S FIS 1006335 Bibliohraphy
DAFTAR PUSTAKA
Aftanasar,
M.S.
dkk.
(2002).
Rectangular
Waveguide
Filters
Using
Photoimageable Thick film Processing. Microwave Conference, 2002.
32nd European, hlm 1-4.
Alaydrus, Mudrik. (2010). Designing Microstrip Bandpass Filter at 3.2 GHz.
International Journal on Electrical Engineering and Informatics – Vol.
2, No. 2, hlm 71 – 83.
Alaydrus, Mudrik. (2012). Simulasi Filter Lolos Bawah dengan Teknologi
Mikrostrip menggunakan Software Sonnet. Jurnal Telekomunikasi dan
Komputer, Vol.3, No. 1, hlm 49 – 64.
Ali, W.M. dkk. (2007). Influence of the Fabrication Process on the Performance
of X-Band Filters. Proceedings of Asia-Pacific Microwave Conference
2007.
Al-Maiyaly, Busrh K.H. (2013). Study the Effect of Thickness on the Electrical
Conductivity and Optical Constant of Co3O4 Thin Films. Ibn AlHaitham
Jour.for Pure & Appl. Sci., Vol.26, No.1, hlm 159-166.
Bhattacharjee, Sayantika dkk. (2013). Design of Microstrip Parallel Coupled Band
Pass Filter for Global Positioning System. Journal of Engineering,
Computers & Applied Sciences (JEC&AS), Vol. 2, No. 5, hlm 28-32.
Chen, Liu dkk. (2004). Characterization of Substrate Materials for System-in-a
Package Applications. Journal of Electronic Packaging . Vol. 126. hlm
195-201.
Effendi, Elli Herlia. (1996). Konduktor Film Tebal Pada Rangkaian Hybrid IC.
Buletin IPT, Vol.1, No.5-6, hlm 39 - 43.
Gondek, Janusz J dan Marek A. Wojcicki. (1983). New Thick-Film Microwave
Elements For Microwave Integrated Circuits. Electrocomponent Science
and Technology, Vol. 1, hlm 1-20.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
51
Gupta, Tapan K. (2003). Handbook Of Thick And Thin Film Hybrid
Microelectronics. New Jersey : John Wiley & Sons.
Hong, Jia-Sheng. (2005). Microstrip Filter Design. [Online]. Tersedia di:
http://home.eps.hw.ac.uk/~ceejh3/presentations/Microstrip%20Filter%2
0Design-JH2005.pdf
Hong, Jia-Sheng dan M.J.Lancaster. (2001). Microstrip Filter for RF/Microwave
Application. New York : John Wiley & Sons.
Hsieh, Ming-Liang dkk. (2006). Microstrip Cross-coupled Trisection Bandpass
Filters Fabricated on High Dielectric Constant Ceramic Substrates.
International Conference on Electronic Materials and Packaging,
hlm 1-4.
Hsu, C.H. dan H.A. Ho. (2009). Hybrid Microstrip Compact Bandpass Filter
Using High Permittivity Substrate. Progress In Electromagnetics
Research Letters, Vol. 12, hlm. 59-67.
Lee, H dkk. (2013). Ag(Ta0.5Nb0.5)O3 Thick Film Based Microwave Band Pass
Filters. Integrated Ferroelectrics: An International Journal, Vol.141,
hlm. 64–71.
Manurung, Roberth V, dkk. (2012). Desain dan Fabrikasi Elektroda Biosensor:
Metode Teknologi Film Tebal. Jurnal Ilmiah Elite Elektro, Vol.3, No.1 ,
hlm 65-70.
Maulana, Eka. (2014). Teknologi Film Tebal Mikroelektronika. [Online]. Tersedia
di:
http://maulana.lecture.ub.ac.id/files/2014/10/03-Teknologi-Film-
Tebal-mikroelektronika.pdf
Nurhayati, Sri dkk. (2013). Pengaruh Suhu Sinter Terhadap Karakteristik Keramik
Calsia Stabilized Zirconia Dengan Penambahan Natrium Karbonat
Untuk Elektrolit Padat.
Indonesian Journal of Materials Science,
Vol.14, No.2, hlm 99-102.
Ng, C.Y dkk. (2002). X-Band Microstrip Bandpass Filter using Photoimageable
Thick-Film
Materials.
IEEE
MTT-S
International
Microwave
Symposium Digest, Vol.3, hlm 2209-2212.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
52
Purnama, Agustian. (2014). Filter Frekuensi .[Online]. Tersedia di: http://compeng.binus.ac.id/files/2014/05/Filter-Frekuensi.pdf
Rane, Sunit dan Vijaya Puri. (2001). Influence of Alumina Overlay on the
Performance of Thin and Thick Film Microstrip Band Pass Filter. The
International Journal of Microcircuits and Electronic Packaging, Vol.
24, No.3, hlm 263-272.
Rane, Sunit dan Vijaya Puri. (2002). Thin Film, Thick Film Microstrip Band Pass
Flter: A Comparison and Effect of Bulk Overlay. Microelectronics
Reliability, Vol. 2, hlm 1953 – 1958.
Rane, Sunit dan Vijaya Puri. (1998). Performance Comparison of Seven Section
Parallel Coupled Microstrip Filter Using Various Ag Thick Film Pastes.
Proceedings of the International Conference on Computers and Devices
for Communication, hlm 445-447.
Retnaningsih, Lilis dkk. (2002). Pengaruh Dimensi Komponen dan Komposisi
Pasta Terhadap Proses Pembuatan Rangkaian Hibrid Film Tebal. Jurnal
Elektronika dan Telekomunikasi, No.1, Vol.II, hlm 37 – 40.
Sakinah, Lisa. (2011). Perancangan Dan Pembuatan Prototipe Band Pass Filter
Untuk Optimasi Transfer Daya Pada Sinyal Frekuensi Rendah; Studi
Kasus: Sinyal EEG. (Tesis). Fakultas Matematika dan Ilmu Pengetahuan
Alam, Insitut Teknologi Sepuluh November. Surabaya.
Shingh, Paramjeet dan A.K. Verma. (2011). Analysis of Multilayer Microstrip
Line of Finite Conductor Thickness using Quasi-Static Spectral Domain
Analysis (SDA) and Single Layer Reduction (SLR) Method. Annual
IEEE India Conference (INDICON),hlm 1-4.
Somer, Jakub. (2013). Application of Thick Films in the Modern Electronics.
(Tesis). Faculty of Electrical Engineering and Communication, Brno
University of Technology. Brno.
Supriyanto, Toto. (2010). Perancangan Bandpass Filter Untuk CPE m-WiMAX
Menggunakan Fiter Aktif Mikrostrip Hairpin. (Tesis). Fakultas Teknik,
Universitas Indonesia. Depok.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
53
Supriyanto, Toto dan Teguh F. (2011). Desain RF Low Noise Band Pass Filter
untuk Aplikasi WiMax Menggunakan Kapasitansi Aktif. Jurnal Ilmiah
Elite Elektro, Vol.2, No.1, hlm 61-66.
Syamsiana, I.N. (2011). Perancangan Dan Pembuatan High Pass Butterworth
Filter Orde Dua Dengan Spesifikasi Super Treble. Jurnal Teknik Elektro
Politeknik Negeri Malang,Vol.9, No.6, hlm 73 – 85.
Tarr,
Martin.
(2007).
Thick
Film
Technology.
[Online]. Tersedia
di:
http://www.ami.ac.uk/courses/topics/0255_tft/
Vincent, Tracey. (2009). Transmission Line Features and Their Influence On GHz
Conductor Loss. (Disertasi). Manufacturing Engineering and Material
Science Program, Worcester Polytechnic Institute. New-England.
Van Vlack, Lawrence H. (2001). Elemen-Elemen Ilmu dan Rekayasa Material.
Jakarta: Erlangga.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
Aftanasar,
M.S.
dkk.
(2002).
Rectangular
Waveguide
Filters
Using
Photoimageable Thick film Processing. Microwave Conference, 2002.
32nd European, hlm 1-4.
Alaydrus, Mudrik. (2010). Designing Microstrip Bandpass Filter at 3.2 GHz.
International Journal on Electrical Engineering and Informatics – Vol.
2, No. 2, hlm 71 – 83.
Alaydrus, Mudrik. (2012). Simulasi Filter Lolos Bawah dengan Teknologi
Mikrostrip menggunakan Software Sonnet. Jurnal Telekomunikasi dan
Komputer, Vol.3, No. 1, hlm 49 – 64.
Ali, W.M. dkk. (2007). Influence of the Fabrication Process on the Performance
of X-Band Filters. Proceedings of Asia-Pacific Microwave Conference
2007.
Al-Maiyaly, Busrh K.H. (2013). Study the Effect of Thickness on the Electrical
Conductivity and Optical Constant of Co3O4 Thin Films. Ibn AlHaitham
Jour.for Pure & Appl. Sci., Vol.26, No.1, hlm 159-166.
Bhattacharjee, Sayantika dkk. (2013). Design of Microstrip Parallel Coupled Band
Pass Filter for Global Positioning System. Journal of Engineering,
Computers & Applied Sciences (JEC&AS), Vol. 2, No. 5, hlm 28-32.
Chen, Liu dkk. (2004). Characterization of Substrate Materials for System-in-a
Package Applications. Journal of Electronic Packaging . Vol. 126. hlm
195-201.
Effendi, Elli Herlia. (1996). Konduktor Film Tebal Pada Rangkaian Hybrid IC.
Buletin IPT, Vol.1, No.5-6, hlm 39 - 43.
Gondek, Janusz J dan Marek A. Wojcicki. (1983). New Thick-Film Microwave
Elements For Microwave Integrated Circuits. Electrocomponent Science
and Technology, Vol. 1, hlm 1-20.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
51
Gupta, Tapan K. (2003). Handbook Of Thick And Thin Film Hybrid
Microelectronics. New Jersey : John Wiley & Sons.
Hong, Jia-Sheng. (2005). Microstrip Filter Design. [Online]. Tersedia di:
http://home.eps.hw.ac.uk/~ceejh3/presentations/Microstrip%20Filter%2
0Design-JH2005.pdf
Hong, Jia-Sheng dan M.J.Lancaster. (2001). Microstrip Filter for RF/Microwave
Application. New York : John Wiley & Sons.
Hsieh, Ming-Liang dkk. (2006). Microstrip Cross-coupled Trisection Bandpass
Filters Fabricated on High Dielectric Constant Ceramic Substrates.
International Conference on Electronic Materials and Packaging,
hlm 1-4.
Hsu, C.H. dan H.A. Ho. (2009). Hybrid Microstrip Compact Bandpass Filter
Using High Permittivity Substrate. Progress In Electromagnetics
Research Letters, Vol. 12, hlm. 59-67.
Lee, H dkk. (2013). Ag(Ta0.5Nb0.5)O3 Thick Film Based Microwave Band Pass
Filters. Integrated Ferroelectrics: An International Journal, Vol.141,
hlm. 64–71.
Manurung, Roberth V, dkk. (2012). Desain dan Fabrikasi Elektroda Biosensor:
Metode Teknologi Film Tebal. Jurnal Ilmiah Elite Elektro, Vol.3, No.1 ,
hlm 65-70.
Maulana, Eka. (2014). Teknologi Film Tebal Mikroelektronika. [Online]. Tersedia
di:
http://maulana.lecture.ub.ac.id/files/2014/10/03-Teknologi-Film-
Tebal-mikroelektronika.pdf
Nurhayati, Sri dkk. (2013). Pengaruh Suhu Sinter Terhadap Karakteristik Keramik
Calsia Stabilized Zirconia Dengan Penambahan Natrium Karbonat
Untuk Elektrolit Padat.
Indonesian Journal of Materials Science,
Vol.14, No.2, hlm 99-102.
Ng, C.Y dkk. (2002). X-Band Microstrip Bandpass Filter using Photoimageable
Thick-Film
Materials.
IEEE
MTT-S
International
Microwave
Symposium Digest, Vol.3, hlm 2209-2212.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
52
Purnama, Agustian. (2014). Filter Frekuensi .[Online]. Tersedia di: http://compeng.binus.ac.id/files/2014/05/Filter-Frekuensi.pdf
Rane, Sunit dan Vijaya Puri. (2001). Influence of Alumina Overlay on the
Performance of Thin and Thick Film Microstrip Band Pass Filter. The
International Journal of Microcircuits and Electronic Packaging, Vol.
24, No.3, hlm 263-272.
Rane, Sunit dan Vijaya Puri. (2002). Thin Film, Thick Film Microstrip Band Pass
Flter: A Comparison and Effect of Bulk Overlay. Microelectronics
Reliability, Vol. 2, hlm 1953 – 1958.
Rane, Sunit dan Vijaya Puri. (1998). Performance Comparison of Seven Section
Parallel Coupled Microstrip Filter Using Various Ag Thick Film Pastes.
Proceedings of the International Conference on Computers and Devices
for Communication, hlm 445-447.
Retnaningsih, Lilis dkk. (2002). Pengaruh Dimensi Komponen dan Komposisi
Pasta Terhadap Proses Pembuatan Rangkaian Hibrid Film Tebal. Jurnal
Elektronika dan Telekomunikasi, No.1, Vol.II, hlm 37 – 40.
Sakinah, Lisa. (2011). Perancangan Dan Pembuatan Prototipe Band Pass Filter
Untuk Optimasi Transfer Daya Pada Sinyal Frekuensi Rendah; Studi
Kasus: Sinyal EEG. (Tesis). Fakultas Matematika dan Ilmu Pengetahuan
Alam, Insitut Teknologi Sepuluh November. Surabaya.
Shingh, Paramjeet dan A.K. Verma. (2011). Analysis of Multilayer Microstrip
Line of Finite Conductor Thickness using Quasi-Static Spectral Domain
Analysis (SDA) and Single Layer Reduction (SLR) Method. Annual
IEEE India Conference (INDICON),hlm 1-4.
Somer, Jakub. (2013). Application of Thick Films in the Modern Electronics.
(Tesis). Faculty of Electrical Engineering and Communication, Brno
University of Technology. Brno.
Supriyanto, Toto. (2010). Perancangan Bandpass Filter Untuk CPE m-WiMAX
Menggunakan Fiter Aktif Mikrostrip Hairpin. (Tesis). Fakultas Teknik,
Universitas Indonesia. Depok.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu
53
Supriyanto, Toto dan Teguh F. (2011). Desain RF Low Noise Band Pass Filter
untuk Aplikasi WiMax Menggunakan Kapasitansi Aktif. Jurnal Ilmiah
Elite Elektro, Vol.2, No.1, hlm 61-66.
Syamsiana, I.N. (2011). Perancangan Dan Pembuatan High Pass Butterworth
Filter Orde Dua Dengan Spesifikasi Super Treble. Jurnal Teknik Elektro
Politeknik Negeri Malang,Vol.9, No.6, hlm 73 – 85.
Tarr,
Martin.
(2007).
Thick
Film
Technology.
[Online]. Tersedia
di:
http://www.ami.ac.uk/courses/topics/0255_tft/
Vincent, Tracey. (2009). Transmission Line Features and Their Influence On GHz
Conductor Loss. (Disertasi). Manufacturing Engineering and Material
Science Program, Worcester Polytechnic Institute. New-England.
Van Vlack, Lawrence H. (2001). Elemen-Elemen Ilmu dan Rekayasa Material.
Jakarta: Erlangga.
Listya Utari, 2014
Penumbuhan Lapisan Film Tebal Ag, Pd/Ag, Dan Au Dengan Menggunakan Metode Screen
Printing Yang Diaplikasikan Sebagai Mikrostrip Bandpass Filter
Universitas Pendidikan Indonesia | repository.upi.edu | perpustakaan.upi.edu