128 x 40 Mono OLED Column Row Driver with Controller

  LD7032

128 x 40 Mono OLED Column / Row

Driver with Controller

1. REVISION HISTORY

  

Ver CONTENS DATE

  1.0 Jun. 2008

  • First version an addition : page7. or floating -

  2.0 Dec. 2008

  • deleted "When IXS=H, CSB must be Low" in page7
  • AC Table : VDD = 1.65 ~ 3.5V (page24,26,27)

  PART 1 CONTENTS

  1. REVISON HISTORY ................................................................................................................................................................2

  2. FEATURES ................................................................................................................................................................................4

  3. BLOCK DIAGRAM .................................................................................................................................................................5

  4. PIN DESCRIPTION ................................................................................................................................................................6

  5. FUNCTIONAL DESCRIPTION .........................................................................................................................8 5.1. MPU Interface .....................................................................................................................................................

  5.2. Dot Memory Map .........................................…..........................................................................................

  5.3. Correspondence Memory and Display ......................................................................................................

  5.4. Output Arrange ..........................................................................................................................................

  5.5. Data Write / Read Sequence ....................................................................................................................

  5.6. Dot Matrix Output Wave Form .................................................................................................................

  5.7. Pre-charge ..................................................................................................................................................

  5.8. Power Save... ... ..................................................................................................................................

  5.9. Reset...................................................................................................................................................

  5.10. OSC ....................................................... . .. ..................................................................................................................

  5.11. Frame Sync Signal(F_SYNC) . .. .... ... .. ..... .............. .. ...... ......................................................................................

  5.12. Interface Mode

  6. Referential Set-up Flow ....................................................................................................................................................20 6.1. Power ON-OFF .........................................................................................................................................

  7. ELECTRICAL CHARACTERISTICS ..........................................................................................................................20 7.1. MAXIMUM RATINGS ............................................................................................................................

  7.2. DC CHARCTERISTICS ..........................................................................................................................

  7.3. AC Characteristics .................................................................................................................................... 7.3.1.1(2) Parallel Interface ............................................................................................................................................. 7.3.2.1(2) Serial Interface .............................................................................................................................................

  7.3.3. I2C Interface ......... .. ....................................................................................................................................

  7.3.4. Driver OUTPUT .... ..... ............................................................................................................................................ ...

  7.3.5. Reset .... .......................................................................................................................................................... ...

2. FEATURES Power Supply

  VDD : 1.65 ~ 3.5V

  VCC_C : 8.0 ~ 16.0V for Column

  VCC_R : 8.0 ~ 16.0V for Row

  Display Area

  Max 128 x 40 Line

  Graphics RAM

  Dot matrix : 128 x 1 Bit x 40 = 5,120 Bit

  Column Driver

  Max 128 Outputs Mono Maximum Output Current = 255 uA (1 uA Step) Next Pin to Pin Current Deviation ± 2.0 (Iout = 50uA) Current Deviation at 1Chip Max-Min ± 4.0 (Iout = 50uA)

  %

  Average Current Deviation against absolute level ± 6.0 (Iout = 50uA)

  %

  5 Times Peak boot Current Driving

  Row Driver

  Max 40 Outputs Variable duty ratio (1 to 40) ON resistance typical 25ohm

  CPU Interface

  8080 or 6800 series parallel interface

  

  Serial Peripheral Interface

  

  I2C Serial Interface

   Screen Saver Screen Saver Function. Oscillator

  On-chip RC oscillator

  Frame Rate

  Variable Frame Rate (60,75,90,105,120,135)Hz

  Crosstalk

  Crosstalk enhancement function

  Internal regulator for row driver

  Selectable Voltage Function. ( 0.8*VCC_C or 0.7*VCC_C )

3. BLOCK DIAGRAM

  PRE

  Co D lu riv m

  C0 ~ C127

  er n

  RSTB A0

  G R

  RDB/E

  A M

  WRB/RW PS CSB C80

  D

  F_SYNC

  o D Co t M Ro

  D7 R0-R39

  riv In w n at M

  D6

  er st tr P o rix ru

  Re U In

  D5

  T lle ct st r

  I g im io

  D4 n

  ru n is in te D te ct g

  D3

  rf r io n ec ac

  D2

  o d e /

  D1(SDIN,SDA)

  er

  D0(SCLK,SCL)

  VCC_R

  ID2

  ID1

  ID0

  IXS EXT_CLK

  O S CA

4. PIN DESCRIPTION

  I PS H : I2C is selected, L : I2C is not selected

  OELD Dot Matrix Power Supply for Column Driver

  VCC_C Power Ground pin.

  VSS (AVSS/AVSS) Analog and digital voltage supply.

  VDD OELD Dot Matrix Power Supply for Row Driver If Internal Regulator for Row Scan is active, this pin is the power output pin of internal row power regulator. A 4.7uF capacitor is recommended to connect between VCC_R and

  VSS. If internal row power regulator is disabled, it must be connected to the external high voltage source or VCC_C.

  VCC_R Function TYPE Signal

4.2. System Interface Control Pins

  H: Parallel L: Serial

  4. 1. Power Supply Pins

  I IXS

  H: 68CPU L: 80CPU

  I C80 Function TYPE Signal

  • . Interface Mode Table

  IXS PS Interface Mode

1 Parallel

  X

  1 Serial I2C Serial SPI

  4.3. MPU Interface Pins Signal TYPE Function

  CSB

  I Chip Select ( Active Low)

RDB/E

  I Read ( Active Low, 80 Interface) Enable (68 Interface)

WRB/RW

  I Write ( Active Low, 80 Interface) H:Read L:Write (68 Interface)

  RSTB

  I Reset (Active Low) A0

  I Address ( L: command, H: Parameter) D7~D0 I/O These are 8-bit bi-directional data bus to be connected to t he microprocessor’s data bus.

  When I2C interface mode is selected, D1 will be the I2C d ata input (SDA) and D0 will be the I2C bus clock input (S CL), and D2 ~ D7 should be tied VDD or VSS. When serial interface mode is selected, D1 will be the seria l data input (SDIN), D0 will be the serial clock input (SCL K), and D2 ~ D7 should be tied VDD or VSS or floating .

  2 ID2~ID0

  I These pins configure I C interface address. Using these

  

2

pins, I C Address can be selected.

  This pin is the dot output current reference pin. I is O

  DOT

  derived from Iref. A resister should be connected between

  IREF this pin and VSS .

  ( Current Setting. Typ Resistance = 39 k Ω )

  ( Current adjustable range ±30%)

  PRE O Pre-Charge Voltage F_SYNC O Frame Sync Signal EXT_CLK I Test Pin.

  This pin should be tied VDD or VSS in normal operation.

  4.4. OLED Driver Pins Signal TYPE Function

  R0 to R39 O OELD Dot Matrix Row Output C0 to C127 O OELD Dot Matrix Column Output

5. FUNCTIONAL DESCRIPTION

  5.1 MPU Interface 5.1.1. 80 Series Interface

  Parameter or Data H H L Read Parameter or Data Parameter or Data H H L Write Parameter or Data Command L H L Write Command

  D[7:0] A0 RDB WRB CSB Function Command

  1’st Parameter/Data 2’nd Parameter/Data CSB A0 WRB/RDB D[7:0]

  ※

  NOTE :

  ↑ stands for rising edge of signal.

  L stands for low in signal. H stands for high in signal.

  5.1.2. 68Series Interface Function CSB RW E A0 D[7:0]

  Write Command L L L Command

  ↓

  Write Parameter/Data L L H Parameter or Data

  ↓

  Read Parameter/Data L H H Parameter or Data

  ↓

  1’st Parameter/Data Command

  2’nd Parameter/Data A0 CSB RW E

  D[7:0]

  5.1.3. Serial Interface Function CSB CLOCK A0 DATA

  Write Command L D[0] L D[1] Write Parameter/Data L D[0] H D[1]

  CSB Command Parameter/Data

  A0 SID(D1)

  D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 SCLK(D0)

  Data Latch Data Latch

  5.1.4. I2C Interface The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be connected to a positive supply through a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.

  I2C communication with this device is initiated by a master sending a Start condition, a high-to-low transition on the SDA input/output while the SCL input is high (see Figure 1 ). After the Start condition, the device address byte is sent, most significant bit (MSB) first, including the data direction bit (R/W).

  After receiving the valid address byte, this device responds with an acknowledge (ACK), a low on the SDA input/output during the high of the ACK-related clock pulse. On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control commands (Start or Stop) (see Figure 2 ). A Stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the master (see Figure 1 ). Any number of data bytes can be transferred from the transmitter to receiver between the Start and the Stop conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK clock pulse so that the SDA line is stable low during the high pulse of the ACK-related clock period (see Figure 3 ). When a slave receiver is addressed, it must generate an ACK after each byte is received. Similarly, the master must generate an ACK after each byte that it receives from the slave transmitter. Setup and hold times must be met to ensure proper operation. A master receiver will signal an end of data to the slave transmitter by not generating an acknowledge (NACK) after the last byte has been clocked out of the slave. This is done by the master receiver by holding the SDA line high. In this event, the transmitter must release the data line to enable the master to generate a Stop condition. SDA SCL S P

  Start Condition Stop Condition

  Figure 1. Definition of Start and Stop Conditions SDA SCL

  Data Line Change Stable; of Data

  Data Valid Allowed Figure 2. Bit Transfer

  Data output by Transmitter NACK

  Data output by Receiver ACK

  SCL From S

  1

  2

  8

  9 Master Figure 3. Acknowledgement on I2C Bus

  • I2C Device ID Address Following a START condition, the bus master must output the address of the slave it is accessing. The address is shown in Figure 4 . To conserve power, no internal pull-up resistors are incorporated on the hardware selectable address pins and they must be pulled HIGH or LOW.

  slave address

  1

  1 ID2

  ID1

  ID0 R/W Fixed programmable

  Figure 4. Device ID Address The last bit of the address byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation.

  MSB bit is first transfered.

  • I2C Bus Transactions SCL write acknowledge acknowledge form slave form slave

  S

  1 2 3 4

  5

  6

  7 A

  1

  2

  3

  4

  5

  6

  7

  8 A

  1

  2

  3

  4

  5

  6

  7

  8 A P SDA Slave Address Command byte Data to

  Parameter register Stop or Repeat Start

  Figure 5. Write Single Parameter Command SCL acknowledge acknowledge write form slave form slave

  S

  1 2 3 4

  5

  6

  7 A

  1

  2

  3

  4

  5

  6

  7

  8 A

  1

  2

  3

  4

  5

  6

  7

  8 A

  1

  2

  3

  4

  5

  6

  7

  8 A P SDA Figure 7. Read From SRAM

  

A

  2

  A

  8

  7

  6

  5

  4

  3

  1 A

  P

  1

  7

  6 5 3 4

  2

  1 S Slave Address Data from SRAM

  (first byte) acknowledge form slave read

  (cont.) (repeated)

  Start acknowledge form master

  SDA (cont.)

  1 not acknowledge form master

  8

  6 5 3 4

  7

  6

  5

  4

  3

  2

  1 A

  7

  2

  3

  1 S Slave Address Command byte acknowledge form slave write

  8

  6

  4

  2 N

  A

  7

  5

  Data from SRAM (last byte)

  5.2 Dot Memory Map Column

  Memory X Address

  00h 01h 02h

  0Eh

  0Fh 00h (00,00) (01,00) (02,00) (0E,00) (0F,00) ss

  01h (00,01) (01,01) (02,01) (0E,01) (0F,01) re d d A w Y o ry R o

  26h (00,26) (01,26) (02,26) (0E,26) (0F,26) m e

  27h (00,27) (01,27) (02,27) (0E,27) (0F,27) M

  Memory Size = 16 x 8Bit 40 = 5,120 Bit

  x

  • “Data Writing Box” command indicate memory writing area.
  • “Writing direction” command indicate writing direction (auto address increment or decrement)

  C D A B Momory Display

  S ca n D ir ec tio n

  Left Scroll

  Ac ti ve R ow

  CDEFGAB

  Active Column Ac ti ve R ow

  ABCDEFG

  A ct iv e R o w

  Display Size Active Column

  Memory Display

  (XS,YS) (XE,YE )

  Memory Data Write

  Rmax Display Direction

  ⇔

  • The column outputs out of active area always pre- charge level.
  • The row outputs out of active area always VCC_R excluding display off.
  • Scan is repeated within active area.
  • Rows out of active row are VCC_R.
  • “DispSize” command don’t use during panel display. Display Size - “DispDirection” command indicate Row scan direction.
  • Row R0
  • “DispStart” command fix the relation of memory and display coordinates.

  Scroll Area - “DispSize” command indicate active outputs.

  Memory Reading Start Address

  5.3. Correspondence Memory and Display

  • In scroll mode, display all memory area regardless display size.

  5.4. Output Arrange

  R0 R1 R2 R3

  20 Display Face

20 R38

  R39 128

  C0•••••••••••••••••••••••••••••••••••••••••••••••C127 R39•••R1 R0•••R38

  Bumps Face Up

  INTERFACE

  5.5. Data Write / Read Sequence

  Dot Data Write Dot Data Read

  DataWrite DataRead WRITE Parameter Dummy Read

  END READ Parameter END

  Serial Interface is impossible to Data Read

  5.6. Dot Matrix Output Wave Form Related Command

  Pre-Charge Level Column Port Voltage Level

  1 Row Period Pre-Charge Period Peak Boot

  Period

Data Display

Period Peak Delay

  Period Pre-Charge Period Peak Delay

  Period Peak Boot Period Data Display

  Period

  1 Row Period Row(N) Column Port

  

Output Waveform

Row(N+1)

  1 CLK

  1 CLK (0,0) (0,1) (1,0) (1,1) Row Overlap

  5.7. Pre-charge When Pre-Charge, each column output is connected the pre-charge pin in the IC. Therefore all dot matrix

  5. 8. Power Save

  Function Display ON/OFF Stand-by Soft Reset

  Command DISPON/OFF STBON/OFF SOFTRES Display-OFF Register Clear

  ・ ・ Dot Matrix

  Function Display ON/Off OSCA Start/Stop Display-OFF

  ・ ・ ・

  Stand-by-ON

  ・

  5. 9. Reset When RSTB Input becomes ‘L’, All Register is set Default. When SOFTRES command is inputted, All Register is set Default 5. 10. OSC

  Dot Dot Matrix Driver

  Memory Dot Matrix OSCA

  Controller Clock System

  !" # $ % Frame frequency is adjusted by DFRAME command

  “ ”

  5. 11. Frame Sync Signal ( F_SYNC ) Row(last) Row(first)

  5. 12. Interface Mode (Data Write Only)

  Dot matrix display data write mode

  Display Memory

COUT0 COUT7

  MSB LSB

  7

  6

  5

  4

  3

  2

  1

  1

  1

  1

  1

  1

  1

  1

  1 (Default)

  WriteDirection = 00h,

1 Address = 8 Pixels

  XDispStart = 00h, YDispStart = 00h

  Display Memory

COUT0 COUT7

  MSB LSB

  7

  6

  5

  4

  3

  2

  1

  1

  1

  1

  1

  1

  1

  1

  1 WriteDirection = 08h ,

  1 Address = 8 Pixels

  XDispStart = 00h, YDispStart = 00h

  Column Memory X Address

  00h 01h 02h

  0Eh

  0Fh 00h (00,00) (01,00) (02,00) (0E,00) (0F,00) ss

  01h (00,01) (01,01) (02,01) (0E,01) (0F,01) re d d A w Y o ry R o

  26h (00,26) (01,26) (02,26) (0E,26) (0F,26) m e

  27h (00,27) (01,27) (02,27) (0E,27) (0F,27) M

VCC_C

  VCC_C

  VCC_R

  V

  −−−−

  0.3 ~ ~ ~ ~

  Supply Voltage

  VDD Unit Value Parameter content

  VDD

  VCC_R OFF OFF ON ON

  V IN

  Min 0.1ms Min 0.1ms

  0V

  0V VDD

  RSTB ON Min 0.1ms

  0V VDD

  !

  • +3.63
    • -0.3

  • +18.0
    • -0.3

  • +18.0

  ∼ ∼ ∼ ∼

  0.3 ~ ~ ~ ~

  VDD+0.3 Input Voltage Range

  6. Referential Set-up Flow

  6.1 Power ON-OFF

  7. ELECTRICAL CHARACTERISTICS

  7.1 MAXIMUM RATINGS

  (Ta = -40 ~85℃)

  ∼ ∼ ∼ ∼

  VCC_C

  • +85 Operating Temperature Range T

  50 ~ ~ ~ ~

  ℃ - - - -

  STG ℃ - - - -

  40 ~ ~ ~ ~

  OPR - - - -

  0.3 ~ ~ ~ ~

  VDD+0.3 Output Voltage Range

  V OUT

  - - - -

  • +125 Storage temperature Range T

  7.2. DC CHARACTERISTICS

  (VDD= 2.8V, VCC_C=VCC_R=15V, Ta = 25 ℃ ) Related

Symbol Parameter Conditions MIN TYP MAX UNIT

  Pins

  VCC_C Operating Voltage for Column

  VCC_C

  8

  16 ‐ ‐

  VCC_R Operating Voltage for Row

  VCC_R

  8

  16 ‐ ‐

  1.8 VDD Logic Power 1

  VDD

  1.65

  3.5 ‐

  2.8 Logical V - High Logic Input Level 0.8*VDD

  IH Input

  VDD -

  V Logical

  V Low Logic Input Level 0.2*VDD -

  IL - Input

  Logical

  V High Logic Output Level Iout 0.9*VDD

  - Output Logical

  VDD =-100uA OH

  V Low Logic Output Level Iout =100uA 0.1*VDD - OL

  Output

  IIL

  • 1.0 Input Leakage Current -1.0 uA

  VDD = 2.8V Oscillator Frequency

  0.9

  1.0

  1.1 FOSC1

  ㎒

  For Dot Matrix

  0.82

  0.91

  1 VDD = 1.8V 0.8*

  VCC_R = 0.8*VCC_C

  

VCC_R Power Regulator 0.75* 0.85*

  IRVCC

  VCC_R

  VCC

  V I =5mA Output Voltage

  VCC_C

  VCC_C

  VCC_R _C Output Current Pin to Pin Even

  Cptp1 Iout = 50uA C0-127 + 2.0 -2.0 - % ness *1)

  Output Current Iout = 50uA C0-127 + 4.0 -4.0 - %

  Calp1 Evenness *2) Cchip1 Output Current C0-127

  Iout = 50uA + 6.0 -6.0 - % Absolute Correctness *3) Cptp3 Peak boot Ioutpeak = 250uA C0-127 + 2.0

  -2.0 - % Pin to Pin Evenness *1) Calp3

Peak boot Evenness *2) Ioutpeak = 250uA C0-127 + 4.0

-4.0 - %

  Cchip3 Peak boot Absolute Correctness Ioutpeak = 250uA C0-127 + 6.0 -6.0 - %

  • 3) ROW ‐Vss

  IOL=35 R0-R39

  25

  • Rrg ON Resistance ROW ‐VCC_R

  40 mA Ω

  IOL=1 mA R0-R39 -

  1 3 k Ω Rr ON Resistance

  6 -

  0.4 V

  ILOAD=3mA Pre-Charge SW ON Resistance Rp

  UNIT MAX TYP MIN Conditions Parameter Symbol

  "

  Low Logic Output Level (open-drain) at 3mA sink current at SDA, SCL ( I

  2 C)

  V DD > 2V

  0.0 -

  V DD < 2V

  All Pin Short Ω 900 600

  0.0 -

  0.2*V

  DD

  I OL Low-Level output

  Current ( I

  2 C)

  VOL = 0.4V 3 - - mA

  VOL = 0.6V

  - C0-127 Each Pin

  7 - - C0-127 Column

  IVCC_C2 mA 1 -

  NOTICE:

  VDD Stand-by Current

  -

  IVCC_R1 uA 5 -

  VCC_R

  IVCC_R2 uA 5 -

  VCC_R *4)

  IVDD2 mA 1 -

  VDD *4)

  IVDD1 Ω

  VCC_C *4) Normal Operation

  IVCC_C1 mA 2 -

  VCC_C

  UNIT MAX TYP MIN Related Pins Conditions Parameter Symbol uA 5 -

  • 4) Iout =10

  A, All Data on, Frame Frequency 120Hz, VCC_C=VCC_R=15V,

  μ

  VDD=2.8V, Output( DOT ) all Open, Display Size full, Others Default

  • (VDD= 2.8V, VCC_C=VCC_R=15V, Ta = 25 ℃ ) (VDD= 2.8V, VCC_C=VCC_R=15V, Ta = 25 ℃ )

  7. 3. AC Characteristics 7. 3. 1.1 Parallel Interface1 (Write/Read Timing)

  Tcsh Tcsh Tcsh Tclw

  VIH

  VIL

  VIH

  VIL

  VIH

  VIL Tcsh Tas Tah

  Tcycw

Tcsh

Tchw

  VIH

  Tdsw Tdhw Tcsh Tcsh

  RDB (E) Tcsh Tas

  VALID Tclr Tcycr

  Tchr Tcsh Tcsh Tcsh

  D0 to D7 (Write) D0 to D7 (Read)

  Tdsr Tdhr Tah

  VIL

  VIL CSB WRB (RW)

  Read Write

  Read control high pulse time 80 Tchr

  10 CSB Tcsh ns Tcycw 100 WRB

  CSB – WRB , RDB time

  10 Tdhr Read data hold time ( Data output disable time )

  200 Tdsr Read data setup time ( Data Output Access Time )

  10 Tdhw Write data hold time

  Tdsw 20 D0 – D7 Write data setup time

  Tclr 60 RDB Read control low pulse time

  VIH

  Write control high pulse width 40 Tchw

  Tclw 40 WRB Write control low pulse width

  Tcycr 500 RDB System cycle time Tah 10 A0 Address hold time Tas 20 A0 Address setup time

  MAX MIN Units Specification Condition Symbol Parameter

  VALID

  VALID

  VALID A0

  (VSS = 0V, VDD= 2.6V~3.5V, Ta = 25 ℃)

  7. 3. 1.2 Parallel Interface2 (Write/Read Timing)

  Read Write

  30 CSB Tcsh ns Tcycw 300 WRB

  CSB – WRB , RDB time

  10 Tdhr Read data hold time ( Data output disable time )

  200 Tdsr Read data setup time ( Data Output Access Time )

  30 Tdhw Write data hold time

  Tdsw 60 D0 – D7 Write data setup time

  Read control high pulse time 80 Tchr

  Tclr 60 RDB Read control low pulse time

  Write control high pulse width 120 Tchw 120 WRB

  Tclw Write control low pulse width Tcycr 500 RDB System cycle time

  Tah 30 A0 Address hold time Tas 60 A0 Address setup time

  MAX MIN Units Specification Condition Symbol Parameter

  (VSS = 0V,

  VDD= 1.65V~3.5V , Ta = 25 ℃)

CSB SCL

  20

  (VSS = 0V, VDD= 2.6V~3.5V, Ta = 25 ℃)

  8 th SCL

  A0 NOTE : The input signal rise time and fall time (tr, tf) is specified at 15 ns or less.

  t ASS t AHS

  SDI

  t CYS t PWL t PWH t CSH t SCC t CHW t DSS t DHS

  V IL

  V IH t CSS

  • Conditions SCC 15 SCL to Chip select t

  Input Signal Slope Output Signal Slope

  MIN Parameter Symbol tr tf

  20 Serial clock cycle High pulse Width Low pulse width t CYS t PWH t PWL

  66

  20 Data setup time Data hold time t DSS t DHS

  20

  50 Chip select setup time Chip select hold time Chip select high pulse width t CSS t CSH t CSW

  50

  20

  CSB SDI SCL Related Pins

  TYP

  Unit

  MAX ns ns ns ns

  • ns
  • 15

  25 A0 A0 setup time A0 hold time t ASS t AHS

  7. 3. 2.1 Serial Interface1

SCL, CSB

    • tr tf

  • 50

  60

  VDD= 1.65V~3.5V , Ta = 25 ℃)

  (VSS = 0V,

  MIN Parameter Symbol

  • Conditions SCC 40 SCL to Chip select t
  • ns

  60 Serial clock cycle High pulse Width Low pulse width t CYS t PWH t PWL

  60

  150

  60 Data setup time Data hold time t DSS t DHS

  CSB SDI SCL Related Pins

  Chip select setup time Chip select hold time Chip select high pulse width t CSS t CSH t CSW

  60 100 100

  TYP

  Unit

  MAX ns ns ns ns

  60 A0 A0 setup time A0 hold time t ASS t AHS

  7. 3. 2.2 Serial Interface2

SCL, CSB

  7. 3. 3 I2C Interface

  (VSS = 0V,

  VDD= 1.65V~3.5V , Ta = 25 ℃)

  Standard mode Fast mode Symbol Parameter

  Unit MIN MAX MIN MAX f SCL clock frequency 100 400 kHz

  scl

  bus free time between a STOP and

  4.7 - - t BUF 1.3 us

  START condition

  4.0 0.6 us - - t hold time (repeated) START condition

  HD;STA

  set-up time form a repeated START t 4.7 0.6 us - -

  SU;STA

  condition

  4.0 0.6 us - - t set-up time for STOP condition

  SU;STO

  t data set-up time 250 - 100 ns -

  SU;DAT

  t data hold time - ns -

  HD;DTA

  t data valid acknowledge time

  0.3

  3.45

  0.1 0.9 us

  VD;ACK

  t 50 ns - - data valid time 300

  VD;DAT

  t LOW period of the SCL clock 4.7 - 1.3 us -

  LOW

  4.0 0.6 us - - t HIGH period of the SCL clock

  HIGH

  • t fall time of both SDA and SCL signals 300 300 ns

  f

  • t rise time of both SDA and SCL signals 1000 - 300 ns

  r

  pulse width of spikes that must be t 50 50 ns

  SP

  suppressed by the input filter t t t 1/f

  SU;STA LOW HIGH SCL SCL

  t t r

  BUF

  t

  f SDA

  t t t t t t

  A

  0.8

  C =10pF R = 10k

Column

Row

  T CFD

  0.5 T CRD T CRPD T CFPD

  I p

  =500uA

  0.8 I d

  =100uA

  0.2

  C =10pF

  0.2 (VSS = 0V, VDD= 2.6V~3.5V, VCC_C=VCC_R=15V, Ta = 25 ℃)

  IREF 0uA

  Normal Current

  IREF x 5 *1) 0uA

  Peak Boot Current 1h 0h

  Gray Scale

  μ

  Column

  Row

  • 1) 5 Times is guaranteed until 500

  • 10 - T
  • 100 ns - T
  • 1200 ns 800 T
  • 200 ns T

  C0-C127 Column Peak Delay Time

  7.3.4. Driver OUTPUT

  T RF T RR

  0.2

  0.8

  “RowOverlap” command changes Row falling timing`

  CRPD

  CRD

  R0-R39 Row Falling Time Unit Max. Typ. Min. Symbol Signal Item

  C0-C127 (to R)

  Column Drive Start Delay Time

  CFD

  C0-C127 (to R)

  Column Falling Time until Row Falling

  RR

  R0-R39 Row Rising Time ns

  RF

  • 200 ns T

  7.3.5. Reset Reset low pulse width must be long than 1 us.

  Reset complete time is small than 1 us.

  128 x 40 Mono OLED Column / Row Driver with Controller

  PART 2 CONTENTS

  1. Display System Command ...................................................................................................................................................31 1.1. Software Reset ........................................................................................................................................

  1.2. Dot Matrix Display ON/OFF ..................................................................................................................

  1.3. Dot Matrix Display Stand-by ON/OFF ..................................................................................................

  1.4. Dot Matrix Frame Rate ..........................................................................................................................

  1.5. Graphics Memory Writing Direction .....................................................................................................

  1.6. Display Direction ....................................................................................................................................

  1.7. Display Size ...........................................................................................................................................

  1.8. Display Start .................................................................................................................................................

  2. Read/Write command .............................................................................................................................................................37 2.1. Data Reading/Writing Box ......................................................................................................................

  2.2. Dot Matrix Display Data Read/Write .....................................................................................................

  2.3. Register Read ..............................................................................................................................................................

  3. Driver Setting Command .......................................................................................................................................................39 3.1. Peak Pulse Width Set .............................................................................................................................

  3.2. Peak Pulse Delay Set ...............................................................................................................................

  3.3. Dot Matrix Current Level Set .................................................................................................................

  3.4. Pre-Charge Width Set ...........................................................................................................................

  3.5. Pre-Charge Mode Select .......................................................................................................................

  3.6. Row overlap set .....................................................................................................................................

  3.7. Row SCAN ...........................................................................................................................................

  3.8. Row Scan Sequence Setting ..................................................................................................................

  3.9. Data Reverse .........................................................................................................................................

  4. Others ...................................................................................................................................................................................43

  5. Optional Command .............................................................................................................................................................44 5.1. IC Test Co mmand ......................................................................................................................

  5.2. Set Internal Regulator for Row Scan .....................................................................................................

  5.3. Aging Mode Set ..............................................................................................................................................................

  5.4. Set XTALK Enable ....... ...... ... .. ... .. ... ......................................................................................................................

  5.5. Set VDD Selection ........... ..... ......................................................................................................................................

  6. Screen Saver Command .......................................................................................................................................................48 6.1. S_Sleep Timer .............................................................................................................................

  6.2. S_Sleep Start .............................................................................................................................

  6.3. S_Step Ti mer ...... .......................................................................................................................

  6.4. S_Step Unit .............................................................................................................................

  6.5. S_Condition .............................................................................................................................

  6.6. S_Saver Start/Stop .............................................................................................................................

  6.7. Screen Saver Mode............................................................................................................................

  6.8. S_MultiScroll............................................................................................................................

INSTRUCTION DESCRIPTION

  1. Display System Command

  1.1 Software Reset

  Command Parameter

  INSTRUCTION Parameter Definition Default WR A0 D[7:0] WR A0 D7 D6 D5 D4 D3 D2 D1 D0

  • L 01h Software Reset - - - - - - - - W SOF
  • Software reset command
  • All registers are cleared default. *1) - Dot matrix is OFF.
  • OSCA is stopped
    • 1) Don’t clear Graphics memory

  1.2. Dot Matrix Display ON/OFF

  Command Parameter

  INSTRUCTION Parameter Definition Default WR A0 D[7:0] WR A0 D7 D6 D5 D4 D3 D2 D1 D0

  D=0 Dot Matrix Display OFF

  • W L 02h W H D0 00h - - - - DDISPON/OFF

  D=1 Dot Matrix Display ON

  • When D0=”0” : Turns the dot matrix Display OFF (Default).

  Display OFF means All Column Output become Pre-charge level.

  All Row Output become VSS. Stop Data transfer from memory to Dot Matrix Driver.

  • When D0=”1” : Turns the dot matrix Display ON.

  1.3. Dot Matrix Display Stand-by ON/OFF

  Command Parameter

  INSTRUCTION Parameter Definition Default WR A0 D[7:0] WR A0 D7 D6 D5 D4 D3 D2 D1 D0

  D=0 : Stand-by OFF DSTBYON/OFF W L 14h W H D0 01h - - - - - - - D=1 : Stand-by ON

  • When D0=“0”

  OSCA Start. (Don’t turn the dot matrix display on)

  • When D0=”1”

  Execute DDISPOFF command OSCA Stop. (Default).

  • NOTE 1 : Don’t clear Graphics memory and Register.
  • NOTE 2 : After software and hardware Reset, stay “DSTBYON” Mode.
  • NOTE 3 : Column Driver latched datas are reset.

  • 1) FO = ‘0’ Frame frequency is difference value by [Display Y Size]. For Example : { F[2:0] = 010b, Display Y Size = 32 } => Frame Frequency is 90Hz. : Freq(SCLK) = 1.0MHz

  1 240 Hz

  84 Hz

  40 108 Hz 120 Hz 135 Hz 270 Hz

  96 Hz

  1

  36

  32 1 107 Hz

  1 120 Hz

  4

  16 120 Hz

  (MHz)

  Frame Frequency

  1 SCLK Freq.

  1

  1

  1

  1

  Frequency (Spec.)

  60 Hz Frame

  90 Hz

  1

  93 Hz 105 Hz 210 Hz

  (Measured)

  1

  (Spec.)

  Example 1) FO = ‘0’

  (MHz)

  1 SCLK Freq.

  1

  1

  1

  3 F[2:0]

  5,6,7

  1

  Frame Frequency

  40

  1 135 Hz 105 Hz

  1

  1

  16 Display Y Size

  32

  36

  40

  16

  32

  36

  1

  16 Display Y Size

  1.4. Dot Matrix Frame Rate Dot Matrix frame rate control command.

  416

  { F[2:0] = 010b, Display Y Size = 16 } => Frame Frequency is 180Hz. : Freq(SCLK) = 1.0MHz { F[2:0] = 010b, Display Y Size = 40 } => Frame Frequency is 72Hz. : Freq(SCLK) = 1.0MHz 1 150 Hz

  = 10 External Clock mode ( Test Mode )

  OSCA mode selection M[1:0] = 00 Internal RC Oscillation mode

  1Ah W H - - FO M1 M0 F2 F1 F0 Frame Frequency 60-120Hz 02h

  WR A0 D7 D6 D5 D4 D3 D2 D1 D0 Parameter Definition Default DFRAME W L

  INSTRUCTION Command WR A0 D[7:0] Parameter

  F[2:0]

  520 The Number of SCLK of one Row ( Display Y Size = 32 )

  1

  2

  75 Hz

  346

  3