Manufacturing And Engineering Technology

1. INTRODUCTION

1.1. Name and Description of Skill

1.1.1. The name of the skill competition is Electronics.

1.1.2. Description of Skill The electronics industry is very diverse and has evolved into several

specialisms. Some technicians/engineers will work across many aspects of electronics, but increasing specialization and technical developments means that specialist technician/engineers are widely employed.

The key areas of specialism which can be seen as careers in their own right include the assembly and wiring of electronic products, the designing of prototype circuits to specifications, the installation and commissioning of equipment including the provision of customer support, service and maintenance which include a service both in site remotely, monitoring and testing to specifications subassemblies or systems and approving fit –for- purpose and simulating outcomes on computers.

Electronics specialists need to work in a wide range of industries by supporting highly technical specialist equipment. These industries include: ➢ Aerospace/aeronautics, ➢ The military, ➢ Robotics, ➢ Audio/TV/entertainment, ➢ Laboratories and hospitals, ➢ Higher education research laboratories, ➢ Communications and telecommunications, ➢ Power, ➢ Transport, ➢ Security, ➢ Manufacturing including instrumentation.

Electronics technicians/engineers must work with a high degree of accuracy and precision, conforming to detailed specifications and international quality standards and demonstrating extensive technical ability.

Due to the constant developments in technology, the electronics technician/engineer needs to be proactive in ensuring that his/her skills and knowledge are up-to-date and meet industry standards and expectations.

The technician/engineer may work directly with clients and will therefore need to demonstrate excellent customer service and communication skills and work effectively to time schedules. When working with clients, the technician/engineer may have to explain elements of complex electronics principles to assist the client to use equipment correctly. Often the nature of the establishment in which the electronics expert works will require him/her to respect confidentiality with respect to highly commercially sensitive information and to demonstrate integrity, honesty and a strong ethical sense.

The electronics specialist will work with a wide range of tools, Specialist hi-tech equipment and materials. Increasingly, computers and specialist software for communications technology is embedded into the work. In addition, tasks will also require the use of specialist hand tools for the assembly and maintenance of circuits and surface mounted technology.

1.2. The Relevance and significance of this Document

This document contains information about the standards required to compete in this skill competition, and the assessment principles, methods and procedures that govern the competition.

Every Competitor must know and understand this Technical Description. In the event, English or Indonesia is official languange.

1.3. Associated Documents

As this Technical Description contains only skill-specific information it must

be used in association with the following: ➢ LKS- Competition Rules

2. THE COMPETENCY SPECIFICATION

2.1. General Competency

➢ Creativity. ➢ Critical thinking. ➢ Honesty and integrity. ➢ Self-motivation. ➢ Problem-solving skills. ➢ Work under pressure. ➢ Able to do environmentally friendly operation.

2.2. Competency for all modules

Skills to do measurements in electronic circuits (with DVM, scope, etc). Skills to use materials and tools of electronics industry in ordinary servicing, installation and repair tasks (hand tools, different soldering and de-soldering technique). Knowledge in analysis and design of electric circuit, electronic circuit and digital logic circuit and sensor circuit.

Module 1 - Hardware Design ➢ Skills to design small modification to basic electronics blocks, ➢ Skills to draw developed circuit by hand, ➢ Skills to design of library component using Altium design PCB software. ➢ Skill to design of Printed Circuit Board using Altium design PCB Software, ➢ Skill to assembling circuits and Printed Circuit Board into prototype.

Module 2 - Embedded Systems Programming ➢ Knowledge of circuit boards, processors, chips, electronic equipment, and computer hardware and software. ➢ Skills and knowledge in programming of embedded systems by using C-

language and Integrated Development Environments (Atmel Studio 7 Compiler and AVR Dude Downloader).

Module 3 - Fault finding, Repair, and Measurement ➢ Troubleshooting, determining causes of operating errors and deciding what to do about it. ➢ Adjust and replace defective or improperly functioning circuitry and Module 3 - Fault finding, Repair, and Measurement ➢ Troubleshooting, determining causes of operating errors and deciding what to do about it. ➢ Adjust and replace defective or improperly functioning circuitry and

results to evaluate performance and determine need for adjustment.

Module 4 – Assembly Project ➢ Skill in assembling and utilizing mechanical parts such as DC Motor, Fan Motor, Solenoids, bolt, nut, washer and etc. ➢ Skill in wiring and forming cables. ➢ Skill in assembling and using various types of parts and SMD part.

2.3. Theoretical Knowledge

Theoretical knowledge is required but not tested explicitly. The Competitors ’ Theoretical knowledge should cover :

Fundamental Electronics Principles ➢ Basics of AC and DC technology. ➢ Two ports LRC network, resistive networks with up to three meshes. ➢ RC oscillators.

Components in Electronics ➢ Properties, behavior, characteristics and application (elementary circuits)

of mechanically, ➢ Electrically and physically adjustable components i.e. Capacitors,

Resistors, Variable Resistors, Coils, Transformers and Diodes.

Multistage and Special Amplifier Circuits ➢ Basic amplifier circuits (AC, DC and power amplifiers) ➢ Differential amplifiers/operational amplifiers ➢ Ideal operational amplifier: (infinite input resistance, zero output resistance

and infinite open loop gain) Basic circuits with operational amplifier, analogue adder and sub-tractor, differentiator, comparator, impedance transducer.

➢ Real operational amplifier: Offset voltage and offset current, compensation, common mode gain and rejection, temperature drift and frequency response.

Generators and Pulse Shaper ➢ Generators for sine wave voltage: RC, quartz, LC oscillators; Wien bridge

generator, phase generator. ➢ Pulse shaper: Schmitt trigger, differentiator, and integrator.

Digital Electronics ➢ Basic logic gates: ➢ Level switching function, function table, pulse, diagram, circuit symbols

(table in appendix) ➢ Properties of basic gates AND, OR, NOT, NAND, NOR, EXCLUSIVE OR

and EXCLUSIVE NOR ➢ Substituting basic NAND or NOR gates for basic gates.

➢ Creating switching functions from given circuits and vice versa. ➢ Making function table from circuit diagrams and switching functions ➢ Simplifying switching networks using Karnaugh diagram or mathematical

techniques. ➢ Flip-flops, RS Flip-flop, D Flip-flop and JK Master slave Flip-flop

(especially counter circuits, shift register and frequency divider).

3. THE ASSESSMENT STRATEGY AND SPECIFICATION

3.1. GENERAL GUIDANCE

Assessment is governed by the LKS Assessment Strategy. The Strategy establishes the principles and techniques to which LKS assessment and marking must conform.

Jury assessment practice lies at the heart of the LKS Competition. For this reason, it is the subject of continuing professional development and scrutiny. The growth of expertise in assessment will inform the future use and direction of the main assessment instruments used by the LKS Competition: the Marking Scheme and Test Project.

Assessment at the LKS Competition falls into two broad types: measurement and judgement. For both types of assessment, the use of explicit benchmarks against which to assess each Aspect isessential to guarantee quality.

The Marking Scheme must follow the weightings within the Standards Specification. The Test Project is the assessment vehicle for the skill competition, and also follows the Standards Specification.

The Marking Scheme, in outline, will lead the process of Test Project design. After this, the Marking Scheme and Test Project will be designed and developed through an iterative process, to ensure that both together optimize their relationship with the Standards Specification and the Assessment Strategy. They will be submitted to Jury for approval together, in order to demonstrate their quality and conformity with the Standards Specification.

4. THE MARKING SCHEME

This section describes how the Jury will assess the Test Project / modules. It also specifies the assessment specifications and procedures and requirements for marking.

4.1. Assessment Criteria

This section defines the assessment criteria and the number of objective marks awarded. The total number of marks for all assessment criteria must be 100.

Marks Module

Criterion

Subjective Objective Total

30 30 Embedded systems

A Hardware design

Programming Fault finding, repair and

measurement

D Assembly Project

4.2. Skill Assessment Specification

Specific marking criteria for each project differ. However, major marking features for each project are as follows.

A. Hardware design - 30 marks Development of given basic circuit - 5 marks Design of PCB-board layout – 15 marks Assembly of PCB (IPC-A-610-F) – 5 marks Functionality of Designed PCB – 5 marks

B. Embedded Systems Programming - 25 marks Software functionality - 25 marks

C. Fault finding, repair and measurement - 25 marks Finding faulty spots and evidence – 15 marks; Standard repairing (IPC-A-610-F) – 5 marks; Validity of measuring results – 5 marks;

D. Assembly Project - 20 marks Functionality – 5 marks Assembly quality according IPC-A-610-F – 12 mark Mechanical Assembly – 3 marks

5. THE TEST PROJECT

5.1. Test Project Design

5.1.1. Hardware Design Each Competitor will have to design a PCB. The Altium designer PCB 17

or 18 will be used in competition. Competitor have to make one library component using Altium designer. The task board must be 100mm x 160mm. Single layer board to be used. Soldering and fuction design PCB.

5.1.2. Embedded Systems Programming Programming module using ATmega 16 (Atmel Studio 7) and AVR Dude

downloader.

5.1.3. Fault Finding, Repair and Measurement The Competitors are expected to work with conventional measuring and

testing equipment to locate, test and replace faulty electronic components on a printed circuit board, surface mount board or mixed technology board. All surface mount components to have no more than 20 pins. The Competitors should be able to document fault finding method/procedure with results. 3 faults on a single board. All test boards must have similar faults. They are further expected to record and analyze measured results. Boards must be pre-built before the Competition. The task board must be 100 mm x 160mm double layer PCB.

5.1.4. Assembly Project The Competitors will be asked to assemble a project from a kit of parts.

The standard to be reached is determined by IPC-A-610 issue F (International acceptability of electronic assemblies) using lead free.

5.2. Time allowed for each module

Time allowed

Module Suggested

(Hours)

Hardware Design

D1, D3 Embedded Systems Programming

4 D2 Fault Finding, Repair, and Measurement

4 D2 Assembly Project

4 D3

6. SKILL MANAGEMENT AND COMMUNICATION

6.1. Discussion Forum

For more information and question send, all mentor each province send number of Whatsapp (WA) to inaskills.electronics@gmail.com . Jury will make WA group for discussion forum.

6.2. Competitor Information

Competitor can get update of test project or other information at www.inaskills-electronics.com/lks2018 .

7. SKILL-SPECIFIC SAFETY REQUIREMENTS

Skill-specific safety requirements: ➢ All Competitors must have safety glasses and Cotton Glove

8. TOOLS BROUGHT BY COMPETITOR

No Tools

Specification

Qty Unit

Discription

Minimal frequency 20

1 Osciloscope dual Channel 1 Set Recomended Digital Osciloscope

MHz Minimal Range

Analog Function Generator

2 Frequency 0.1 Hz -

(1) Install Atmel Studio 7(with usbasp driver), Altium 17/18, microsoft office, pdf reader and video player.

Minimal I3 core, Ram

(2) The laptop new OS and just

3 Laptop 1 Set software above are allowed to install.

2 GB, Higher spec.

Will speed up the

(3) Dont put important file to the

desing

laptop, if any file in laptop will delete and we are not responsible for any data loss.

4 Multi tester

Analaog / Digital

1 pcs

5 Solder Iron

1 pcs Rocomended brand is goot 6 Power Suppply

Standard

0 - 12 V Minimal 1

1 pcs Dont bring big power supply(1

Ampere

Ampere is enaugh) recomended brand is goot or sanfix

7 Cutter Piler

Recomended pointed

1 pcs

and sharp ends

recomended sanfix P-40 or PS 41

9 De-Soldering Pump

11 Screw driver set

Standard

1 Set

for setting multiturn and Terminal 12 Precision screw driver

tools for drawing schematics and 14 Stationery

Additional information will be posted on the electronics forum

9. MATERIALS & EQUIPMENT

9.1. Infrastructure List

The Infrastructure List contents all the information regarding to equipment, materials and facilities provided by the organizer / responsible and participant. Some standard components to be provided by organizer/ responsible and participant.

9.2. Materials

All material test project for competition are provided by organizer and competitors are not allowed to bring any material for competition.

10. SCHEDULE OF COMPETITION

COMPETITION

TIME

ACTIVITIES Technical meeting and

Hardware Design (1)

Hardware Design (2)

16:30 - selesai

Embedded Systems

Fault Finding, Repair and

13:15 - 17:15

Measurement

17:15 - selesai

Assembly Project

12:00 - 13:00

Lunch

C3 13:00 - 13:15

Briefing

13:15 - 15:15

Hardware Design (3)

15:15 - 17:15

Evaluation

17:15 - selesai

Marking

11. LAYOUT COMPETITION

Line Follower

Track

12. VISITOR AND MEDIA ENGAGEMENT

Following is a list of possible ways to maximize visitor and media engagement: ➢ Try a trade;

➢ Display screens outlining the tasks being performed; ➢ Test Project descriptions; ➢ Competitor profiles; ➢ Daily reporting of Competition status; ➢ Display of interesting electronic project; ➢ Display of past Test Projects; ➢ Sponsor install a mini working electronic production line close to the

competition area.

13. SUSTAINABILITY

This skill competition will focus on the sustainable practices below: ➢ Recycling.

o Using project from previous competition for different task; o Encourage use of industry donated components; o Use datasheets in PDF form

➢ Use of components available from global suppliers;

HARDWARE DESIGN

Modul 1

Foto: Noor Ahwan (Jawa Tengah Hadi hardiansyah (Jawa Barat) Helmi Yuliardi (Jawa Tengah)

Test Project document LKS_2018_HWD_EN

Submitted by:

Name : Tim Elektronika LKS ASC WSC Member : Ina skills Electronics

Type

: Close Project

Time

: 7:30 Hours

1. Introduction

This Hardware Design Project will access each competitor’s skill and capacity.

1. To design circuit based on the given drawing, components and product specification.

2. To design printed Circuit Board (PCB) layout using Altium Designer CAD tool.

3. To assemble and test the functionality of product prototype.

2. Description of project and tasks

a. Circuit Design and Schematic Capture (Time limit: 2.0 hrs)

You are to complete 4 designs. Please complete the designs according to the requirements. Use only components from the parts list for your designs. You may not need all the components in the parts list. Competitor can use LTspice to simulate the design. LTspice is freeware and competitor can download the software at http://www.linear.com/designtools/software/.

Competitors can read component data sheet that is provided with only personal computer which contains Data sheet pack. The data sheet pack should be provided by Committee. The hard copi es brought by competitor can’t

be used, but competitors can read the hard copies provided with committee. When you have completed your designs you are to submit your answers on the provided Answer Sheets to the expert. You cannot do this until the 1 st hour has passed. You cannot start your PCB design in this phase of the test project.

b. Design of Printed Circuit Board (Time limit: 3:30 hrs)

➢ Design printed circuit board of PCB using Altium Designer CAD tool. ➢ Complete the designs, save PCB in the Desktop

• File folder : LKS_HWD_ NOTABLE • File name : LKS_HWD_ NOTABLE

➢ Please use track widths (including necked track) of 0.3 mm (11.811mil) minimum for signal and 0.6 mm (23.622 mil) minimum for power and

a minimum clearance of 0.3mm (11.811mil).

There must be clearly difference size of track for both signal and power.

Board dimension of 100 x 160 mm is to be used

Follow the following design rules: • Design rule: Pad – Pad clearance is 0,4mm • Design rule: Pad – Trace clearance is 0,3mm • Design rule: Trace – Trace clearance is 0,24mm • Design rule: Copper Pour – Trace clearance is 0,24mm • Design rule: Copper Pour – Pad clearance is 0,4mm • Design rule: Board Edge – ALL clearance is 0,5mm

Rule of Design PCB: • All SMD components should be placed on the Bottom layer and all TH components should be placed on the Top layer. • Signal traces should be as short as possible. • Components should be grouped together in a logical way by function.

Poor grouping results in long traces, difficulty in routing and a poor PC board.

Row Driver

8 x 8 Dot Matrix Display

Amplifier Power

Column Driver

• Use mitred or rounded corners so noise is minimized. (Does not apply to T intersections).

• Sharp angle can cause noise injection into other tracks on the PCB. Therefore all corners should be rounded or mitred (angled) by 45 deg.

WL

L>W

• While we cannot produce a silk screen layer on our milled boards, Competitors should ensure reference designators and other needed information is present in the assembly documentation. All text should

be in the same direction, ideally. There may be times where space does not permit this, and in this case the competitor should place the designation in a location that most clearly identifies where the component is located, or other important information related to the component.

Text should be readable in two directions only.

• There should be no overlap of text onto other text or outlines.

• Polarized or Orientation Component Marking Components that have a polarity should be marked on the assembly documentation. Non-polarized components should also be

indicated through markings on the assembly.

Notice that D1 and C4

markings that

2 2 indicate polarization. ICs

R2

IC IC C3 IC1 IC1

show markings indicating C1 orientation.

Resistors have no marking indicating orientation or

polarization.

• Jumper Wires

Jumper wires should be short, straight and not diagonal or crooked.

• Do not place jumpers under components.

• Power track not allowed between pin IC

• T-junction

➢ There must not be any country/competitor indication on the PCB Layout. ➢ You are to place the components following the instuction. ➢ Compelete the design and save to :

• PCB Bottom Layer.pdf (scale 1:1) • Component Placement Side bottom overlay.pdf (scale 1:1) • Component Placement Side top overlay.pdf (scale 1:1) • All schematics. Pdf

c. Build and Test Hardware design project (Time limit: 2.0 Hr)

Assemble PCB, and check its operation.

Completing the project, submit all the product and documents.

3. PROJECT OVERVIEW

The circuit is a maze controller. There are 2 separated parts:

1. Responsible to control the servo output based on the input frequency. Channel A creates a reference to X motor and channel B to the Y motor.

2. Responsible to create the start/stop signal. The metallic ball touches metallic contacts in the beginning and in the end of the maze. The circuit enables a wave sign in the output when a start pulse is generated (at the beginning) and disable it when a stop pulse is generated (in the end).

Functionally, the smartphone app generates a sine wave that has its frequency changed using the phone’s accelerometer. Each audio channel is controlled by one axes of the accelerometer. The smartphone is not necessary, all waves can be created by the function generator and the output generated signals can be checked using the oscilloscope. Of course, if the circuit works properly it can be connected to the smartphone!

Maze Controller Board

MAZE CONTROL APP

Data Accelerometer

XY

Frequency Out Audio

Hz

Audio R

Audio L

Hz

ON/OFF

#app will be uploaded in february

Block Diagram

Part List

No. Qty.

Value / Tipe Part

Information

1 1 IC 7402

OR Gate, DIP 14

2 2 IC 7404

NOT Gate, DIP 14

3 2 IC 7408

AND Gate, DIP 14

4 2 IC 7493

Binary Counter, DIP 14

5 2 IC NE555

Single precision timer DIP 8

Quad differential

6 1 IC LM339

comparators, DIP 14

7 1 FCS 9013

Traonsistor, DIP TO-92

8 2 1N4148

Diode

9 1 GREEN LED 5mm

10 1 Relay SPDT 5V

11 2 Header 3x1

12 5 Test Point 1 Pin

13 2 Push Button 2 pin

No. Qty.

Value / Tipe Part

Information

14 >1

Resistor standard

DIP 1% 1/4W

15 >1

Capasitor standard

DIP

16 4 Spacer 10mm

Metal spacer M3

17 2 Motor Servo SG90 9G

18 1 3.5mm jack handphone

19 1set

Mechanic maze

4. Competence

➢ Competitor can understanding : • Datasheet component (Ex.74ls390)

• Truth table

• Time Chart

➢ Competitor can design digital and analog circuit. ➢ Design PCB Layout following standard rule.

Modul 2 ASSEMBLY PROJECT

Foto:

Rahmat Hidayat (Sumatera Utara)

Test Project Document LKS_2018_ASM_EN

Submitted by: Name

: Tim Elektronika LKS ASC WSC Member : ASC WSC Team ID

Type

: Open Project

Time

: 4 Hours Point Indonesia Skills Competition/ LKS SMK Nasional Skill Electronics : 20 Points

1. INSTRUCTIONS

Competitors are given 4 hours to complete an electronics assembly project. This test project shall access competitors in the following areas:

a. Ability to assemble an electronic project based on given drawings, specifications and instructions like :

➢ Schematic Diagrams ➢ PCB Layout Diagrams ➢ Assembly Photographs ➢ Component Part Lists ➢ Component Data Sheets

b. Ability to verify proper operation of an electronic project after assembly like :

➢ Interpret test specifications ➢ Demonstrate proper operation of complete project

2. DESCRIPTION PROJECT AND TASKS

Assembly of this project is the digital power supply. The microcontroller used in the circuit is ATMEGA 16, a member of Atmel’s AVR microcontroller family. The main features of the power supply are the adjustable output voltage level and protection current limiter. Character 16x 2 of LCD is used as a control interface to set the parameters of voltage and current, and as displays for monitoring the actual values of voltage and current parameters that must be controlled. The output voltage of this device is 0-13 volts and the current is 1.5 amperes.

The Digital Power Supply Unit conforms to the following specifications:

Digital Power Supply Unit SPECIFICATIONS NO

CRITERIA

REQUIREMENTS

1. Rated Input Voltage 220 VAC (+/-) 10%

2. Rated Output Voltage Span

0V to 13VDC

3. Set Voltage Accuracy Set Voltage (+/-) 100mV

4. Output Voltage Ripple

< 50mVAC

The Digital Power Supply Unit can be operated with the following controls:

FRONT PANEL CONTROL SYM

DESCRIPTION FUNCTION

SW1 SWITCH Turn ‘ON’ & ‘OFF’ Power Supply Unit

Navigate continuously through the following S2

Increase Set Voltage

S4 DOWN

Decrease Set Voltage

S5

OK

Program Run / Function

JA +OUTPUT Power Supply DC Output Voltage (+) JB

-OUTPUT Power Supply DC Output Voltage (-) LCD 1

LCD PANEL Display File List and the operation of product

Fig 1 : Assembly Project 3D view

Fig 2 : Block Diagram Assembly Project

3. INSTRUCTION TO THE COMPETITOR

Time limit is 4 hours.

Complete this Assembly Project using given materials and documents.

➢ Diagram list ➢ Schematic : Main PCB, Panel PCB ➢ Component Layout : Main PCB Top, Main PCB Bottom, Panel PCB

Top, Panel PCB Bottom ➢ Photographs for assembling ➢ Operating description ➢ Parts list

4. Parts list (BOM)

4.1. Main PCB No. Qty

Value

Description

Part Number

1 1 0.33 Resistor, 5W, 5%

R35

Resistor SMD 0805

R2

3 1 1k

Resistor SMD 0805

R5

4 1 1k8

Resistor SMD 0805

R31

5 3 4k7

Resistor SMD 0805

R1, R30, R32

6 1 5k6

Resistor SMD 0805

R34 R3, R16, R17, R18, R19,

7 15 10k

Resistor SMD 0805

R20, R21, R22, R23, R24, R33, R26, R27, R28, R29

R4, R6, R7, R8, R9, R10,

8 12 20k

Resistor SMD 0805

R11, R12, R13, R14, R15, R25

Multi turn variable

Capacitor SMD 0805

C10, C11,

11 5 100nF

Capacitor SMD 0805

C6, C8, C9, C12, C13

Aluminium electrolytic

12 2 22uF/35V

C3, C5

capacitors, 5× 5 dia Aluminium electrolytic

13 2 330uF/25V

C4, C7,

capacitors, 10× 10 dia Capacitor, Electrolytic,

C1

14 1 2200uF/25V

2 mm pitch, 12 mm dia Capacitor, Electrolytic,

C2

15 1 4700uF/25V

2 mm pitch, 16 mm dia

IN4001/

Diode 1 A, footprint

DO-41 Bridge diode 3A, size

D1

17 1 KBPC308

15.9x15.9 mm 3A General Purpose

18 1 1N5401

Plastic

Rectifier, D7

footprint DO-201AD 1A General Purpose

19 1 1N4148

Plastic

Rectifier, D4

footprint DO-35

20 1 8V2

Diode zener 1 watt

led SMD 0805

SMD

Transistor,

22 2 2N2222

Q1, Q2

footprint

NPN

No. Qty Value

Description

Part Number

SOT23_N Transistor

footprint SOT54 Transistor

footprint SOT54

25 1 DB139

Transistor NPN

Q5

26 1 TIP35

Transistor NPN

Q6

5 V 1A Step-Down

27 1 MC78M05

Voltage

Regulator, U1

footprint 369A-03

12 V 1A Step-Down

28 1 MC78M12

Voltage

Regulator, U2

footprint 369A-03

Atmega16A Microcontrollers,

footprint 44A_N SMD Crystal, Load

30 1 Capacitance 10,0pF to Y1

MHZ

75.0pF

31 1 TMB12A05 Buzzer

BZ1

SMD Push button size

32 1 B3F-1020

S1

5 mm Relay 12 Volt, 5 pin,

33 1 Relay

RL1

SPDT, omron

2x5pin Male

10 Pin, male, Pin

34 1 Header With

P4

Header, 2.54 mm Pitch

cover ST 1x6Pin male

Header

6 Pin, Male, Pin

P3

single ST, Header, 2.54 mm Pitch yellow

T-block

2 2-Pin Terminal Blok, 5

mm Pitch

1x2

white MHDR 1x2, 2.54 mm

38 9 1 pin plug

1 pin test point

X8, X9

4.2. Panel PCB No Qty

Value

Description

Part Number

Resistor SMD 0805

R36

Multi turn variable

Capacitor SMD 0805

C14

SN74HC59 Register

IC SMD,

U4

5D footprint D016_N Tactile Switch size

5 4 B3F-4050 12x12 mm, DC 24 V, SW1, SW2, SW3, SW4,

50 mA

6 4 knob

knob Switch TG12864E- 16x2

Tactile Switch square

10 Pin, male, Pin

P6

Header With Header, 2.54 mm Pitch cover ST

9 3 Plug 1 pin

Plug test point 1 pin

X10, X11, X12

4.3. Power Supply Box No Qty Value

Description

Part Number

1 1 AC Cord Cable Inlet,

250V, 2.5A,

2 1 770W-X2/12 28x16

mm, Panel P7

Thickness + fuse Rocker

Switch,

3 1 SLE10A2

125VAC, 10A, SPST, SW1

20 mm dia Step

Down

Transformer,

4 1 T1 110/220/230 primary,

0- 18V Fan DC 12 Volt,

5 1 F1 60x60mm

6 1 Fan nets 60x60 mm

7 2 IDC socket S10 - A1

P4’, P6’

Banana socket red,

8 1 JA 8mm dia

Banana socket black,

9 1 JB 8mm dia

Heat sink for TIP35

10 1 35mmx12.5mm

11 1 1,5 M

Wire, 18 AWG, Black

12 1 1,5 M

Wire, 18 AWG, Red

13 1 20 cm

layer cable, 10 layer Shrinkable

Tubing,

14 1 15 cm

Black, 4mm dia Shrinkable

Tubing,

15 1 15 cm

red, 4mm dia Spacer,

metal,

16 8 Hexagonal, M3x10 mm

Screw Pan Head,

17 7 metal M3x8mm

Screw, Pan Head,

18 4 Brass, Nickel Plated, M3x35mm

Screw, Pan Head,

19 2 Brass, Nickel Plated, M4x8 mm

Hexagonal Nut M3,

20 6 metal

21 2 Hexagonal Nut M4 Cable Ties, 2.5x100

22 10 mm

Acrylic Casing 19 x 14

23 1 x 6 cm

5. Proses Assembly

Pastikan semua komponen lengkap

Fig 20 Semua komponen

5.1. Perakitan Main PCB

Merakit main PCB berdasarkan main PCB skematik dan main PCB list komponen. Spesifikasi ketinggian

(1) IC ATmega 16 sudah dipasang oleh panitia. (2) Kapasitor, buzzer, transistor SMD SOT23, resistor DIP, Resistor SMD Diode, Led,

Socket, connector, Relay, T- block, Switch button, harus menempel pada permukaan PCB.

(3) Transistors tipe TO 92 adalah 5mm – 7mm dari permukaan PCB. (4) Transistor SOT 32 dan TO-218 sesuai dengan kondisi manufaktur kaki komponen.

Fig 21 Main PCB Atas

(5) Pasanglah komponen terkecil dan terpendek terlebih dahulu.

(6) Berikut adalah hasil solderan main PCB

Fig 22 Main PCB Atas, Setelah Assembly

Fig 23 Main PCB Bawah

5.2. PANEL PCB ASSEMBLY

Perakitan PCB depan berdasarkan Panel PCB skematik dan Panel PCB list komponen.

a. Assembly kapacitor, Resistor, IC, test point, variable resistor dan header 2 x5 pin pada sisi bawah dari PCB.

Fig 24 Panel PCB Bawah

b. Assembly Push Button pada sisi atas dari PCB, diberi jarak +- 3mm dari PCB.

Fig 25 Assemble Push Button Fig 25 Assemble Push Button

Fig 26 Gabungkan LCD dengan 16 pin header

Assemble LCD pada atas of PCB

Fig 27 Assembly LCD

Fig 28 Panel PCB Atas, Setelah Assembly

5.3. Assembly dan pengkabelan instalasi power. a. Assembly Inlet AC, Kipas, Jaring Kipas, Rocker Switch, Transformer, Soket Banana pada kotak acrylic.

Fig 29 Assembly asesoris

Pemasangan Inlet AC, jangan lupa pasang fuse pada koker inlet

Fig 30 Assembly Inlet AC

Fig 31 Assembly Transformer

Fig 32 Assembly Rocker Switch

Fig 33 Assembly soket banana

Fig 34 Assembly kipas dan jarring kipas

b. Assembly dan pengkabelan instalasi power.

Fig 35 Pengkabelan instalasi power Fig 35 Pengkabelan instalasi power

Fig 36 Assembly main PCB dan panel PCB

Fig 37 Assembly main PCB

Fig 38 Assembly panel PCB Fig 38 Assembly panel PCB

Fig 39 Jalur pengkabelan

Fig 40 Pengkabelan Inlet AC

Fig 41 Pengkabelan transformer primer (0 – 220 V)

Fig 42 Pengkabelan transformer sekunder (0 – 18 V)

Fig 43 Pengkabelan rocker switch

Fig 44 Pengkabelan soket banana

Fig 45 pengkabelan soket IDC

Fig 46 Panjang IDC socket

Fig 47 Panjang IDC socket

40 CM ± 0.5 cm

Fig 48 Panjang DC socket

Hasil Perakitan

Fig 49 Hasil perakitan

Fig 50 Hasil perakitan

Modul 3 FAULT FINDING, REPAIR AND MEASUREMENT

Foto: Hadi Hardiansyah (Jawa Barat)

Test Project Document LKS_2018_FFRM_EN

Submitted by: Name

: Tim Elektronika LKS ASC WSC Member : ASC WSC Team ID

Type

: Open Hardware

Time

: 4 Hours Point Indonesia Skills Competition/ LKS SMK Nasional : 25 Points

1. Description

Name of project is Frequency analyzer.

Figure 1. PCB “8 Band Audio Spectrum Analyzer”

This project is 8 Band Audio Spectrum Analyzer. A spectrum analyzer measures the magnitude of an input signal versus frequency within the full frequency range of the instrument. The primary use is to measure the power of the spectrum of known and unknown signals.

By analyzing the spectra of electrical signals, dominant frequency, power, distortion, harmonics, bandwidth, and other spectral components of a signal can

be observed that are not easily detectable in time domain waveforms. These parameters are useful in the characterization of electronic devices, such as wireless transmitters.

Spectrum analysis can be used at audio frequencies to analyse the harmonics of an audio signal. A typical application is to measure the distortion of a nominally sine wave signal.

The display of a spectrum analyzer has frequency on the horizontal axis and the amplitude displayed on the vertical axis. To the casual observer, a spectrum analyzer looks like an oscilloscope and, in fact, some lab instruments can function either as an oscilloscope or a spectrum analyzer.

This project uses 8 active band pass filter which consist of 30Hz, 70Hz, 140 Hz, 400 Hz, 1kHz, 2kHz, 8kHz and 16 kHz band pass filter that used LM324 as the main op-amp.

2. Block diagram

The block diagram is shown in Fig 2.

Figure 2 . Block diagram for “ 8 Band Audio Spectrum Analyzer”

3. Recording of faults Record the evidence of each fault using the attached sheets and symbols

shown below.

FAULT DESCRIPTION

DESCRIPTION SYMBOL

FAULT

SYMBOL

Open Stuck at high voltage

(part, wire or PCB (pin, input, output, trace)

etc.) Short

Stuck at low voltage

(part, wire or PCB (pin, input, output, trace)

etc.) Part with larger value

Incorrect part (resistor, capacitor,

? number or wiring

etc.) connecting Part with smaller

Wrong Polarity value

(resistor, capacitor, etc.)

Reference component locations accurately. Refer to examples shown below.

LOCATION CATEGORY SAMPLE

Power +5V / +12V / -5V / -12V / GND Pin of IC

IC2_8

Component of R/C/L R7_1 （left/up:1 right/down:2) Test Point

TP1

Between Two Components

R1-R2

Example

DEFECTIVE PART

FAULT SYMBOL

Fault #1

IC 2 _8 - R7_1

Tegangan pada R7_ 1

Tegangan pada R7_ 1

dibawah 1V

mendekati 5V

Node: R7_1 ___

DEFECTIVE PART

FAULT SYMBOL

Measurement 5.00V #2

5.00V

1.00V/DIV

1.00ms/DIV

GND

GND

Node: _ TP1 ______

2ms

4ms

4. Recording of Measurement

Each measurement should show how to measure by using the symbol as below.

TOOLS

SIMBOL

Power Supply

Voltmeter V

Function Generator

GND

Example measuring schematic:

Vcc TP2

TP1

5V

CH1 CH2

GND

5. Best Practice to Make jumper wire

4.1. Wire routing Unless otherwise specified by high speed/high frequency requirements,

route jumper wires the shortest route in straight legs as possible, avoiding test points, to points of termination. Allow enough length for routing, stripping and attachment.

Jumper wire routing on assemblies having the same part number should

be the same pattern. Routing shall be documented for each part number and followed without deviation.

Do not allow jumper wires to pass over or under any component, however, they may pass over parts such as thermal mounting plates, brackets and components that are bonded to the PWB.

Jumpers may pass over solder lands if sufficient slack is provided so they can be moved away from the solder land for component replacement. Except for connectors at the edge of the board, do not pass jumpers through component foot prints unless the layout of the assembly prohibits the routing in other areas. Do not pass jumpers over patterns or vias used as a test point..

4.1.1. Target ➢ Wire routed shortest route.

➢ Wire does not pass over or under component. ➢ Wire does not pass over land patterns or vias used as points. ➢ Wire does not cross component footprint or lands.

4.1.2. Defect ➢ Wire routed under or over components. ➢ Routing of wire(s) overhang or wrap over the edge of the board. ➢ The wire is loose and can extend above the height of adjacent

components.

4.2. Supported Holes

4.2.1. Target : ➢ Wires soldered into a PTH/Via hole

4.2.2. Defect : ➢ Wire soldered into PTH with component lead

4.3. Wrapped Attachment

4.3.1. Target : ➢ Wire is wrapped a minimum of 90° on a flat lead or 180° on a round lead. ➢ Acceptable solder connection at wire/lead interface. ➢ Wire contour or end is discernible in the solder connection. ➢ Wire overhang of component termination does not violate minimum

electrical clearance.

4.3.2. Defect : ➢ Wire is wrapped less than 90° on flat or less than 180° on round leads. ➢ Wire overhang violates minimum electrical clearance

Answer Sheet

Competitor Name

Table Number

Signature

Fault-Answer Sheet

DEFECTIVE PART

FAULT SYMBOL

DEFECTIVE PART

FAULT SYMBOL

Fault #2

BEFORE

AFTER

Measurement #2

Node: _______

DEFECTIVE PART

FAULT SYMBOL

DEFECTIVE PART

FAULT SYMBOL

Fault #4

BEFORE

AFTER

Measurement #1

Node: _______

DEFECTIVE PART

FAULT SYMBOL

DEFECTIVE PART

FAULT SYMBOL

Fault #

BEFORE

AFTER

Measurement #

Node: _______

Measurement-Answer Sheet

Measurement # Schematic Measurement

Measurement Output

Vertical Settings:

/div

Horizontal

Settings:

/div

Verify graph output

Calculate the voltage using the formula

Calculate the frequency using the formula

Schematic #1

Indonesia Skills Competition/ LKS SMK Nasional

Skill Electronics Rev. 17-01-2018 67 of 91

Schematic #2

Indonesia Skills Competition/ LKS SMK Nasional Skill Electronics Rev. 17-01-2018 68 of 91

Schematic #3

Indonesia Skills Competition/ LKS SMK Nasional

Skill Electronics Rev. 17-01-2018 69 of 91

PCB TOP & BOTTOM

Indonesia Skills Competition/ LKS SMK Nasional Skill Electronics Rev. 17-01-2018 70 of 91

PCB TOP

Indonesia Skills Competition/ LKS SMK Nasional Skill Electronics Rev. 17-01-2018 71 of 91

PCB BOTTOM

Indonesia Skills Competition/ LKS SMK Nasional Skill Electronics Rev. 17-01-2018 72 of 91

#Info Tambahan Silahkan download datasheet, schematic pdf, PCB dan video pada website: www.inaskills-electronics.com/lks2018

Modul 4 SOFTWARE DESIGN

Foto:

Handriko (Bangka Belitung)

Test Project Document LKS_2018_ESP_EN

Submitted by: Name

: Tim Elektronika LKS ASC WSC Member : ASC WSC

Type

: Open hardware & Colse Firmware

Time

: 4 Hours Point Indonesia Skills Competition/ LKS SMK Nasional : 25 Points

1. Description

Hardware used is Line Follower V1.2 robot (LF V1.2). LF V1.2 is a small robot. LF V1.2 is a small robot with a size of 100 x 100 mm. Type of motor used is N20 with speed 1000Rpm at 12V. The main control of this robot is a microcontroller type ATmega16/32 and there is include a downloader type USBAsp on this robot, so that directly connected to the computer when the user is doing the programming. This robot can work with a voltage power of 6 to 12 Volts, but in competition later, this robot uses voltage 7.4V (LIPO 2S 850mA). Competitor have to program the Line Follower following instruction until can run normally in the track.

Figure 1. Line follower V1.1

2. Description of project and tasks

The task is split into 2 programming tasks.

1. Functions to control the hardware.

2. Running robot following line track.

3. Software

All competitors are required to use Atmel studio 7. Template, libraries and tutorials will be uploaded on the website www.inaskills-electronics.com/lks2018 . In the competition participants will be given a template by the jury.

4. Interface

This Line follower use interface:

6 light sensor (ADC)

LCD Character 16x2

4 push button

2 Motor with gearbox (PWM)

5. Schematic

5.1 Power Supplay

5.2 Controller

5.3 Sensor

5.4 User Push Button

5.5 4 bit LCD 16x2

5.6 Motor logic controller

5.7 Driver motor DC

5.8 Pasive Buzzer

5.9 Downloader

5.10 USB and connector

6. Detail hardware

Sensor

Roda Roda

Ø34 mm Ø34 mm

Downloader Atmega

USB Asp 16/32

V booster

USB

Ball Caster

Downloader

H=10mm

7. Track design competition

#Design changed 30% during the competition

8. PCB Design

6.1 PCB TOP & BOTTOM

6.2 PCB TOP

6.3 PCB BOTTOM

List Components.

Footprint Quantity 8-Bit AVR

1 Microcontroller 8-Bit AVR

U7

Atmega 8

32A_M

1 Microcontroller Capacitor

U6

Atmega16

44A_M

4 Capacitor

C11, C12, C20, C21

22pF

C0805

10 C27, C29, C33, C34 Capacitor

C5, C15, C18, C19, C22, C26,

100nF

C0805

8 C30, C32 Resistor

C4, C6, C7, C8, C13, C14,

100nF

C1206

Chip_R0805 6 Polarized Capacitor

C35, C36, C37, C38, C39, C40

2.2nF

CAPOL-X-7343-43 6 (Surface Mount) Polarized Capacitor

C1, C2, C3, C17, C9, C10

470uF

CAPOL-X-7343-43 1 (Surface Mount) Capasitor

C28

220uF

capSMD10 1 Aluminium Resistor

C16

1000uF

Chip_R0805 2 Resistor

R31, R33

150K

Chip_R0805 2 Resistor

R32, R34

100K

Chip_R0805 1 Resistor

R41

1.5K

Chip_R0805 1 Resistor

R42

Chip_R0805 1 Resistor

R11, R12

R26, R27, R28, R29

R0805

7 R30 Resistor

R3, R16, R17, R20, R21, R25,

R6, R13, R18, R19, R22, R23

10K

R0805

5 Schottky Diode

R7, R8, R14, R15, R24

68 R0805

DO214AC 1 Default Diode

D2 SS36

DO214AC 10 D32, D33, D34, D35 Default Diode

D5, D23, D24, D25, D26, D31,

M7

DO-201-15 1 Double-Pole, Double-

D1 1N5402

DPDT-6 1 Throw Switch Crystal Oscillator

S5

Switch 6pin ON OFF

HC-49/SM 1 Crystal Oscillator

Y1

12MHz

HC-49/SM 1 Header, 2-Pin

Y2

16Mhz

HDR1X2 1 Header, 3-Pin, Dual

P1

Header male 2x1

HDR2X3_CEN 1 row Magnetic Transducer

P2

Header male 3x2

KLJ-9025 1 Buzzer Inductor

LS1

Pasive buzzer SMD

L-MS127 1 Liquid Crystal Display

L1

47uH

LCD 1602 1 LED

LCD1

LCD 16x2 neumaric

LED0805 2 LED

D10, D11

LED Blue

LED0805 4 LED

D19, D20, D27, D28

LED Green

D3 LED Green

LED_0805 1

Footprint Quantity LED

LED_0805 1 USB 2.0, Right Angle,

D4 LED Red

Mini USB AB - 1 SMT, AB Type,

J1

Mini USB

440479

Receptacle, 5 Position, Black Motor, General Kind

B1, B2

Motor DC 12V

N20 Motor + 2

Wheel 2 Dual Full Bridge Driver

1000Rpm

SO20_M 1 Sensor

U9

L298P

U0, U1, U2, U3, U4, U5

QRE1113g /

Sensor LF 6

TCRT5000

SMD Solder Jumper CB1, CB2, CB3

SKQY_SMD Tact 5

Switch

SOD-80 2 Zener Diode

Zener Diode D6, D7

3V3

SOD-80 3 Quad 2-Input NOR

D8, D9, D18

1N4148

SOIC14A_M 1 Buffered B series Gate, 14-Pin SOIC NPN Bipolar Transistor

U10

CD4001

SOT23_M 2 Precision 500mA

Q1, Q2

9013/3904

1 Regulator SIMPLE SWITCHER®

U11

L78M05

TO-252

TS5B_M 1 3A Step-Up Voltage Regulator Roda

U8

LM2576-ADJ

2 Battry

Pololu roda 34mm

1 Charger

Lipo 2S 850mA

1 Ball caster

Charger Lipo 2S

1 Pcb

Metal H10mm

Inaskills Design 1 Hit sink

PCB LF

2 pengikat battery

9x9mm

Valco Strap

10mmx150mm 2

#Info Tambahan Silahkan download\ template, tutorial, schematic pdf, dan video pada website: www.inaskills-electronics.com/lks2018

INFORMASI PENTING

1. Baca dan pahami secara baik rule pedoman LKS.

2. Baca dan pahami secara baik Technical Description (TD) bidang Electronics.

3. Software yang digunakan dalam LKS 2018 sesuai dengan TD.

4. Peserta wajib membawa alat sesuai dengan yang tercantum pada TD, tolong selalu aktif dalam group/ email/ website ina skills terutama tujuh hari sebelum perlombaan untuk memastikan perubahan dari panitia tentang alat sesuai dengan kebijakan angaran dari direktorat.

5. Alat yang dibawa oleh peserta dari sekolah harap dibawa pada saat familiarisasi alat.

6. Peserta dibolehkan merubah tataletak alat dan pengkabelan pada work station/ meja kerja sesuai dengan kebutuhan peserta.

7. Software penunjang harus diinstal pada saat peserta masih berada didaerah/ tempat latihan, dikarenakan waktu familiarisasi yang singkat. Juri tidak bertanggung jawab jika pada saat lomba terjadi ketidak siapan software pada komputer peserta.

8. Peserta dan pembimbing masing masing harus membawa laptop. Laptop peserta akan ditinggal ditempat lomba saat familiarisasi hingga perlombaan selesai (tidak diperkenankan dibawa kepenginapan saat kompetisi). Untuk latihan di tempat penginapan peserta bisa menggunakan laptop pembimbing. Catatan: untuk laptop peserta disaranan disk dalam kondisi kosong atau tidak ada data yang penting.

9. Selalu aktif untuk membuka website www.inaskills-electronics.com untuk mendapatkan tutorial tutorial dan informasi tambahan penting dalam persiapan LKS 2018.

10. Saat kompetisi peserta tidak diperkenankan membawa HP dan memory stick diarea tempat lomba tanpa seizin juri.

11. Saat perlombaan berlangsung tidak ada buku atau kertas diatas meja dan semua tas harus dimasukan dalam loker yang telah disediakan oleh panitia.

12. Utamakan keselamatan dan kesehatan kerja. sarung tangan akan disediakan oleh panitia.

13. Jika peserta terdapat melakukan kecurangan dengan bukti yang jelas maka akan dikenakan pengurangan nilai atau diskualifikasi.

14. Persiapan LKS yang sangat singkat, tolong manfaatkan waktu sebaik baiknya, perkuat dasar/ basic.

15. Jadwal istirahat peserta menyesuaikan waktu ibadah setempat. Bagi Muslim harap untuk membawa sendal jepit dan sajadah serta mukena bagi perempuan.

16. Jika peserta dari dearah kesulitan dalam pencarian bahan latihan, bisa menghubungi kami. Jangan sampai bahan menghambat kita dalam belajar.

SELAMAT BERLATIH !!!

Soal akan berubah minimal 30%

Mungkin ada informasi tambahan mengenai persiapan LKS NASIONAL 2018,

Mohon selalu membuka web inaskills www.inaskills-electronics.com/lks2018

Forum group WA silahkan hub email: inaskills.electronics@gmail.com Dengan format pesan

Asal Sekolah

Provinsi

Nama Pembimbing

TTL Pembimbing

No Handphone Pembimbing : Nama Peserta

TTL Peserta

No Handphone Peserta