v
TABLE OF CONTENTS
Abstrak i
Abstract ii
Dedication iii
Acknowledgement iv
Table of Content v
List of Tables ix
List of Figures x
List of Abbreviations, Symbols and Nomenclatures xiii
CHAPTER 1: INTRODUCTION 1
1.1 Background of Study
1 1.2
Problem Statement 3
1.3 Objectives
3 1.4
Scope of Study 4
CHAPTER 2: LITERATURE REVIEW 5
2.1 Coating Method
5 2.1.1 Definition of Coating
5 2.1.2 Process of coating
6 2.1.2.1 Dry Process
6 2.1.2.2 Wet Process
7 2.2
Electroless Nickel Alloy Depositions 9
vi 2.2.1 Introduction
9 2.2.2 Electroless Nickel Alloy deposition Plating Bath
9 2.2.2.1 Sources of Nickel
10 2.2.2.1 Reducing Agent
10 2.2.2.2 Complexing Agent
11 2.2.2.3 StabilizerInhibitors
12 2.2.2.4 Buffering Agents
13 2.3
Effective Parameter of Electroless Nickel Alloy Deposition 13
2.3.1 Temperature 13
2.3.2 pH 14
2.3.4 Complexing Agent 15
2.4 Effect of Addition Metallic Ions in Electroless Ni-P
16 2.5
Reaction Mechanism 17
2.5.1 Introduction 17
2.5.2 Basic Reaction Mechanism of Electroless Ni-P Alloy Deposition 18 2.5.3 Reaction Mechanism of Electroless Ternary Nickel
Alloy Deposition 20
2.5.3.1 Reaction Mechanism of Ni-Cu-P 20
2.5.3.2 Reaction Mechanism of Ni-Co-P 21
2.5.4 Reaction Mechanism of Electroless Quaternary Nickel Alloy Deposition
22
vii 2.6
Electrochemical Measurements 23
2.6.1 Introduction 23
2.6.2 Polarization Measurements 24
2.5.3 Cyclic Voltammetry Measurements 26
CHAPTER 3: METHODOLOGY 28
3.1 Introduction 28
3.2 Experimental procedure 30
3.3 Raw material 30
3.4 Electroless Ni-Co-Cu-P plating bath 31
3.5 Preparation of Working Electrode
31 3.6 Analysis of Ni-Co-Cu-P Plating Bath
32 3.6.1 Cyclic Voltammetry Measurements
33 3.7
Comparison with Actual Plating of Electroless Ni-Co-Cu-P Alloy Deposition
34
CHAPTER 4: RESULT AND DISCUSSION 35
4.1 Introduction
35 4.2
Cyclic Voltammetry Measurement 35
4.2.1 Acidic Bath 36
4.2.1.1 Ni-P Plating Bath 36
4.2.1.2 Co-P Plating Bath 37
4.2.1.3 Cu-P Plating Bath 38
viii 4.2.1.4 Ni-Co-P Plating Bath
40 4.2.1.5 Ni-Cu-P Plating Bath
41 4.2.1.6 Ni-Co-Cu-P Plating Bath
42 4.2.1.7 Deposition Rate of Ni-Co-Cu-P in Acidic Bath
43 4.2.2 Alkaline Bath
45 4.2.2.1 Ni-P Plating Bath
45 4.2.1.2 Co-P Plating Bath
46 4.2.1.3 Cu-P Plating Bath
47 4.2.1.4 Ni-Co-P Plating Bath
48 4.2.1.5 Ni-Cu-P Plating Bath
49 4.2.1.6 Ni-Co-Cu-P Plating Bath
50 4.2.1.7 Deposition Rate of Ni-Co-Cu-P in Alkaline Bath
52 4.3 Reaction Mechanism of Electroless Quaternary Ni-Co-Cu-P Alloy Deposition 53
CHAPTER 5: CONCLUSION AND RECOMMENDATION
