MEMS Handling Instructions ESD Considerations
MPU-6000MPU-6050 Product Specification
Document Number: PS-MPU-6000A-00 Revision: 3.4
Release Date: 08192013
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Temperature Set Points Corresponding to Reflow Profile Above Step Setting
CONSTRAINTS Temp °C
Time sec Max. Rate °Csec
A T
room
25
B T
Smin
150
C T
Smax
200 60 t
BC
120 D
T
Liquidus
217 r
TLiquidus-TPmax
3 E
T
Pmin [255°C, 260°C]
255 r
TLiquidus-TPmax
3 F
T
Pmax [ 260°C, 265°C]
260 t
AF
480 r
TLiquidus-TPmax
3 G
T
Pmin [255°C, 260°C]
255 10 t
EG
30 r
TPmax-TLiquidus
4 H
T
Liquidus
217 60 t
DH
120 I
T
room
25
Notes: Customers must never exceed the Classification temperature T
Pmax
= 260°C. All temperatures refer to the topside of the QFN package, as measured on the package body surface.
Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use
lead-free solders that have lower specified temperature profiles Tp
max
~ 235°C. Also use lower ramp-up and ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we
used for qualification, as these represent the maximum tolerable ratings for the device.
11.5 Storage Specifications The storage specification of the MPU-60X0 conforms to IPCJEDEC J-STD-020D.1 Moisture Sensitivity
Level MSL 3.
Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: 40°C and 90 RH After opening moisture-sealed bag
168 hours -- Stora ge conditions: ambient ≤30°C at 60RH