Acceptable – Class 1,2,3 • Parts and components are mounted such that they do not
obstruct solder flow onto the primary side solder destination side lands of plated-through holes required to be soldered.
Process Indicator – Class 2 Defect – Class 3
• Parts and components obstruct solder flow onto the primary side solder destination side lands of plated-through holes
required to be soldered.
Defect – Class 1,2,3 • Parts and components are mounted such that they violate
minimum electrical clearance.
2 1
Figure 7-22
1. Insulating washer 2. Spacer
1 2
3
4
Figure 7-23
1. Hard mount 2. Air
3. Component body 4. Solder
1 2
3
4
Figure 7-24
1. Nonmetal 2. Mounting hardware
3. Component case 4. Conductive pattern
7.1.4 Component Mounting – Hole Obstruction
7-12 IPC-A-610F
July 2014
These criteria are applicable to Dual-in-Line Packages DIP, Single-in-Line Packages SIP and sockets.
Note: In some cases a heat sink may be located between the component and the printed board; in these cases other criteria may be specified.
Target – Class 1,2,3 • Standoff step on all leads rests on the land.
• Lead protrusion meets requirements, see 7.3.3 and 7.4.3.
Acceptable – Class 1,2,3 • Amount of tilt is limited by minimum lead protrusion and
height requirements.
Figure 7-25
Figure 7-27 Figure 7-26
Figure 7-28
Figure 7-29
7.1.5 Component Mounting – DIPSIP Devices and Sockets
7-13 IPC-A-610F
July 2014
Defect – Class 1,2,3 • Tilt of the component exceeds maximum component height
limits. • Lead protrusion does not meet acceptance requirements
due to tilt of component.
Figure 7-30
Figure 7-31
Figure 7-32
7.1.5 Component Mounting – DIPSIP Devices and Sockets cont.
7-14 IPC-A-610F
July 2014
Target – Class 1,2,3 • Component is perpendicular and base is parallel to board.
• Clearance between base of component and board surface land is between 0.3 mm [0.01 in] and 2 mm [0.08 in].
Acceptable – Class 1,2,3 • Component tilt does not violate minimum electrical clear-
ance, Figure 7-34-C. Acceptable – Class 1
Process Indicator – Class 2,3 • Space between component base and board surfaceland is
less than 0.3 mm [0.01 in] or more than 2 mm [0.08 in], see 7.1.4.
Defect – Class 1,2,3 • Violates minimum electrical clearance.
Note: Some components cannot be tilted due to mating requirements with enclosures or panels, for example toggle
switches, potentiometers, LCDs, and LEDs.
Figure 7-33
C
Figure 7-34
7.1.6 Component Mounting – Radial Leads – Vertical
7-15 IPC-A-610F
July 2014
Spacers used for mechanical support or to compensate for component weight need to be in full contact with both component and board surface.
Target – Class 1,2,3 • Spacer is in full contact with both component and board.
• Lead is properly formed.
Acceptable Supported Holes – Class 1,2 Process Indicator Supported Holes – Class 3
Defect Unsupported Holes – Class 1,2,3 • Spacer is not in full contact with component and board.
1 2
Figure 7-35
1. Spacer 2. Contact
