Conclusion 63 Potential of Commercialization 64 Recommendation 64 Regulated Voltage Using Pins VS1 and VS2 Pins Name and Its Function Hot Spot Measurement of High Voltage Transformer ON and OFF State of Basic Boost Converter The Seebeck Effect Due To Temp

4.3.2.1 Pin Name and Function 54

4.4 Final Product 55

4.5 Analysis of TEG and LTC3108 Boost Converter 58

4.5.1 Voltage Output Versus Current TEG 58

4.5.2 Temperature Versus V out TEG 59

4.5.3 Vin Versus Vout LTC3108 Boost Converter 60

4.6 Final Output of LTC3108 Boost Converter 62

4.7 Final Discussion 62

V CONCLUSION AND RECOMMENDATION

5.1 Conclusion 63

5.2 Potential of Commercialization 64

5.3 Recommendation 64

REFERENCES 65 APPENDICES 67 LIST OF TABLES NO. DESCRIPTION PAGES 2.1 Pin Function of LTC3108 23

2.2 Regulated Voltage Using Pins VS1 and VS2

25 2.3 Operation of LTC3108 27

4.1 Pins Name and Its Function

54 LIST OF FIGURES NO. DESCRIPTION PAGES 1.1 Power Transformer in Distribution System 2

1.2 Hot Spot Measurement of High Voltage Transformer

3 2.1 Basic Circuit of Boost Converter 10

2.2 ON and OFF State of Basic Boost Converter

11 2.3 Example of TEG Device 18

2.4 The Seebeck Effect Due To Temperature Gradient

19 2.5 Basic Structure of Thermoelectric Couple 20

2.6 Equivalent Thermoelectric Model

21 2.7 Pin Configuration of LTC3108 23

2.8 Block Diagram of LTC3108

27 2.9 Output Voltage Sequencing with Vout Programmed for 3.3V Time Not to Scale 33

2.10 Comparison between SMT Component left with

Through-hole Component right 34

2.11 Surface-mount Capacitor

34 2.12 Size of SMT Component 38

3.1 Flow of Project

43 3.2 Methodology Flowchart 44

4.1 Structure of the System

52 4.2 Schematic Diagram of the Project 53

4.3 PCB Layout Diagram of the Project

54 4.4 Final Product Using LTC3108 IC And Surface Mount Component 56 4.5 Real Size of the Product Which Is Compact 57

4.6 Final Product Inside the Packaging

57 4.7 Vout, V VS Current,I 59

4.8 Temperature, °C VS Vout, V

60 4.9 Vin, V VS Vout, V 61

4.10 Final Output

62 LIST OF ABBREVIATIONS TNB – Tenaga Nasional Berhad TEG – Thermoelectric Generator V - Voltage PIC – Programmable Integrated Circuit IC – Integrated Circuit DC – Direct Current PWM – Pulse Width Modulator SMD – Surface Mount Device SMT – Surface Mount Technology PMC – Power Management Circuit PCB – Printed Circuit Board I – Current C - Celcius LIST OF APPENDICES noted that the appendix section is start at page 67 NO. DESCRIPTION PAGES A ELECTRICAL AND TYPICAL PERFORMANCE CHARACTERISTIC OF LTC3108 APPENDIX A-1 B TYPE OF SMT PACKAGE APPENDIX B-1 C GAANT CHART APPENDIX C-1 D COMPONENT SELECTION APPENDIX D-1 1 CHAPTER I INTRODUCTION

1.1 Project Introduction