COMPARISON OF THE SHEAR BOND STRENGTH OF REBONDED MECHANICALLY RETENTIVE CERAMIC BRACKETS WHICH WERE CLEANED BY TWO DIFFERENT METHODS.

COMPARISON OF THE SHEAR BOND STRENGTH OF REBONDED
MECHANICALLY RETENTIVE CERAMIC BRACKETS WHICH
WERE CLEANED BY TWO DIFFERENT METHODS
drg. L. CINTHIA HUTOMO, Sp Ort

ABSTRACT
The purpose of this study was to measure the shear bond strength of rebounded
mechanically retentive ceramic brackets prior which the base of them were cleaned by two
different methods. The first method was burnt out using spirituous lamp, and the second
method was burnt out using spirituous lamp and sandblasted for 4 second eventually.
Thirty debonded ceramic brackets were prepared as the subject of this study. They were
devided into two groups namely A and B which contains fifteen debonded brackets each. Group
A was used to determine shear bond strength of rebonded ceramic bracket which was cleaned
by first method and group B was used to determine shear bond strength of rebonded ceramic
bracket which was cleaned by second method. The ceramic bracket which have been cleaned
were rebonded on a good extracted permanent human upper first premolar.
The shear bond strength were measured by Panke Pearson Equipment Limited, whereas
the bond failure location of the rebonded brackets were examined using Zoom Stereo
Microscope. T test used to compare of the shear bond strength between two groups, whereas
Chi-Square analysis was used to determine the bond failure location of rebounded ceramic
brackets.

The result of this experiment showed that shear bond strength of rebonded ceramic
brackets which were cleaned by second method was higher than those by first menthod, and
had significant differences ( p0,05 ). The bond failure location of
rebounded mechanically retentive ceramic brackets which cleaned by method I were mostly
happen in the adhesive ( 86,7%), and on the method II all the failure happen in the adhesive (
100% ).
Key word : Shear Bond Strength, Mechanically Retentive Rebonded Ceramic Brackets, Cleaning
Method.