MEMS Handling Instructions ESD Considerations

MPU-6000MPU-6050 Product Specification Document Number: PS-MPU-6000A-00 Revision: 3.4 Release Date: 08192013 46 of 52 Temperature Set Points Corresponding to Reflow Profile Above Step Setting CONSTRAINTS Temp °C Time sec Max. Rate °Csec A T room 25 B T Smin 150 C T Smax 200 60 t BC 120 D T Liquidus 217 r TLiquidus-TPmax 3 E T Pmin [255°C, 260°C] 255 r TLiquidus-TPmax 3 F T Pmax [ 260°C, 265°C] 260 t AF 480 r TLiquidus-TPmax 3 G T Pmin [255°C, 260°C] 255 10 t EG 30 r TPmax-TLiquidus 4 H T Liquidus 217 60 t DH 120 I T room 25 Notes: Customers must never exceed the Classification temperature T Pmax = 260°C. All temperatures refer to the topside of the QFN package, as measured on the package body surface. Production Reflow: Check the recommendations of your solder manufacturer. For optimum results, use lead-free solders that have lower specified temperature profiles Tp max ~ 235°C. Also use lower ramp-up and ramp-down rates than those used in the qualification profile. Never exceed the maximum conditions that we used for qualification, as these represent the maximum tolerable ratings for the device. 11.5 Storage Specifications The storage specification of the MPU-60X0 conforms to IPCJEDEC J-STD-020D.1 Moisture Sensitivity Level MSL 3. Calculated shelf-life in moisture-sealed bag 12 months -- Storage conditions: 40°C and 90 RH After opening moisture-sealed bag 168 hours -- Stora ge conditions: ambient ≤30°C at 60RH

11.6 Package Marking Specification

INVENSENSE MPU6000 X X X X X X-X X X X Y Y W W X Lot traceability code Foundry code Package Vendor Code Rev Code Y Y = Year Code W W = Work Week TOP VIEW Part number INVENSENSE MPU6050 X X X X X X-X X X X Y Y W W X TOP VIEW Package Marking Specification MPU-6000MPU-6050 Product Specification Document Number: PS-MPU-6000A-00 Revision: 3.4 Release Date: 08192013 47 of 52

11.7 Tape Reel Specification

Tape Dimensions Reel Outline Drawing Reel Dimensions and Package Size PACKAGE SIZE REEL mm L V W Z 4x4 330 102

12.8 2.3