Index of /intel-research/silicon

I DF M a nufa c t uring
U pda t e
Brian L. Harrison
Corporate Vice President
General Manager
Fab/Sort Manufacturing
September 16, 2003

I nt e l’s M a nufa c t uring
Le a de rship
Scale

y Scale:
– Leading edge capacity, investment, & people

Agility

y Agility:
– Customer Responsiveness

Operational

Excellence

y Operational Excellence:
– Disciplined execution & continuous improvement

2

Scale

I nt e l’s M a nufa c t uring
Le a de rship
y Scale:
– Leading edge capacity, investment capability & people

3

Scale

I nt e l’s 3 0 0 m m Fa b Sit e s

Ireland

Fab 24
Oregon

D1C/D1D
New Mexico

Fab 11X

90nm
65nm
Dev

–Arizona Fab 12 announced as next
300mm fab for 65nm

4

Scale

I nt e l’s 3 0 0 m m fa bs

• D1C (OR)
• 130nm production running (yields > 200mm)
• 90nm process validated and shipping pre-production samples
• Fab 11X (NM)
• 130nm production running (yields > 200mm)
• 90nm tools & process in checkout (on track); production in Q4
• Fab 24 (IR)
• 90nm facility ready; installing tools (on track); production in
2004
• D1D (OR)
• 65nm facility and tools online; development underway (for
production in 2005)
• Fab 24 (IR) & Fab 12C (Arizona) are next in line for 65nm
production (specific schedule TBD)

5

I nt e l’s M a nufa c t uring
Le a de rship

Agility

y Scale:
– Leading edge capacity, investment capability & people

y Agility:
– Customer Responsiveness

6

N e w T e c hnology Ra m p Le a de rship

Agility

1 3 0 nm M a nufa c t uring Ca pa c it y
wspw
1 3 0 nm

Proc e ss
(3 0 0 m m )

Done
Done

F11X

1 3 0 nm
Proc e ss

Done Done
Done
Done Done
D2 F22

F20

F17 D1C

Other. 2

Other. 1

D2

Other. 3
0
Q1

Q2

Q3

2001

Q4

Q1

Q2

Q3

2002

Q4

Q1

Q2

Q3

Q4

2003
Intel estimates and public information
7

Agility

9 0 nm c a pa c it y ra m p
Ramping 90nm faster with only Three 300mm fabs!

Intel 0.13um

F24

(200mm
Equivalent)

WSPW

Intel 90nm

F11X

D1C

F11X
D1C

Q

Q+1

Q+2

Q+3

Q+4

Q+5

Q+6

Q+7

(Quarter in Ramp)

**Source: Intel Estimates

8

I nt e l’s M a nufa c t uring
Le a de rship

Operational
Excellence

y Scale:
– Leading edge capacity, investment capability & people

y Agility:
– Customer Responsiveness

y Operational Excellence:
– Disciplined execution & continuous improvement

9

Log (Die Yield)

Operational
Excellence

I nt e l Y ie ld M a t c hing T hrough
Copy Ex a c t ly

0.5 µm
(3 fabs)

0.25 µ m
(3 fabs)

0.35 µm
(3 fabs)

180 nm

130 nm

(5 fabs)

(4 fabs)

Month

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Y ie ld T re nd
0.18µm
200mm

0.13µm
200mm

0.13µm
300mm

90nm
300mm

Defect
Density
(log scale)

1997

1998

1999

2000

2001

2002

2003

2004

90 nm defect reduction trend - our fastest ever
90 nm yields are now at HVM levels
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Operational
Excellence

Copy Ex a c t ly! M e t hod
Product:

• Matching At All Levels
• Same Physical Inputs
• Statistically Matched
Responses (Outputs)

• Keeping Matched
•
•
•
•

Coordinated Changes
Audits
Process Control System
Joint Fab Mgmt Structure

-Yield
-Reliability

Module:
-CD’s
-Visual

-SEM
-Electrical

Equipment/Process:
-Etch/Dep Rates
-Particles

-Thicknesses
-Film Comp

Physical Inputs:
-Recipes
-Facilities

-Chemicals
-Gases

-Clean room
-Equipment

Better
Better Quality
Quality and
and Faster
Faster Improvements
Improvements
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Sum m a ry
y Intel’s manufacturing leadership (through scale,
agility, and operational excellence) will enable a
rapid transition to our 90nm products
y 300mm capacity is coming on-line rapidly to support
Intel’s microprocessor roadmap
y Intel’s 90nm technology ramp is underway and on
track

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14

Fa b1 1 X 9 0 nm St a t us
Inline Monitors

Monitor 4

Monitor 3

Monitor 2

Full Loop
Short route 1
Short route 2
D1C Mean
D1C Mean + 1.5s

Monitor 1

Scale

–All in-line monitors in Fab 11X looking
healthy: Technology is ready

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