Perancangan dan Realisasi Kedalamam Pemboran Menggunakan PIC16F84.

teknologi yang saat ini menuntut adanya ketepatan dan kecepatan yang semakin

tinggi. Untuk masalah pemboran kedalaman, akan terasa sulit dilakukan secara

manual jika adanya permintaan yang banyak dan kedalaman yang ingin dibor

berbeda-beda. Dalam Tugas Akhir ini telah dirancang dan direalisasikan sebuah

alat pemboran dengan kedalaman yang diinginkan menggunakan mikrokontroler.

Alat pemboran kedalaman ini dirancang dan direalisasikan dengan

memanfaatkan modul sensor inframerah GP2D02, motor DC, papan ketik, dan

LCD yang dikendalikan oleh pengendali mikro PIC16F84. Masukan diberikan

melalui penekanan tombol papan ketik. Penekanan tombol ‘*’ untuk memasukkan

data panjang mata bor dan kedalaman yang diinginkan. Data masukan berupa dua

digit angka desimal dalam satuan cm. Penekanan tombol ‘#’ untuk menjalankan

proses pemboran. Motor DC akan menurunkan mesin bor sampai pada nilai

setpoint tertentu. Setelah nilai setpoint tercapai, motor DC segera menaikkan

mesin bor pada kedudukan semula. Dengan demikian, proses pemboran selesai

dan menunggu masukan data yang baru.

Pengujian kinerja alat pemboran kedalaman dilakukan dengan cara

melakukan pemboran terhadap kayu lunak (Borneo) dan kayu keras (Kamper).

Persentase kesalahan rata-rata pemboran terhadap kayu Borneo menggunakan

panjang mata bor 10 cm diameter 4,5 mm adalah 9,54 %, menggunakan panjang

mata bor 8 cm diameter 5 mm adalah 9,64 %, menggunakan panjang mata bor 6

cm diameter 6,5 mm adalah 25,10 %. Sedangkan persentase kesalahan pemboran

terhadap kayu Kamper menggunakan panjang mata bor 10 cm diameter 4,5 mm

adalah 9,99 %, menggunakan panjang mata bor 8 cm 5 mm adalah 9,88 %,

menggunakan panjang mata bor 6 cm diameter 6,5 mm adalah 25,34 %.

Kesalahan disebabkan karena adanya daerah mati (

deadzone

) pada sistem

mekanik alat pemboran kedalaman yang tersusun dari gigi dan rantai.

excelsior. For the problem of deepness drilling, will be felt done difficult in

manual of if existence of request which is a lot of and deepness which wish drilled

different each other. In this Final Duty have been designed and realized by a

drilling appliance with the deepness wanted use the microcontroller.

This deepness Drilling appliance is designed and realized by exploiting

infra-red censor module of GP2D02, motor DC, board type, and LCD controlled

by micro controller of PIC16F84. Input given by through emphasis of board knob

type the. Knob emphasis '*' to enter the long data of eye drill and wanted

deepness. Input data in the form of two number digit denary in set of cm. Knob

emphasis '#' to run process the drilling. Motor DC will degrade the drilling

machine come up with the certain value set point. After value set point reached

the, motor DC immediately boost up the drilling machine at domiciling from the

beginning. Thereby, process the drilling to finish and await the new data input.

Examination of Performance of appliance of deepness drilling done by

doing drilling to softwood (Borneo) and hardwood (Kamper). Percentage of

Mistake of drilling mean to wood Borneo use the eye length drill 10 cm diameter

4,5 mm is 9,54 %, using eye length drill 8 cm diameter 5 mm is 9,64 %, using eye

length drill 6 cm diameter 6,5 mm is 25,10 %. While percentage of drilling

mistake to wood Kamper use the eye length drill 10 cm diameter 4,5 mm is 9,99

%, using eye length drill 8 cm 5 mm is 9,88 %, using eye length drill 6 cm

diameter 6,5 mm is 25,34 % Mistake caused by caused by dead area (dead zone)

of at system of mechanic of structured deepness drilling appliance from tooth and

enchain.

Halaman

ABSTRAK

………. i

ABSTRACT ……… ii

KATA PENGANTAR……….. iii

DAFTAR ISI ………...

v

DAFTAR GAMBAR……… viii

DAFTAR TABEL………

ix

BAB I PENDAHULUAN

I.1 Latar Belakang Masalah……….…... 1

I.2 Identifikasi Masalah……….. 2

I.3 Tujuan………... 2

I.4 Pembatasan Masalah………. 2

I.5 Sistem Pembahasan……….. 3

BAB II TEORI PENUNJANG

II.1 Mikrokontroler PIC16F84……… 4

II.1.1 Deskripsi Pin-pin………. 6

II.1.2 Organisasi Memori……….. 8

II.1.2.1 Organisasi Memori Program……….. 9

II.1.2.2 Organisasi Memori Data………... 10

II.1.3 Register Fungsi Khusus………... 11

II.1.3.1 Register STATUS……….. 12

II.1.3.2 Register OPTION_REG………. 13

II.1.3.3 Register INTCON………...….14

II.1.3.4 Program Counter, PCL, dan PCLATCH………… 15

II.1.3.5 Stack………... 15

II.1.3.6 Pengalamatan Tak Langsung………... 16

II.1.6.1 Modul TIMER0 dan Register TMR0………. 22

II.1.6.2 Pewaktu Power-up………..22

II.1.6.3 Pewaktu Start-up Osilator (OST)………... 23

II.1.6.4 Pewaktu Watchdog (WDT)……… 23

II.1.6.5 Penyekala………24

II.1.7 Memori Data EEPROM……….. 24

II.1.7.1 Register EECON1 dan EECON2………... 24

II.1.7.2 Register EEDATA dan EEADR……….25

II.1.8 Reset……… 25

II.1.9 Interupsi………..…….26

II.1.9.1 Interupsi Eksternal RB0/INT………..……..27

II.1.9.2 Interupsi TMR0……….. 27

II.1.9.3 Interupsi PORTB……… 27

II.1.10 Set Instruksi………... 27

II.1.11 Format Instruksi……… 29

II.1.12 Register Fungsi Khusus sebagai Sumber/Tujuan……….. 31

II.2 Pengendali Motor DC………….………..33

II.3 Modul Sensor Inframerah GP2D02………. 35

BAB III PERANCANGAN DAN REALISASI

III.1 Diagram Kerja dan Cara Kerja…..………. 39

III.2 Sistem Mekanik……….. 41

III.3 Perancangan Perangkat keras Internal……… 42

III.3.1 Rangkaian Antarmuka PIC16F84 dengan Modul

Sensor Inframerah ………..…. 42

III.3.2 Rangkaian Secara Keseluruhan………..…. 43

III.4 Perancangan Perangkat Keras Eksternal……….44

III.5.1 Subprogram untuk Pembacaan Modul Sensor

Inframerah ……….. 47

III.5.2 Program Keseluruhan………... 47

BAB IV PENGUJIAN DAN ANALISA KINERJA ALAT

IV.1 Pengujian Rangkaian Antarmuka PIC16F84 dengan

Modul Sensor Inframerah………...…… 51

IV.2 Pengujian Rangkaian Catu Daya……… 61

IV.3 Pengujian Alat Secara Keseluruhan………... 62

IV.3.1 Pengujian Terhadap Kayu Lunak (Borneo)…………

62

IV.3.1.1 Pengujian dengan Panjang Mata Bor 10 cm….. 62

IV.3.1.2 Pengujian dengan Panjang Mata Bor 8 cm…… 62

IV.3.1.3 Pengujian dengan Panjang Mata Bor 6 cm…… 63

IV.3.2 Pengujian Terhadap Kayu Keras (Kayu Kamper)……... 63

IV.3.1.1 Pengujian dengan Panjang Mata Bor 10 cm….. 63

IV.3.1.2 Pengujian dengan Panjang Mata Bor 8 cm…… 63

IV.3.1.3 Pengujian dengan Panjang Mata Bor 6 cm…… 63

BAB V KESIMPULAN DAN SARAN

V.1 Kesimpulan………...72

V.2 Saran……….73

DAFTAR PUSTAKA

LAMPIRAN A. Foto Alat

B. Rangkaian Keseluruhan

C. Perangkat Lunak

Gambar 2.1

Pin-pin Mikrokontroler PIC16F84

Gambar 2.2

Peta Memori Program dan Stack PIC16F83/CR83

Gambar 2.3

Peta Memori Program dan Stack PIC16F84/CR84

Gambar 2.4

Peta File Register PIC16F83/CR83

Gambar 2.5

Peta File Register PIC16F84/CR84

Gambar 2.6

Pengoperasian Osilator Kristal (Konfigurasi LP, XT, HS)

Gambar 2.7

Tegangan Keluaran Multivibrator Astabil

Gambar 2.8

Rangkaian Multivibrator Astabil

Gambar 2.9

LED Pemancar Inframerah

Gambar 2.10

Position Sensitive Detector (PSD)

Gambar 2.11

Struktur Position Sensitive Photodioda

Gambar 2.12

Cara Kerja Modul Sensor GP2D02

Gambar 2.13

Diagram Pewaktuan Pengukuran dan Keluaran Data

Gambar 3.1

Diagram Kerja Alat Pemboran Kedalaman

Gambar 3.2

Rancangan Alat Pemboran Kedalaman

Gambar 3.3

Rangkaian Antarmuka PIC16F84 dengan Modul Sensor

Gambar 3.4

Rangkaian Catu Daya 5 Volt

Gambar 3.5

Rangkaian Catu Daya 12 Volt

Gambar 3.6

Rangkaian Pengaturan Kecepatan Motor DC

Gambar 3.7

Flowchart Subprogram untuk Pembacaan Sensor

Gambar 3.8

Flowchart Program Keseluruhan

Tabel 2.1

Fungsi Pin-pin pada PIC16X8X

Tabel 2.2

Perbandingan Keluarga PIC16X8X

Tabel 2.3

Piranti Keluarga PIC16X8X

Tabel 2.4

Register STATUS (Alamat 03h, 83h)

Tabel 2.5

Register OPTION_REG (Alamat 81h)

Tabel 2.6

Register INTCON (Alamat 0Bh, 8Bh)

Tabel 2.7

Tipikal Pemilihan Nilai Kapasitor untuk Osilator Kristal

Tabel 2.8

Fungsi Port A

Tabel 2.9

Fungsi Port B

Tabel 2.10

Uraian Bidang Opcode

Tabel 2.11

Format Umum untuk Instruksi

Tabel 2.12

Set Instruksi PIC16F8X

Tabel 4.1

Hasil Pembacaan Modul Sensor Inframerah

Tabel 4.2

Hasil Pengukuran Tegangan Keluaran Catu Daya

Tabel 4.3

Hasil Pengujian Terhadap Kayu Borneo dengan Panjang

Mata

Bor

10

cm

Tabel 4.4

Hasil Pengujian Terhadap Kayu Borneo dengan Panjang

Mata

Bor

8

cm

Tabel 4.5

Hasil Pengujian Terhadap Kayu Borneo dengan Panjang

Mata

Bor

6

cm

Tabel 4.6

Hasil Pengujian Terhadap Kayu Kamper dengan Panjang

Mata

Bor

10

cm

Tabel 4.7

Hasil Pengujian Terhadap Kayu Kamper dengan Panjang

Mata

Bor

8

cm

Tabel 4.8

Hasil Pengujian Terhadap Kayu Kamper dengan Panjang

Mata

Bor

6

cm

Tabel 4.9

Persentase Kesalahan Rata-Rata Hasil Pemboran

Kedalaman

DATA SHEET

Product specification

Supersedes data of 1998 Jun 04

2003 Jun 25

74HC595; 74HCT595

8-bit serial-in, serial or parallel-out

shift register with output latches;

3-state

FEATURES • 8-bit serial input

• 8-bit serial or parallel output

• Storage register with 3-state outputs

• Shift register with direct clear

• 100 MHz (typical) shift out frequency

• ESD protection:

HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. APPLICATIONS

• Serial-to-parallel data conversion

• Remote control holding register.

DESCRIPTION

The 74HC/HCT595 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A.

The 74HC/HCT595 is an 8-stage serial shift register with a storage register and 3-state outputs. The shift register and storage register have separate clocks.

Data is shifted on the positive-going transitions of the SH_CP input. The data in each register is transferred to the storage register on a positive-going transition of the ST_CP input. If both clocks are connected together, the shift register will always be one clock pulse ahead of the storage register.

The shift register has a serial input (DS) and a serial standard output (Q7’) for cascading. It is also provided with asynchronous reset (active LOW) for all 8 shift register stages. The storage register has 8 parallel 3-state bus driver outputs. Data in the storage register appears at the output whenever the output enable input (OE) is LOW. QUICK REFERENCE DATA

GND = 0 V; Tamb= 25°C; tr= tf= 6 ns.

Notes

1. CPD is used to determine the dynamic power dissipation (PDinµW).

PD= CPD×VCC2×fi×N +Σ(CL×VCC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC= supply voltage in Volts;

N = total load switching outputs;

Σ(CL×VCC2×fo) = sum of the outputs.

2. For 74HC595 the condition is VI= GND to VCC.

For 74HCT595 the condition is VI= GND to VCC−1.5 V.

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

74HC 74HCT

tPHL/tPLH propagation delay CL= 50 pF; VCC= 4.5 V

SH_CP to Q7’ 19 25 ns

SH_CP to Qn 20 24 ns

MR to Q7’ 100 52 ns

fmax maximum clock frequency SH_CP and ST_CP 100 57 MHz

CI input capacitance 3.5 3.5 pF

FUNCTION TABLE See note 1.

Note

1. H = HIGH voltage level; L = LOW voltage level;

↑= LOW-to-HIGH transition;

↓= HIGH-to-LOW transition; Z = high-impedance OFF-state; n.c. = no change;

X = don’t care.

ORDERING INFORMATION

INPUT OUTPUT

FUNCTION

SH_CP ST_CP OE MR DS Q7’ Qn

X X L L X L n.c. a LOW level on MR only affects the shift registers

X ↑ L L X L L empty shift register loaded into storage register

X X H L X L Z shift register clear; parallel outputs in high-impedance

OFF-state

↑ X L H H Q6’ n.c. logic high level shifted into shift register stage 0;

contents of all shift register stages shifted through, e.g. previous state of stage 6 (internal Q6’) appears on the serial output (Q7’)

X ↑ L H X n.c. Qn’ contents of shift register stages (internal Qn’) are

transferred to the storage register and parallel output stages

↑ ↑ L H X Q6’ Qn’ contents of shift register shifted through; previous

contents of the shift register is transferred to the storage register and the parallel output stages

TYPE NUMBER

PACKAGE TEMPERATURE

RANGE PINS PACKAGE MATERIAL CODE

74HC595N −40 to +125°C 16 DIP16 plastic SOT38-4

74HCT595N −40 to +125°C 16 DIP16 plastic SOT38-4

74HC595D −40 to +125°C 16 SO16 plastic SOT109-1

74HCT595D −40 to +125°C 16 SO16 plastic SOT109-1

74HC595DB −40 to +125°C 16 SSOP16 plastic SOT338-1

74HCT595DB −40 to +125°C 16 SSOP16 plastic SOT338-1

74HC595PW −40 to +125°C 16 TSSOP16 plastic SOT403-1

74HCT595PW −40 to +125°C 16 TSSOP16 plastic SOT403-1

74HC595BQ −40 to +125°C 16 DHVQFN16 plastic SOT763-1

PINNING

PIN SYMBOL DESCRIPTION

1 Q1 parallel data output

2 Q2 parallel data output

3 Q3 parallel data output

4 Q4 parallel data output

5 Q5 parallel data output

6 Q6 parallel data output

7 Q7 parallel data output

8 GND ground (0 V)

9 Q7’ serial data output

10 MR master reset (active LOW)

11 SH_CP shift register clock input

12 ST_CP storage register clock input

13 OE output enable (active LOW)

14 DS serial data input

15 Q0 parallel data output

16 VCC positive supply voltage

handbook, halfpage Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q7' Q0 DS GND ST_CP SH_CP VCC OE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 595 MLA001 MR

Fig.1 Pin configuration DIP16, SO16 and (T)SSOP16. handbook, halfpage 1 16 GND(1) Q1 VCC 8 2 3 4 5 7 Q2 Q3 Q4 Q5 Q6 15 14 13 12 10 6 11 9 GND

Top view MBL893

Q7 Q7' MR SH_CP ST_CP OE DS Q0

Fig.2 Pin configuration DHVQFN16.

(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.

handbook, halfpage OE MR 9 15 1 2 3 4 5 6 7 13 10 14 11 12 MLA002 Q1 Q0 Q2 Q3 Q4 Q5 Q6 Q7 Q7' DS ST_CP SH_CP

Fig.3 Logic symbol.

handbook, halfpage MSA698 15 9 1 2 3 4 5 6 7 1D 2D C1/ 10 11 14 C2 12 13 EN3 SRG8 R 3 OE MR Q1 Q0 Q2 Q3 Q4 Q5 Q6 Q7 Q7' DS ST_CP SH_CP

Fig.4 IEC logic symbol.

handbook, full pagewidth

ST_CP DS SH_CP MR

Q7' 8-STAGE SHIFT REGISTER

8-BIT STORAGE REGISTER 14 11 10 12 9 OE 3-STATE OUTPUTS Q1 Q2 Q3 Q5 Q6 Q7 Q4 Q0 15 1 2 3 4 5 6 7 13 MLA003

handbook, full pagewidth

STAGE 0 STAGES 1 to 6 STAGE 7

FF0 D

CP Q

R

LATCH D

CP Q

FF7 D

CP Q

R

LATCH D

CP Q

MLA010

D Q

Q1 Q2 Q3 Q4 Q5 Q6 Q7

Q7'

Q0 DS

ST_CP SH_CP

OE MR

handbook, full pagewidth

high-impedance OFF-state ST_CP

DS SH_CP

MR

OE

Q1 Q0

Q7' Q6

Q7

MLA005-1

RECOMMENDED OPERATING CONDITIONS

LIMITED VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).

Note

1. For DIP16 packages: above 70°C derate linearly with 12 mW/K. For SO16 packages: above 70°C derate linearly with 8 mW/K. For SSOP16 packages: above 60°C derate linearly with 5.5 mW/K. For TSSOP16 packages: above 60°C derate linearly with 5.5 mW/K. For DHVQFN16 packages: above 60°C derate linearly with 4.5 mW/K.

SYMBOL PARAMETER CONDITIONS 74HC 74HCT UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V

VI input voltage 0 − VCC 0 − VCC V

VO output voltage 0 − VCC 0 − VCC V

Tamb ambient temperature −40 − +125 −40 − +125 °C

tr, tf input rise and fall time VCC= 2.0 V − − 1000 − − − ns

VCC= 4.5 V − 6.0 500 − 6.0 500 ns

VCC= 6.0 V − − 400 − − − ns

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage −0.5 +7.0 V

IIK input diode current VI<−0.5 V to VI> VCC+ 0.5 V − ±20 mA

IOK output diode current VO<−0.5 V to VO> VCC+ 0.5 V − ±20 mA

IO output source or sink current VO=−0.5 V to VCC+ 0.5 V

Q7’ standard output − ±25 mA

Qn bus driver outputs − ±35 mA

ICC, IGND VCC or GND current − ±70 mA

Tstg storage temperature −65 +150 °C

DC CHARACTERISTICS Type 74HC

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

OTHER VCC (V)

Tamb=−40 to +85°C; note 1

VIH HIGH-level input

voltage

2.0 1.5 1.2 − V

4.5 3.15 2.4 − V

6.0 4.2 3.2 − V

VIL LOW-level input

voltage

2.0 − 0.8 0.5 V

4.5 − 2.1 1.35 V

6.0 − 2.8 1.8 V

VOH HIGH-level output

voltage

VI= VIH or VIL

all outputs

IO=−20µA 2.0 1.9 2.0 − V

4.5 4.4 4.5 − V

6.0 5.9 6.0 − V

Q7’ standard output

IO=−4.0 mA 4.5 3.84 4.32 − V

IO=−5.2 mA 6.0 5.34 5.81 − V

Qn bus driver outputs

IO=−6.0 mA 4.5 3.84 4.32 − V

IO=−7.8 mA 6.0 5.34 5.81 − V

VOL LOW-level output

voltage

VI= VIH or VIL

all outputs

IO= 20µA 2.0 − 0 0.1 V

4.5 − 0 0.1 V

6.0 − 0 0.1 V

Q7’ standard output

IO= 4.0 mA 4.5 − 0.15 0.33 V

IO= 5.2 mA 6.0 − 0.16 0.33 V

Qn bus driver outputs

IO= 6.0 mA 4.5 − 0.16 0.33 V

IO= 7.8 mA 6.0 − 0.16 0.33 V

ILI input leakage current VI= VCCor GND 6.0 − − ±1.0 µA

IOZ 3-state output

OFF-state current

VI= VIHor VIL;

VO= VCCor GND

6.0 − − ±5.0 µA

ICC quiescent supply

current

VI= VCCor GND;

IO= 0

Note

1. All typical values are measured at Tamb= 25°C. Tamb=−40 to +125°C

VIH HIGH-level input

voltage

2.0 1.5 − − V

4.5 3.15 − − V

6.0 4.2 − − V

VIL LOW-level input

voltage

2.0 − − 0.5 V

4.5 − − 1.35 V

6.0 − − 1.8 V

VOH HIGH-level output

voltage

VI= VIH or VIL

all outputs

IO=−20µA 2.0 1.9 − − V

4.5 4.4 − − V

6.0 5.9 − − V

Q7’ standard output

IO=−4.0 mA 4.5 3.7 − − V

IO=−5.2 mA 6.0 5.2 − − V

Qn bus driver outputs

IO=−6.0 mA 4.5 3.7 − − V

IO=−7.8 mA 6.0 5.2 − − V

VOL LOW-level output

voltage

VI= VIH or VIL

all outputs

IO= 20µA 4.5 − − 0.1 V

Q7’ standard output

IO= 4.0 mA 4.5 − − 0.4 V

Qn bus driver outputs

IO= 6.0 mA 4.5 − − 0.4 V

ILI input leakage current VI= VCCor GND 5.5 − − ±1.0 µA

IOZ 3-state output

OFF-state current

VI= VIHor VIL;

VO= VCCor GND

5.5 − − ±10.0 µA

ICC quiescent supply

current

VI= VCCor GND;

IO= 0

5.5 − − 160 µA

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

Type 74HCT

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr= tf= 6 ns; CL= 50 pF.

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

OTHER VCC (V)

Tamb=−40 to +85°C;note 1

VIH HIGH-level input

voltage

4.5 to 5.5 2.0 1.6 − V

VIL LOW-level input

voltage

4.5 to 5.5 − 1.2 0.8 V

VOH HIGH-level output

voltage

VI= VIHor VIL

all outputs

IO=−20µA 4.5 4.4 4.5 − V

Q7’ standard output

IO=−4.0 mA 4.5 3.84 4.32 − V

Qn bus driver outputs

IO=−6.0 mA 4.5 3.7 4.32 − V

VOL LOW-level output

voltage

VI= VIHor VIL

all outputs

IO= 20µA 4.5 − 0 0.33 V

Q7’ standard output

IO= 4.0 mA 4.5 − 0.15 0.33 V

Qn bus driver outputs

IO= 6.0 mA 4.5 − 0.16 0.33 V

ILI input leakage current VI= VCCor GND 5.5 − − ±1.0 µA

IOZ 3-state output

OFF-state current

VI= VIHor VIL;

VO= VCCor GND

5.5 − − ±5.0 µA

ICC quiescent supply

current

VI= VCCor GND;

IO= 0

5.5 − − 80 µA

∆ICC additional supply

current per input

VI= VCC−2.1 V;

IO= 0; note 2

Notes

1. All typical values are measured at Tamb= 25°C.

2. The value of additional quiescent supply current (∆ICC) for a unit load of 1 is given here. To determine∆ICCper input,

multiply this value by the unit load coefficient per input pin: a. pin DS: 0.25

b. pins MR, SH_CP, ST_CP and OE: 1.50. Tamb=−40 to +125°C

VIH HIGH-level input

voltage

4.5 to 5.5 2.0 − − V

VIL LOW-level input

voltage

4.5 to 5.5 − − 0.8 V

VOH HIGH-level output

voltage

VI= VIHor VIL

all outputs

IO=−20µA 4.5 4.4 − − V

Q7’ standard output

IO=−4.0 mA 4.5 3.7 − − V

Qn bus driver outputs

IO=−6.0 mA 4.5 3.7 − − V

VOL LOW-level output

voltage

VI= VIHor VIL

all outputs

IO= 20µA 4.5 − − 0.1 V

Q7’ standard output

IO= 4.0 mA 4.5 − − 0.4 V

Qn bus driver outputs

IO= 6.0 mA 4.5 − − 0.4 V

ILI input leakage current VI= VCCor GND 5.5 − − ±1.0 µA

IOZ 3-state output

OFF-state current

VI= VIHor VIL;

VO= VCCor GND

5.5 − − ±10.0 µA

ICC quiescent supply

current

VI= VCCor GND;

IO= 0

5.5 − − 160 µA

∆ICC additional supply

current per input

VI= VCC−2.1 V;

IO= 0; note 2

4.5 to 5.5 − − 490 µA

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

AC CHARACTERISTICS Family 74HC

GND = 0 V; tr= tf= 6 ns; CL= 50 pF.

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

WAVEFORMS VCC (V) Tamb= 25°C

tPHL/tPLH propagation delay

SH_CP to Q7’

see Fig.7 2.0 − 52 160 ns

4.5 − 19 32 ns

6.0 − 15 27 ns

propagation delay ST_CP to Qn

see Fig.8 2.0 − 55 175 ns

4.5 − 20 35 ns

6.0 − 16 30 ns

tPHL propagation delay

MR to Q7’

see Fig.10 2.0 − 47 175 ns

4.5 − 17 35 ns

6.0 − 14 30 ns

tPZH/tPZL 3-state output enable time

OE to Qn

see Fig.11 2.0 − 47 150 ns

4.5 − 17 30 ns

6.0 − 14 26 ns

tPHZ/tPLZ 3-state output disable time

OE to Qn

see Fig.11 2.0 − 41 150 ns

4.5 − 15 30 ns

6.0 − 12 26 ns

tW shift clock pulse width

HIGH or LOW

see Fig.7 2.0 75 17 − ns

4.5 15 6 − ns

6.0 13 5 − ns

storage clock pulse width HIGH or LOW

see Fig.8 2.0 75 11 − ns

4.5 15 4 − ns

6.0 13 3 − ns

master reset pulse width LOW

see Fig.10 2.0 75 17 − ns

4.5 15 6.0 − ns

6.0 13 5.0 − ns

tsu set-up time DS to SH_CP see Fig.9 2.0 50 11 − ns

4.5 10 4.0 − ns

6.0 9.0 3.0 − ns

set-up time SH_CP to ST_CP

see Fig.8 2.0 75 22 − ns

4.5 15 8 − ns

6.0 13 7 − ns

th hold time DS to SH_CP see Fig.9 2.0 +3 −6 − ns

4.5 +3 −2 − ns

trem removal time MR to SH_CP see Fig.10 2.0 +50 −19 − ns

4.5 +10 −7 − ns

6.0 +9 −6 − ns

fmax maximum clock

pulse frequency SH_CP or ST_CP

see Figs 7 and 8 2.0 9 30 − MHz

4.5 30 91 − MHz

6.0 35 108 − MHz

Tamb=−40 to +85°C

tPHL/tPLH propagation delay

SH_CP to Q7’

see Fig.7 2.0 − − 200 ns

4.5 − − 40 ns

6.0 − − 34 ns

propagation delay ST_CP to An

see Fig.8 2.0 − − 220 ns

4.5 − − 44 ns

6.0 − − 37 ns

tPHL propagation delay

MR to Q7’

see Fig.10 2.0 − − 220 ns

4.5 − − 44 ns

6.0 − − 37 ns

tPZH/tPZL 3-state output enable time

OE to Qn

see Fig.11 2.0 − − 190 ns

4.5 − − 38 ns

6.0 − − 33 ns

tPHZ/tPLZ 3-state output disable time

OE to Qn

see Fig.11 2.0 − − 190 ns

4.5 − − 38 ns

6.0 − − 33 ns

tW shift clock pulse width

HIGH or LOW

see Fig.7 2.0 95 − − ns

4.5 19 − − ns

6.0 16 − − ns

storage clock pulse width HIGH or LOW

see Fig.8 2.0 95 − − ns

4.5 19 − − ns

6.0 16 − − ns

master reset pulse width LOW

see Fig.10 2.0 95 − − ns

4.5 19 − − ns

6.0 16 − − ns

tsu set-up time DS to SH_CP see Fig.9 2.0 65 − − ns

4.5 13 − − ns

6.0 11 − − ns

set-up time SH_CP to ST_CP

see Fig.8 2.0 95 − − ns

4.5 19 − − ns

6.0 16 − − ns

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

th hold time DS to SH_CP see Fig.9 2.0 3 − − ns

4.5 3 − − ns

6.0 3 − − ns

trem removal time MR to SH_CP see Fig.10 2.0 65 − − ns

4.5 13 − − ns

6.0 11 − − ns

fmax maximum clock

pulse frequency SH_CP or ST_CP

see Figs 7 and 8 2.0 4.8 − − MHz

4.5 24 − − MHz

6.0 28 − − MHz

Tamb=−40 to +125°C

tPHL/tPLH propagation delay

SH_CP to Q7’

see Fig.7 2.0 − − 240 ns

4.5 − − 48 ns

6.0 − − 41 ns

propagation delay ST_CP to Qn

see Fig.8 2.0 − − 265 ns

4.5 − − 53 ns

6.0 − − 45 ns

tPHL propagation delay

MR to Q7’

see Fig.10 2.0 − − 265 ns

4.5 − − 53 ns

6.0 − − 45 ns

tPZH/tPZL 3-state output enable time

OE to Qn

see Fig.11 2.0 − − 225 ns

4.5 − − 45 ns

6.0 − − 38 ns

tPHZ/tPLZ 3-state output disable time

OE to Qn

see Fig.11 2.0 − − 225 ns

4.5 − − 45 ns

6.0 − − 38 ns

tW shift clock pulse width

HIGH or LOW

see Fig.7 2.0 110 − − ns

4.5 22 − − ns

6.0 19 − − ns

storage clock pulse width HIGH or LOW

see Fig.8 2.0 110 − − ns

4.5 22 − − ns

6.0 19 − − ns

master reset pulse width LOW

see Fig.10 2.0 110 − − ns

4.5 22 − − ns

6.0 19 − − ns

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

tsu set-up time DS to SH_CP see Fig.9 2.0 75 − − ns

4.5 15 − − ns

6.0 13 − − ns

set-up time SH_CP to ST_CP

see Fig.8 2.0 110 − − ns

4.5 22 − − ns

6.0 19 − − ns

th hold time DS to SH_CP see Fig.9 2.0 3 − − ns

4.5 3 − − ns

6.0 3 − − ns

trem removal time MR to SH_CP see Fig.10 2.0 75 − − ns

4.5 15 − − ns

6.0 13 − − ns

fmax maximum clock

pulse frequency SH_CP or ST_CP

see Figs 7 and 8 2.0 4 − − MHz

4.5 20 − − MHz

6.0 24 − − MHz

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

Family 74HCT

GND = 0 V; tr= tf= 6 ns; CL= 50 pF.

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

WAVEFORMS VCC (V)

Tamb= 25°C

tPHL/tPLH propagation delay

SH_CP to Q7’

see Fig.7 4.5 − 25 42 ns

propagation delay ST_CP to Qn

see Fig.8 4.5 − 24 40 ns

tPHL propagation delay

MR to Q7’

see Fig.10 4.5 − 23 40 ns

tPZH/tPZL 3-state output enable time

OE to Qn

see Fig.11 4.5 − 21 35 ns

tPHZ/tPLZ 3-state output disable time

OE to Qn

see Fig.11 4.5 − 18 30 ns

tW shift clock pulse width

HIGH or LOW

see Fig.7 4.5 16 6 − ns

storage clock pulse width HIGH or LOW

see Fig.8 4.5 16 5 − ns

master reset pulse width LOW

see Fig.10 4.5 20 8 − ns

tsu set-up time DS to SH_CP see Fig.9 4.5 16 5 − ns

set-up time SH_CP to ST_CP

see Fig.8 4.5 16 8 − ns

th hold time DS to SH_CP see Fig.9 4.5 +3 −2 − ns

trem removal time

MR to SH_CP

see Fig.10 4.5 +10 −7 − ns

fmax maximum clock

pulse frequency SH_CP or ST_CP

see Figs 7 and 8 4.5 30 52 − MHz

Tamb=−40 to +85°C

tPHL/tPLH propagation delay

SH_CP to Q7’

see Fig.7 4.5 − − 53 ns

propagation delay ST_CP to Qn

see Fig.8 4.5 − − 50 ns

tPHL propagation delay

MR to Q7’

see Fig.10 4.5 − − 50 ns

tPZH/tPZL 3-state output enable time

OE to Qn

see Fig.11 4.5 − − 44 ns

tPHZ/tPLZ 3-state output disable time

OE to Qn

tW shift clock pulse width

HIGH or LOW

see Fig.7 4.5 20 − − ns

storage clock pulse width HIGH or LOW

see Fig.8 4.5 20 − − ns

master reset pulse width LOW

see Fig.10 4.5 25 − − ns

tsu set-up time DS to SH_CP see Fig.9 4.5 20 − − ns

set-up time SH_CP to ST_CP

see Fig.8 4.5 20 − − ns

th hold time DS to SH_CP see Fig.9 4.5 3 − − ns

trem removal time

MR to SH_CP

see Fig.10 4.5 13 − − ns

fmax maximum clock

pulse frequency SH_CP or ST_CP

see Figs 7 and 8 4.5 24 − − MHz

Tamb=−40 to +125°C

tPHL/tPLH propagation delay

SH_CP to Q7’

see Fig.7 4.5 − − 63 ns

propagation delay ST_CP to Qn

see Fig.8 4.5 − − 60 ns

tPHL propagation delay

MR to Q7’

see Fig.10 4.5 − − 60 ns

tPZH/tPZL 3-state output enable time

OE to Qn

see Fig.11 4.5 − − 53 ns

tPHZ/tPLZ 3-state output disable time

OE to Qn

see Fig.11 4.5 − − 45 ns

tW shift clock pulse width

HIGH or LOW

see Fig.7 4.5 24 − − ns

storage clock pulse width HIGH or LOW

see Fig.8 4.5 24 − − ns

master reset pulse width LOW

see Fig.10 4.5 30 − − ns

tsu set-up time DS to SH_CP see Fig.9 4.5 24 − − ns

set-up time SH_CP to ST_CP

see Fig.8 4.5 24 − − ns

th hold time DS to SH_CP see Fig.9 4.5 3 − − ns

trem removal time

MR to SH_CP

see Fig.10 4.5 15 − − ns

fmax maximum clock

pulse frequency SH_CP or ST_CP

see Figs 7 and 8 4.5 20 − − MHz

SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT

AC WAVEFORMS

handbook, full pagewidth

MSA699

tPLH tPHL

tW 1/fmax

VM VM

SH_CP input

Q7' output

tTHL tTLH

90%

10%

Fig.7 Waveforms showing the clock (SH_CP) to output (Q7’) propagation delays, the shift clock pulse width and maximum shift clock frequency.

74HC595: VM= 50%; VI= GND to VCC. 74HCT595: VM= 1.3 V; VI= GND to 3 V.

handbook, full pagewidth

MSA700

tPLH tPHL

tW

1/fmax

VM VM

VM

ST_CP input

tsu SH_CP input

Qn output

Fig.8 Waveforms showing the storage clock (ST_CP) to output (Qn) propagation delays, the storage clock pulse width and the shift clock to storage clock set-up time.

74HC595: VM= 50%; VI= GND to VCC. 74HCT595: VM= 1.3 V; VI= GND to 3 V.

handbook, full pagewidth

MLB196 th

tsu

th tsu

Q7' output SH_CP input

DS input

VM

VM

VM

Fig.9 Waveforms showing the data set-up and hold times for the DS input.

74HC595: VM= 50%; VI= GND to VCC. 74HCT595: VM= 1.3 V; VI= GND to 3 V.

The shaded areas indicate when the input is permitted to change for predictable output performance.

handbook, full pagewidth

MLB197 tPHL

tW

VM VM VM

SH_CP input

trem MR input

Q7' output

Fig.10 Waveforms showing the Master Reset (MR) pulse width, the master reset to output (Q7’) propagation delay and the master reset to shift clock (SH_CP) removal time.

74HC595: VM= 50%; VI= GND to VCC. 74HCT595: VM= 1.3 V; VI= GND to 3 V.

handbook, full pagewidth

MSA697 tPLZ

tPHZ

outputs disabled

outputs enabled 90%

10%

outputs enabled

OE input VM

tPZL

tPZH VM

VM Qn output

LOW-to-OFF OFF-to-LOW

Qn output HIGH-to-OFF OFF-to-HIGH

tr tf

90%

10%

Fig.11 Waveforms showing the 3-state enable and disable times for input OE.

74HC595: VM= 50%; VI= GND to VCC. 74HCT595: VM= 1.3 V; VI= GND to 3 V.

handbook, full pagewidth

MGK563 D.U.T

VCC VCC

VI VO

RT

RL = 1 kΩ CL 50 pF PULSE

GENERATOR

Fig.12 Test circuit for 3-state outputs.

Definitions for test circuit: RL= Load resistor.

CL= Load capacitance including jig and probe capacitance.

RT= Termination resistance should be equal to the output impedance Zo of the pulse generator.

TEST SWITCH

tPLH/tPHL open

tPLZ/tPZL VCC

PACKAGE OUTLINES

REFERENCES OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT38-4 95-01-14_03-02-13

M_H c

(e )₁ M_E A L seating plane A1 wM b₁ b₂ e D A₂ Z 16 1 9 8 E pin 1 index

b

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

UNIT _max.A 1 2 _b

1 (1) (1)

(1)

b₂ c D E e L M_H Z

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) A

min. A

max. b e1 ME w max.

1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254

2.54 7.62 8.25

7.80 10.0

8.3 0.76

4.2 0.51 3.2

inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01

0.1 0.3 0.32

0.31 0.39

0.33 0.03

0.17 0.02 0.13

X w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L

v M A

(A )3 A 8 9 1 16 y

pin 1 index

UNIT _max.A A1 A2 A3 bp c D(1) E(1) e HE L Lp Q v w y Z(1) θ

REFERENCES OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 ₈ 0 o o 0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4

SOT109-1 076E07 MS-012 99-12-27_03-02-19

0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016

0 2.5 5 mm

scale

UNIT A₁ A₂ A₃ bp c D(1) E(1) e HE L Lp Q v w y Z θ

REFERENCES OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.21

0.05 1.80 1.65 0.25

0.38 0.25

0.20 0.09

6.4 6.0

5.4

5.2 0.65 1.25

7.9 7.6

1.03 0.63

0.9 0.7

1.00 0.55

8 0 o o 0.13

0.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT338-1 99-12-27_03-02-19

(1)

wM bp

D

H_E E

Z

e

c

v M A X A

y

1 8

16 9

θ A A1

A₂

L_p Q

detail X L

(A )₃

MO-150 pin 1 index

0 2.5 5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1

A max.

UNIT A₁ A₂ A₃ b_p c D(1) _E(2) _{e H} (1)

E L Lp Q v w y Z θ

REFERENCES OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95 0.80

0.30 0.19

0.2 0.1

5.1 4.9

4.5 4.3 0.65

6.6 6.2

0.4 0.3

0.40 0.06

8 0 o o 0.13 0.1

0.2 1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75 0.50

SOT403-1 MO-153 99-12-27

03-02-18 wM

b_p D

Z

e

0.25

1 8

16 9

θ A A1

A2

Lp Q

detail X L

(A )₃ HE

E

c

v M A X A

y

0 2.5 5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

A max.

1.1

terminal 1 index area

0.5 1

A1 b Eh

UNIT e y

0.2 c REFERENCES OUTLINE VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 3.6 3.4 Dh 2.15 1.85 y1 2.6 2.4 1.15 0.85 e1 2.5 0.30 0.18 0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT763-1 - - - MO-241

-0.5 0.3 L 0.1 v 0.05 w

0 2.5 5 mm

scale

SOT763-1 DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

16 terminals; body 2.5 x 3.5 x 0.85 mm

A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 2 7 15 10 9 8 1 16 X D E C B A terminal 1 index area A C C B v M wM E(1) Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1)

02-10-17 03-01-27

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL DATA SHEET

STATUS(1)

PRODUCT

STATUS(2)(3) DEFINITION

I Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the specification in any manner without notice.

II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).

DEFINITIONS

Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definitionLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

DISCLAIMERS

Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software -described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be

communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

© Koninklijke Philips Electronics N.V. 2003 _SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax:+31 40 27 24825 For sales offices addresses send e-mail to:sales.addresses@www.semiconductors.philips.com.

VCC 4.4 to 7 V

2.7

14.4

1 :GND 2 :Vin

Reg

2 :Vin 1 :GND

29

12 14

1 4

VCC - 0.3 to + 10 V

Vin - 0.3 to + 3 V

- 0.3 to + 10 V Topr - 10 to + 60 ˚C

Tstg - 40 to + 70 ˚C

MAX.0.8

❈20±0.2

❈4.5±0.2

37 4 2 -15.4 2 -1.5 2 -1 2 -φ_3.2 ±_0.15

2-R4

2

-8

12kΩ 3 :VCC 4 :Vout

3 :VCC VCC VCC

4 :Vout

VCC

(Unit : mm)

Features

Applications

Absolute Maximum Ratings

Parameter Symbol Rating Unit

Symbol Rating Unit

Operating Supply Voltage

Outline Dimensions

Emitting portion Detecting portion

JAPAN SOLDERLESS TERMINAL MSG. CO.

made connector (S4B-ZR) The dimensions marked with_{as the dimensions of lens center position.}❈ are described

Block Diagram

Signal processing circuit

LED drive circuit _{Control circuit}

Reflective object

IR LED (Control _signal

input)

*1

*1 Open drain operation input

Supply voltage Input terminal voltage Output terminal voltage Operating temperature Storage temperature

1. Impervious to color and reflectivity of reflective object 2. High precision distance measurement output for direct

connection to microcomputer

4. Capable of changing of distance measuring range through change the optical portion (lens)

1. Sanitary sensors

2. Human body sensors for consumer products such as electric fans and air conditioners

3. Garage sensors

* PSD : Position Sensitive Detector

Light detector (PSD*)

BVO

3. Low dissipation current at OFF-state

(dissipation current at OFF-state : TYP. 3µA)

CC

(Ta=25˚C, V =5V)

■ ■

■

■

70ms

0.1ms 0.1ms

1.6ms 2ms

Note) L : Distance to reflective object

*1 Reflective object : White paper (reflectivity : 90%) *3 Vin terminal : Open drain drive input.

Conditions : Vin terminal current at Vin OFF-state : -1µA Vin terminal current at Vin ON-state : 0.3V

*2 Average dissipation current value during distance measuring operation when detecting of input signal, Vin as shown in the timing chart

Test Circuit

1. Test circuit

2. Vin input signal for measurement

1

2 3

4 Distance measuring sensor

8-bit serial output read

V signal inputin

DEC : Decimalized value of sensor output (8-bit serial)

Output terminal voltage

*1

VOL Output voltage at Low - - 0.3 V

Distance characteristics of output D L = 80cm, *1 - 75 - DEC

∆D Output change at L=80 cm to 20 cm, *1 48 58 68 DEC Dissipation current at operating ICC L = 20cm, *1, *2 - 22 35 mA at OFF-state Ioff L = 20cm, *1 - 3 8 µA Vin terminal current Ivin Vin = 0V - - 170 - 280 µA

Fig. 1 Distance Measuring Output vs. Distance to Reflective Object

20 40 60 80 100 120 160 180 200 220

140

Gray White

Distance measuring output (DEC)

White paper : KODAK made gray chart R-27, white surface (reflectivity : 90%) Gray paper : KODAK made gray chart R-27,

gray surface (reflectivity : 18%)

MSB LSB LSB

70ms or more 0.2ms or less1ms or more

1.5ms or more 1.5ms or more Power OFF Vin

Output

Fig. 3 Detection Distance vs. Illuminance

Detection distance L (cm)

Illuminance (lx)

Test Method for Anti External Disturbing Light Characteristics

Reflective object

Distance to reflective object

Sensor

Sunlight Illuminance meter

Detection distance L (cm)

Sensing range X (mm)

KODAK made white paper (reflectivity : 90%)

Sensor Emitting portion

Detecting portion White paper (reflectivity : 90%)

Reflective object

Sensing distance

0 5000 10000 15000 20000 25000 30000 0

10 20 30 40 50 60 70 80 90 100

50cm

30cm 15cm

- 100 - 50 0 50 100

0 10 20 30 40 50 60 70 80

Sensing distance : 50 cm

LM555

Timer

General Description

The LM555 is a highly stable device for generating accurate time delays or oscillation. Additional terminals are provided for triggering or resetting if desired. In the time delay mode of operation, the time is precisely controlled by one external re-sistor and capacitor. For astable operation as an oscillator, the free running frequency and duty cycle are accurately controlled with two external resistors and one capacitor. The circuit may be triggered and reset on falling waveforms, and the output circuit can source or sink up to 200mA or drive TTL circuits.

Features

n Direct replacement for SE555/NE555

n Timing from microseconds through hours

n Operates in both astable and monostable modes

n Adjustable duty cycle

n Output can source or sink 200 mA

n Output and supply TTL compatible

n Temperature stability better than 0.005% per ˚C

n Normally on and normally off output

n Available in 8-pin MSOP package

Applications

n Precision timing

n Pulse generation

n Sequential timing

n Time delay generation

n Pulse width modulation

n Pulse position modulation

n Linear ramp generator

Schematic Diagram

DS007851-1

Ordering Information

Package Part Number Package Marking Media Transport NSC Drawing

8-Pin SOIC LM555CM LM555CM Rails

M08A

LM555CMX LM555CM 2.5k Units Tape and Reel

8-Pin MSOP LM555CMM Z55 1k Units Tape and Reel

MUA08A

LM555CMMX Z55 3.5k Units Tape and Reel

8-Pin MDIP LM555CN LM555CN Rails N08E

DS007851-3 Top View

Supply Voltage +18V Power Dissipation (Note 3)

LM555CM, LM555CN 1180 mW

LM555CMM 613 mW

Operating Temperature Ranges

LM555C 0˚C to +70˚C

Storage Temperature Range −65˚C to +150˚C

(SOIC and MSOP)

Vapor Phase (60 Seconds) 215˚C

Infrared (15 Seconds) 220˚C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.

Electrical Characteristics

(Notes 1, 2)

(TA= 25˚C, VCC= +5V to +15V, unless othewise specified)

Parameter Conditions Limits Units LM555C

Min Typ Max

Supply Voltage 4.5 16 V

Supply Current V_CC= 5V, R_L=∞

VCC= 15V, RL=∞

(Low State) (Note 4)

3 10

6

15 mA

Timing Error, Monostable

Initial Accuracy 1 %

Drift with Temperature RA= 1k to 100kΩ, 50 ppm/˚C

C = 0.1µF, (Note 5)

Accuracy over Temperature 1.5 %

Drift with Supply 0.1 %/V

Timing Error, Astable

Initial Accuracy 2.25 %

Drift with Temperature RA, RB= 1k to 100kΩ, 150 ppm/˚C

C = 0.1µF, (Note 5)

Accuracy over Temperature 3.0 %

Drift with Supply 0.30 %/V

Threshold Voltage 0.667 x VCC

Trigger Voltage VCC= 15V 5 V

VCC= 5V 1.67 V

Trigger Current 0.5 0.9 µA

Reset Voltage 0.4 0.5 1 V

Reset Current 0.1 0.4 mA

Threshold Current (Note 6) 0.1 0.25 µA

Control Voltage Level VCC= 15V

VCC= 5V

9 2.6

10 3.33

11

4 V

Pin 7 Leakage Output High 1 100 nA

Pin 7 Sat (Note 7)

Output Low VCC= 15V, I7= 15mA 180 mV

Output Voltage Drop (Low) VCC= 15V

I_SINK= 10mA 0.1 0.25 V

ISINK= 50mA 0.4 0.75 V

ISINK= 100mA 2 2.5 V

ISINK= 200mA 2.5 V

VCC= 5V

ISINK= 8mA V

ISINK= 5mA 0.25 0.35 V

Output Voltage Drop (High) ISOURCE= 200mA, VCC= 15V 12.5 V

ISOURCE= 100mA, VCC= 15V 12.75 13.3 V

VCC= 5V 2.75 3.3 V

Rise Time of Output 100 ns

Fall Time of Output 100 ns

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guarguar-anteed for parameters where no limit is given, however, the typical value is a good indication of device performance.

Note 3: For operating at elevated temperatures the device must be derated above 25˚C based on a +150˚C maximum junction temperature and a thermal resistance of 106˚C/W (DIP), 170˚C/W (S0-8), and 204˚C/W (MSOP) junction to ambient.

Note 4: Supply current when output high typically 1 mA less at VCC= 5V. Note 5: Tested at VCC= 5V and VCC= 15V.

Note 6: This will determine the maximum value of RA+ RBfor 15V operation. The maximum total (RA+ RB) is 20MΩ. Note 7: No protection against excessive pin 7 current is necessary providing the package dissipation rating will not be exceeded. Note 8: Refer to RETS555X drawing of military LM555H and LM555J versions for specifications.

DS007851-4 DS007851-19

High Output Voltage vs. Output Source Current

DS007851-20

Low Output Voltage vs. Output Sink Current

DS007851-21

Low Output Voltage vs. Output Sink Current

DS007851-22

Low Output Voltage vs. Output Sink Current

DS007851-24 DS007851-25

Discharge Transistor (Pin 7) Voltage vs. Sink Current

DS007851-26

Discharge Transistor (Pin 7) Voltage vs. Sink Current

by a transistor inside the timer. Upon application of a

nega-tive trigger pulse of less than 1/3 VCCto pin 2, the flip-flop is

set which both releases the short circuit across the capacitor and drives the output high.

The voltage across the capacitor then increases

exponen-tially for a period of t = 1.1 R_AC, at the end of which time the

voltage equals 2/3 VCC. The comparator then resets the

flip-flop which in turn discharges the capacitor and drives the

output to its low state.Figure 2 shows the waveforms

gener-ated in this mode of operation. Since the charge and the threshold level of the comparator are both directly propor-tional to supply voltage, the timing internal is independent of supply.

During the timing cycle when the output is high, the further application of a trigger pulse will not effect the circuit so long as the trigger input is returned high at least 10µs before the end of the timing interval. However the circuit can be reset during this time by the application of a negative pulse to the reset terminal (pin 4). The output will then remain in the low state until a trigger pulse is again applied.

When the reset function is not in use, it is recommended that

it be connected to VCCto avoid any possibility of false

trig-gering.

Figure 3 is a nomograph for easy determination of R, C val-ues for various time delays.

ASTABLE OPERATION

If the circuit is connected as shown inFigure 4 (pins 2 and 6

connected) it will trigger itself and free run as a multivibrator.

The external capacitor charges through RA+ RBand

dis-charges through RB. Thus the duty cycle may be precisely

set by the ratio of these two resistors.

In this mode of operation, the capacitor charges and

dis-charges between 1/3 VCCand 2/3 VCC. As in the triggered

mode, the charge and discharge times, and therefore the fre-quency are independent of the supply voltage.

DS007851-5 FIGURE 1. Monostable

DS007851-6 VCC= 5V Top Trace: Input 5V/Div.

TIME = 0.1 ms/DIV. Middle Trace: Output 5V/Div. RA= 9.1kΩ Bottom Trace: Capacitor Voltage 2V/Div.

C = 0.01µF

FIGURE 2. Monostable Waveforms

DS007851-7 FIGURE 3. Time Delay

DS007851-8 FIGURE 4. Astable

The charge time (output high) is given by:

t1= 0.693 (RA+ RB) C

And the discharge time (output low) by:

t2= 0.693 (RB) C

Thus the total period is:

T = t1+ t2= 0.693 (RA+2RB) C

The frequency of oscillation is:

Figure 6 may be used for quick determination of these RC values.

The duty cycle is:

FREQUENCY DIVIDER

The monostable circuit ofFigure 1 can be used as a fre-quency divider by adjusting the length of the timing cycle. Figure 7 shows the waveforms generated in a divide by three circuit.

PULSE WIDTH MODULATOR

When the timer is connected in the monostable mode and triggered with a continuous pulse train, the output pulse width can be modulated by a signal applied to pin 5.Figure 8 shows the circuit, and in Figure 9 are some waveform examples.

DS007851-9 VCC= 5V Top Trace: Output 5V/Div.

TIME = 20µs/DIV. Bottom Trace: Capacitor Voltage 1V/Div. RA= 3.9kΩ

RB= 3kΩ

C = 0.01µF

FIGURE 5. Astable Waveforms

DS007851-10 FIGURE 6. Free Running Frequency

DS007851-11 VCC= 5V Top Trace: Input 4V/Div.

TIME = 20µs/DIV. Middle Trace: Output 2V/Div. RA= 9.1kΩ Bottom Trace: Capacitor 2V/Div.

C = 0.01µF

FIGURE 7. Frequency Divider

DS007851-12 FIGURE 8. Pulse Width Modulator

DS007851-13 VCC= 5V Top Trace: Modulation 1V/Div.

TIME = 0.2 ms/DIV. Bottom Trace: Output Voltage 2V/Div. RA= 9.1kΩ

C = 0.01µF

to the control voltage terminal. The pulse position varies with the modulating signal, since the threshold voltage and hence

the time delay is varied. Figure 11 shows the waveforms

generated for a triangle wave modulation signal.

LINEAR RAMP

When the pullup resistor, RA, in the monostable circuit is

re-placed by a constant current source, a linear ramp is

gener-ated.Figure 12 shows a circuit configuration that will perform

this function.

Figure 13 shows waveforms generated by the linear ramp. The time interval is given by:

VBE.0.6V DS007851-14

FIGURE 10. Pulse Position Modulator

DS007851-15 VCC= 5V Top Trace: Modulation Input 1V/Div.

TIME = 0.1 ms/DIV. Bottom Trace: Output 2V/Div. RA= 3.9kΩ

RB= 3kΩ

C = 0.01µF

FIGURE 11. Pulse Position Modulator

DS007851-16 FIGURE 12.

DS007851-17 VCC= 5V Top Trace: Input 3V/Div.

TIME = 20µs/DIV. Middle Trace: Output 5V/Div. R1= 47kΩ Bottom Trace: Capacitor Voltage 1V/Div.

R2= 100kΩ

RE= 2.7 kΩ

C = 0.01 µF

Thus the frequency of oscillation is

Note that this circuit will not oscillate if R_Bis greater than 1/2 RAbecause the junction of RAand RBcannot bring pin 2 down to 1/3 VCCand trigger the lower comparator. ADDITIONAL INFORMATION

Adequate power supply bypassing is necessary to protect associated circuitry. Minimum recommended is 0.1µF in par-allel with 1µF electrolytic.

Lower comparator storage time can be as long as 10µs when pin 2 is driven fully to ground for triggering. This limits the monostable pulse width to 10µs minimum.

Delay time reset to output is 0.47µs typical. Minimum reset pulse width must be 0.3µs, typical.

Pin 7 current switches within 30ns of the output (pin 3) volt-age.

DS007851-18 FIGURE 14. 50% Duty Cycle Oscillator

Small Outline Package (M) NS Package Number M08A

8-Lead (0.118” Wide) Molded Mini Small Outline Package NS Package Number MUA08A

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

National Semiconductor Corporation

Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com

National Semiconductor Europe

Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208

English Tel: +44 (0) 870 24 0 2171

Français Tel: +33 (0) 1 41 91 8790

National Semiconductor Asia Pacific Customer Response Group

Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com

National Semiconductor Japan Ltd.

Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 www.national.com

Molded Dual-In-Line Package (N) NS Package Number N08E



Devices Included in this Data Sheet:

• PIC16F83 • PIC16CR83 • PIC16F84 • PIC16CR84

• Extended voltage range devices available (PIC16LF8X, PIC16LCR8X)

High Performance RISC CPU Features:

• Only 35 single word instructions to learn • All instructions single cycle (400 ns @ 10 MHz)

except for program branches which are two-cycle • Operating speed: DC - 10 MHz clock input

DC - 400 ns instruction cycle

• 14-bit wide instructions • 8-bit wide data path

• 15 special function hardware registers • Eight-level deep hardware stack

• Direct, indirect and relative addressing modes • Four interrupt sources:

- External RB0/INT pin - TMR0 timer overflow

- PORTB<7:4> interrupt on change - Data EEPROM write complete • 1,000,000 data memory EEPROM

ERASE/WRITE cycles

• EEPROM Data Retention > 40 years

Peripheral Features:

• 13 I/O pins with individual direction control • High current sink/source for direct LED drive

- 25 mA sink max. per pin - 20 mA source max. per pin • TMR0: 8-bit timer/counter with 8-bit

programmable prescaler Device Memory Freq Max. Data

Flash RAM EEPROM

PIC16F83 512 words 36 64 10 MHz PIC16CR83 512 words 36 64 10 MHz PIC16F84 1 K-words 68 64 10 MHz PIC16CR84 1 K-words 68 64 10 MHz

F = Flash; CR = ROM

Pin Diagram

Special Microcontroller Features:

• Power-on Reset (POR) • Power-up Timer (PWRT) • Oscillator Start-up Timer (OST)

• Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation

• Code-protection

• Power saving SLEEP mode • Selectable oscillator options

• Serial In-System Programming - via two pins (ROM devices support only Data EEPROM programming)

CMOS Technology:

• Low-power, high-speed CMOS Flash/EEPROM technology

• Fully static design

• Wide operating voltage range: - Commercial: 2.0V to 6.0V - Industrial: 2.0V to 6.0V • Low power consumption:

- < 2 mA typical @ 5V, 4 MHz - 15 µA typical @ 2V, 32 kHz

- < 1 µA typical standby current @ 2V

RA1 RA0 OSC1/CLKIN OSC2/CLKOUT VDD RB7 RB6 RB5 RB4 RA2 RA3 RA4/T0CKI MCLR VSS RB0/INT RB1 RB2 RB3 •1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10

PIC16F8X

PDIP, SOIC

PIC16CR8X

PIC16F8X

8-Bit CMOS Flash/EEPROM Microcontrollers

Table of Contents

1.0 General Description ... 3 2.0 PIC16F8X Device Varieties ... 5 3.0 Architectural Overview... 7 4.0 Memory Organization ... 11 5.0 I/O Ports... 21 6.0 Timer0 Module and TMR0 Register... 27 7.0 Data EEPROM Memory... 33 8.0 Special Features of the CPU ... 37 9.0 Instruction Set Summary ... 55 10.0 Development Support ... 67 11.0 Electrical Characteristics for PIC16F83 and PIC16F84... 71 12.0 DC & AC Characteristics Graphs/Tables for PIC16F83 and PIC16F84 ... 83 13.0 Electrical Characteristics for PIC16CR83 and PIC16CR84... 85 14.0 DC & AC Characteristics Graphs/Tables for PIC16CR83 and PIC16CR84 ... 97 15.0 Packaging Information ... 99 Appendix A: Feature Improvements ... 103 Appendix B: Compatibility... 103 Appendix C: What’s New ... 104 Appendix D: What’s Changed... 104 Appendix E: PIC16C84 to PIC16F83/CR83 and PIC16F84/CR84 Conversion Considerations... 104 Appendix F: PIC16/17 Microcontrollers ... 105 Index... 115 PIC16F8X Product Identification System ... 121

To Our Valued Customers

We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time to ensure that these documents are correct. However, we realize that we may have missed a few things. If you find any information that is missing or appears in error, please use the reader response form in the back of this data sheet to inform us. We appreciate your assistance in making this a better document.

 1996 Microchip Technology Inc. DS30430B-page 3

1.0

GENERAL DESCRIPTION

The PIC16F8X is a group in the PIC16CXX family of low-cost, high-performance, CMOS, fully-static, 8-bit microcontrollers. This group contains the following devices:

• PIC16F83 • PIC16CR83 • PIC16F84 • PIC16CR84

All PIC16/17 microcontrollers employ an advanced RISC architecture. PIC16CXX devices have enhanced core features, eight-level deep stack, and multiple internal and external interrupt sources. The separate instruction and data buses of the Harvard architecture allow a 14-bit wide instruction word with a separate 8-bit wide data bus. The two stage instruction pipeline allows all instructions to execute in a single cycle, except for program branches (which require two cycles). A total of 35 instructions (reduced instruction set) are available. Additionally, a large register set is used to achieve a very high performance level. PIC16F8X microcontrollers typically achieve a 2:1 code compression and up to a 2:1 speed improvement (at 10 MHz) over other 8-bit microcontrollers in their class.

The PIC16F8X has up to 68 bytes of RAM, 64 bytes of Data EEPROM memory, and 13 I/O pins. A timer/counter is also available.

The PIC16CXX family has special features to reduce external components, thus reducing cost, enhancing system reliability and reducing power consumption. There are four oscillator options, of which the single pin RC oscillator provides a low-cost solution, the LP oscillator minimizes power consumption, XT is a standard crystal, and the HS is for High Speed crystals. The SLEEP (power-down) mode offers power saving. The user can wake the chip from sleep through several external and internal interrupts and resets.

A highly reliable Watchdog Timer with its own on-chip RC oscillator provides protection against software lock-up.

The devices with Flash program memory allow the same device package to be used for prototyping and production. In-circuit reprogrammability allows the code to be updated without the device being removed from the end application. This is useful in the development of many applications where the device may not be easily accessible, but the prototypes may require code updates. This is also useful for remote applications where the code may need to be updated (such as rate information).

Table 1-1 lists the features of the PIC16F8X, and Appendix D: list the features of all of the Microchip microcontrollers.

A simplified block diagram of the PIC16F8X is shown in Figure 3-1.

The PIC16F8X fits perfectly in applications ranging from high speed automotive and appliance motor control to low-power remote sensors, electronic locks, security devices and smart cards. The Flash/EEPROM technology makes customization of application programs (transmitter codes, motor speeds, receiver frequencies, security codes, etc.) extremely fast and convenient. The small footprint packages make this microcontroller series perfect for all applications with space limitations. Low-cost, low-power, high performance, ease of use and I/O flexibility make the PIC16F8X very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, serial communication, capture and compare, PWM functions and co-processor applications).

The serial in-system programming feature (via two pins) offers flexibility of customizing the product after complete assembly and testing. This feature can be used to serialize a product, store calibration data, or program the device with the current firmware before shipping.

1.1 Family and Upward Compatibility

Those users familiar with the PIC16C5X family of microcontrollers will realize that this is an enhanced version of the PIC16C5X architecture. Please refer to Appendix A: for a detailed list of enhancements. Code written for PIC16C5X can be easily ported to the PIC16F8X (Appendix B:).

1.2 Development Support

The PIC16CXX family is supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a low-cost development programmer and a full-featured programmer. A “C” compiler and fuzzy logic support tools are also available.

TABLE 1-1: PIC16F8X FAMILY OF DEVICES

PIC16C84 10 — 1K — 36 64 TMR0 4 13 2.0-6.0 18-pin DIP, SOIC PIC16F84(1) 10 1K — — 68 64 TMR0 4 13 2.0-6.0 18-pin DIP, SOIC PIC16CR84(1) 10 — — 1K 68 64 TMR0 4 13 2.0-6.0 18-pin DIP, SOIC PIC16F83(1) 10 512 — — 36 64 TMR0 4 13 2.0-6.0 18-pin DIP, SOIC PIC16CR83(1) 10 — — 512 36 64 TMR0 4 13 2.0-6.0 18-pin DIP, SOIC

All PIC16/17 family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect, and high I/O current capability.

All PIC16C8X family devices use serial programming with clock pin RB6 and data pin RB7. Note 1: Please contact your local sales office for availability of these devices.

Maximum Frequency of Operation (MHz)EEPROM Data Memory (bytes)Data EEPROM (bytes)Timer Module(s)Interrupt SourcesI/O Pins Voltage Range (Volts)Packages

Program Memory

Clock Memory Peripherals Features

ROM

 1996 Microchip Technology Inc. DS30430B-page 5

2.0

PIC16F8X DEVICE VARIETIES

A variety of frequency ranges and packaging options are available. Depending on application and production requirements the proper device option can be selected using the information in this section. When placing orders, please use the “PIC16F8X Product Identification System” at the back of this data sheet to specify the correct part number.

There are four device “types” as indicated in the device number.

1. F, as in PIC16F84. These devices have Flash program memory and operate over the standard voltage range.

2. LF, as in PIC16LF84. These devices have Flash program memory and operate over an extended voltage range.

3. CR, as in PIC16CR83. These devices have ROM program memory and operate over the standard voltage range.

4. LCR, as in PIC16LCR84. These devices have ROM program memory and operate over an extended voltage range.

When discussing memory maps and other architectural features, the use of F and CR also implies the LF and

LCR versions.

2.1 Electrically Erasable Devices

These devices are offered in the lower cost plastic package, even though the device can be erased and reprogrammed. This allows the same device to be used for prototype development and pilot programs as well as production.

A further advantage of the electrically erasable version is that they can be erased and reprogrammed in-circuit, or by device programmers, such as Microchip's PICSTART Plus or PRO MATE II programmers.

2.2 Quick-Turnaround-Production (QTP) Devices

Microchip offers a QTP Programming Service for factory production orders. This service is made available for users who choose not to program a medium to high quantity of units and whose code patterns have stabilized. The devices have all Flash locations and configuration options already pro-grammed by the factory. Certain code and prototype verification procedures do apply before production shipments are available.

For information on submitting a QTP code, please contact your Microchip Regional Sales Office.

2.3 Serialized

Quick-Turnaround-Production (SQTP ) Devices

Microchip offers the unique programming service where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential.

Serial programming allows each device to have a unique number which can serve as an entry-code, password or ID number.

For information on submitting a SQTP code, please contact your Microchip Regional Sales Office.

2.4 ROM Devices

Some of Microchip’s devices have a corresponding device where the program memory is a ROM. These devices give a cost savings over Microchip’s traditional user programmed devices (EPROM, EEPROM). ROM devices (PIC16CR8X) do not allow serialization information in the program memory space. The user may program this information into the Data EEPROM. For information on submitting a ROM code, please contact your Microchip Regional Sales Office.

 1996 Microchip Technology Inc. DS30430B-page 7

3.0

ARCHITECTURAL OVERVIEW

The high performance of the PIC16CXX family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC16CXX uses a Harvard architecture. This architecture has the program and data accessed from separate memories. So the device has a program memory bus and a data memory bus. This improves bandwidth over traditional von Neumann architecture where program and data are fetched from the same memory (accesses over the same bus). Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. PIC16CXX opcodes are 14-bits wide, enabling single word instructions. The full 14-bit wide program memory bus fetches a 14-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions (Example 3-1). Consequently, all instructions execute in a single cycle (400 ns @ 10 MHz) except for program branches.

The PIC16F83 and PIC16CR83 address 512 x 14 of program memory, and the PIC16F84 and PIC16CR84 address 1K x 14 program memory. All program mem-ory is internal.

The PIC16CXX can directly or indirectly address its register files or data memory. All special function registers including the program counter are mapped in the data memory. An orthogonal (symmetrical) instruction set makes it possible to carry out any oper-ation on any register using any addressing mode. This symmetrical nature and lack of ‘special optimal situations’ make programming with the PIC16CXX simple yet efficient. In addition, the learning curve is reduced significantly.

PIC16CXX devices contain an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the working register (W register), and the other operand is a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register.

Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF

instructions for examples.

A simplified block diagram for the PIC16F8X is shown in Figure 3-1, its corresponding pin description is shown in Table 3-1.

FIGURE 3-1: PIC16F8X BLOCK DIAGRAM

Flash/ROM Program Memory

Program Counter 13

Program Bus 14

Instruction reg

8 Level Stack (13-bit)

Direct Addr

8

Instruction Decode & Control

Timing Generation

OSC2/CLKOUT OSC1/CLKIN

Power-up Timer Oscillator Start-up Timer

Power-on Reset Watchdog

Timer

MCLR VDD, VSS

W reg ALU

MUX

I/O Ports TMR0

STATUS reg FSR reg

Indirect Addr

RA3:RA0 RB7:RB1 RA4/T0CKI EEADR EEPROM Data Memory

64 x 8 EEDATA

Addr Mux

RAM Addr RAM

File Registers

EEPROM Data Memory Data Bus 8

5

7

7 PIC16F84/CR84

1K x 14 PIC16F83/CR83

512 x 14

PIC16F83/R83/84 36 x 8 PIC16F84/CR84

68 x 8

TABLE 3-1: PIC16F8X PINOUT DESCRIPTION

Pin Name DIP No.

SOIC No.

I/O/P Type

Buffer

Type Description

OSC1/CLKIN 16 16 I ST/CMOS (3) Oscillator crystal input/external clock source input.

OSC2/CLKOUT 15 15 O — Oscillator crystal output. Connects to crystal or resonator in crystal oscillator mode. In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate.

MCLR 4 4 I/P ST Master clear (reset) input/programming voltage input. This pin is an active low reset to the device.

PORTA is a bi-directional I/O port.

RA0 17 17 I/O TTL

RA1 18 18 I/O TTL

RA2 1 1 I/O TTL

RA3 2 2 I/O TTL

RA4/T0CKI 3 3 I/O ST Can also be selected to be the clock input to the TMR0 timer/counter. Output is open drain type.

PORTB is a bi-directional I/O port. PORTB can be software pro-grammed for internal weak pull-up on all inputs.

RB0/INT 6 6 I/O TTL/ST (1) _{RB0/INT can also be selected as an external interrupt pin.}

RB1 7 7 I/O TTL

RB2 8 8 I/O TTL

RB3 9 9 I/O TTL

RB4 10 10 I/O TTL Interrupt on change pin. RB5 11 11 I/O TTL Interrupt on change pin.

RB6 12 12 I/O TTL/ST (2) _{Interrupt on change pin. Serial programming clock.}

RB7 13 13 I/O TTL/ST (2) _{Interrupt on change pin. Serial programming data.}

VSS 5 5 P — Ground reference for logic and I/O pins. VDD 14 14 P — Positive supply for logic and I/O pins. Legend: I= input O = output I/O = Input/Output P = power

— = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt.

2: This buffer is a Schmitt Trigger input when used in serial programming mode.

BAB I

PENDAHULUAN

Dalam bab ini dibahas mengenai latar belakang, identifikasi masalah, tujuan, pembatasan masalah, spesifikasi alat dan sistematika pembahasan.

I.1 Latar Belakang

Teknik pengendalian terus berkembang mengikuti laju perkembangan teknologi yang saat ini menuntut adanya ketepatan dan kecepatan yang semakin tinggi. Ketepatan dan kecepatan yang baik dari hasil kerja suatu alat akan memberikan hasil yang mendekati atau bahkan sama dengan hasil yang kita inginkan. Dalam hal ini akan dibahas mengenai masalah pemboran. Untuk melakukan pemboran terhadap suatu bahan dengan kedalaman lubang bor yang berbeda-beda sesuai dengan permintaan, akan terasa sulit bila dikerjakan secara manual. Apalagi jika adanya permintaan yang banyak maka kerja manual membutuhkan waktu yang lama.

Berdasarkan hal tersebut, telah dirancang dan direalisasikan sebuah alat pemboran otomatis sesuai dengan kedalaman yang diinginkan. Kedalaman lubang bor yang diinginkan dan panjang mata bor menjadi masukan yang diberikan melalui penekanan tombol pada papan ketik. Mekanisme kerja alat dikendalikan oleh sebuah mikrokontroler PIC16F84.

I.2 Identifikasi Masalah

Bagaimana merancang dan merealisasikan alat pemboran dengan kedalaman yang diinginkan menggunakan modul sensor inframerah GP2D02 dan mikrokontroler PIC16F84 ?

BAB I PENDAHULUAN ₂

I.3 Tujuan

Merancang dan merealisasikan alat pemboran dengan kedalaman yang diinginkan dengan menggunakan modul sensor inframerah GP2D02 dan mikrokontroler PIC16F84.

I.4 Pembatasan Masalah

Perancangan dan realisasi alat pemboran kedalaman ini dibatasi pada :

• Posisi atau koordinat titik yang akan dibor tidak dibahas.

• Panjang dan lebar benda yang ingin di bor minimal 10 cm serta tingginya maksimal 8 cm.

• Kedalaman lubang bor maksimal 8 cm dan panjang mata bor maksimal 11 cm.

• Sensor dengan resolusi 1 cm.

• Benda yang di bor adalah kayu lunak (Borneo) dan kayu keras (Kamper).

I.5 Spesifikasi Alat

Spesifikasi alat yang digunakan dalam perancangan dan realisasi alat pemboran kedalaman antara lain :

• Bor AC 220 Volt • Motor DC 12 Volt

• Mikrokontroler PIC16F84

• Modul sensor inframerah GP2d02 • Papan ketik 4x3

BAB I PENDAHULUAN ₃

I.6 Sistematika Pembahasan

Sistematika pembahasan menguraikan penjelasan dari tiap-tiap bab seperti dibawah ini.

Bab I Pendahuluan

Bab ini berisi penjelasan mengenai latar belakang, identifikasi masalah, tujuan penelitian, pembatasan masalah, spesifikasi alat dan sistematika penulisan.

Bab II Teori Penunjang

Bab ini berisi pembahasan mengenai pengendali mikro PIC16F84, motor DC dan modul sensor inframerah GP2D02.

Bab III Perancangan dan Realisasi

Bab ini berisi perancangan dan realisasi perangkat keras dan perangkat lunak alat pemboran kedalaman.

Bab IV Pengujian Alat

Bab ini berisi penjelasan mengenai hasil pengujian terhadap perangkat keras dan perangkat lunak alat serta pengujian alat secara keseluruhan. Bab V Kesimpulan dan Saran

Bab ini berisi kesimpulan dari hasil pengujian serta saran-saran untuk pengembangan lebih lanjut.

BAB V

KESIMPULAN DAN SARAN

Bab ini akan membahas kesimpulan dari hasil pengujian dan saran-saran untuk pengembangan lebih lanjut.

V.1 KESIMPULAN

Berdasarkan pengujian yang telah dilakukan maka dapat disimpulkan : 1. Alat pemboran kedalaman telah berhasil direalisasikan dengan menggunakan

modul sensor inframerah GP2D02 sebagai sensor jarak (kedalaman).

2. Semakin besar diameter mata bor akan menyebabkan kesalahan hasil bor yang semakin besar pula. Hal ini disebabkan karena jika menggunakan mata bor dengan diameter yang semakin besar akan mengakibatkan semakin berkurangnya kemampuan penetrasi mata bor terhadap benda (kayu) pada saat proses pemboran. Sehingga motor akan terhenti sebelum proses pemboran selesai.

3. Pengaruh jenis kayu yang di bor sangat kecil. Hal ini ditandai dengan selisih persentase kesalahan dari pemboran terhadap kedua jenis kayu (Borneo dan Kamper) tidak mencapai 0,5 %.

4. Resolusi sensor untuk jarak deteksi: - 10,0 cm s.d 13,9 cm adalah 1 mm - 14,0 cm s.d 17,9 cm adalah 2 mm - 18,0 cm s.d 20,9 cm adalah 3 mm - 21,0 cm s.d 35,9 cm adalah 5 mm - 36,0 cm s.d 80,0 cm adalah 10 mm.

5. Persentase kesalahan rata-rata pemboran kedalaman terhadap : ¾ Kayu Borneo

- Panjang mata bor 10 cm dan diameter 4,5 mm : 9,54 %. - Panjang mata bor 10 cm dan diameter 5,0 mm : 9,64 %.

BAB V KESIMPULAN DAN SARAN

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- Panjang mata bor 10 cm dan diameter 6,5 mm : 25,10 %. ¾ Kayu Kamper

- Panjang mata bor 10 cm dan diameter 4,5 mm : 9,99 %. - Panjang mata bor 10 cm dan diameter 5,0 mm : 9,88 %. - Panjang mata bor 10 cm dan diameter 6,5 mm : 25, 34 %.

6. Kesalahan disebabkan oleh adanya daerah mati (dead zone) pada sistem mekanik alat pemboran yang tersusun dari gigi dan rantai.

V.2 SARAN

Saran-saran dalam Tugas Akhir ini adalah :

1. Untuk pengembangan lebih lanjut, dapat ditambahkan pengaturan posisi atau koordinat benda yang ingin dibor.

2. Adanya perbaikan sistem mekanik alat pemboran kedalaman agar dapat mencapai hasil bor yang diinginkan.

3. Dapat menggunakan motor DC yang berdaya lebih besar untuk mengangkat dan menurunkan mesin bor sehingga akan didapatkan kestabilan yang baik dalam melakukan proses pemboran kedalaman.