Spacers used for mechanical support or to compensate for component weight need to be in full contact with both component and board surface.
Target – Class 1,2,3 • Spacer is in full contact with both component and board.
• Lead is properly formed.
Acceptable Supported Holes – Class 1,2 Process Indicator Supported Holes – Class 3
Defect Unsupported Holes – Class 1,2,3 • Spacer is not in full contact with component and board.
1 2
Figure 7-35
1. Spacer 2. Contact
Figure 7-36
Figure 7-37
7.1.6.1 Component Mounting – Radial Leads – Vertical – Spacers
7-16 IPC-A-610F
July 2014
Acceptable Supported Holes – Class 1 Process Indicator Supported Holes – Class 2
Defect Supported Holes – Class 3 Defect Unsupported Holes – Class 1,2,3
• Spacer is not in contact with component and board, Figures 7-39-A.
• Lead is improperly formed, Figure 7-39-B. Defect – Class 1,2,3
• Spacer is inverted, Figure 7-39-C.
A C
B
Figure 7-39 Figure 7-38
7.1.6.1 Component Mounting – Radial Leads – Vertical – Spacers cont.
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July 2014
Target – Class 1,2,3 • The component body is in flat contact with the board’s
surface. • Bonding material is present, if required, see 7.2.2.
Acceptable – Class 1,2,3 • Component in contact with board on at least 1 side andor
surface.
Note: When documented on an approved assembly drawing, a component may be either side mounted or end mounted.
The body may need to be bonded or otherwise secured to the board to prevent damage when vibration and shock forces
are applied.
Defect – Class 1,2,3 • Unbonded component body not in contact with mounting
surface. • Bonding material not present if required.
Figure 7-40
Figure 7-41
Figure 7-42
7.1.7 Component Mounting – Radial Leads – Horizontal
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July 2014
These criteria apply to soldered connectors. For connector pin criteria see 4.3. For connector damage criteria see 9.5. Connector modulepin misalignment, defined in this section, is to be measured at the connector lead-in areahole for receptacles
or at the pin tip for pin headers. In cases where an assembly connector is composed of 2 or more identical connector modules, modules manufactured by differ-
ent suppliers
shall not be mixed.
Target – Class 1,2,3 • Connector is flush with board.
• Lead protrusion meets requirements. • Board lock if equipped is fully insertedsnapped into the
board.
Figure 7-44 Figure 7-43
7.1.8 Component Mounting – Connectors
7-19 IPC-A-610F
July 2014
Acceptable – Class 1,2,3 • Board lock is fully insertedsnapped through the board.
• Any tilt or misalignment, provided: – Minimum lead protrusion is met.
– Maximum height requirements are not exceeded. – Mates correctly.
Defect – Class 1,2,3 • Will not mate when used in application due to angle or
misalignment. • Component violates height requirements.
• Board lock is not fully insertedsnapped into board. • Lead protrusion does not meet acceptance requirements.
Note: A trial mating of connector to connector or to assembly may be required to assure the connectors meet form, fit and
function requirement.
Figure 7-45
Figure 7-46
Figure 7-47
7.1.8 Component Mounting – Connectors cont.
7-20 IPC-A-610F
July 2014
These criteria are applicable to right angle soldered connectors with pin spacing ≥2.5 mm [0.1 in]. Target – Class 1,2,3
• Connector is mounted flush with the surface of the board, see Figure 7-48-A.
• All modules of a multi-part connector are aligned and are mounted flush to adjoining modules, see Figure 7-48-B.
Acceptable – Class 1 • Connector spacing does not affect mating of connector with assembling
requirements, e.g., face plates, bracket, mating connector, etc. Acceptable – Class 2,3
• Connector-to-board spacing is equal to or less than 0.13 mm [0.005 in] not shown.
• Maximum misalignment is less than 0.25 mm [0.01 in] across the con- tact openings of all connectors in the connector lineup, see Figure 7-50.
Defect – Class 1,2,3 • Connector spacing affects mating of connector with assembling require-
ments, e.g., face plates, bracket, mating connector, etc. Defect – Class 2,3
• Connector-to-board spacing is greater than 0.13 mm [0.005 in] not shown.
• Maximum misalignment Figure 7-1-A is greater than 0.25 mm [0.01 in] across the faces contact openings of all modules connectors in the
connector lineup.
Figure 7-48
Figure 7-51 Figure 7-49
Figure 7-50
7.1.8.1 Component Mounting – Connectors – Right Angle
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July 2014
These criteria are applicable to vertical shrouded pin headers and vertical receptacle connectors that are 2 mm - 2.54 mm [0.08 - 0.1 in] pin spacing.
Target – Class 1,2,3 • Connector is mounted flush with the surface of the board.
• All modules of a multi-part connector are aligned and are mounted flush to adjoining modules not shown.
Acceptable – Class 1 • Connector spacing does not affect mating of connector with
assembling requirements, e.g., face plates, bracket, mating connector, etc.
Acceptable – Class 2,3 • Connector-to-board spacing is equal to or less than 0.13
mm [0.005 in] not shown. • Individual connectormodules contact openings, requiring
alignment, are equal to, or less than, 0.25 mm [0.01 in], with adjacent modules not shown.
• Maximum misalignment between any 2 modulespins in the connector lineup is less than 0.25 mm [0.01 in] not shown.
Defect – Class 1,2,3 • Connector spacing affects mating of connector with assem-
bling requirements, e.g., face plates, bracket, mating con- nector, etc.
Defect – Class 2,3 • Connector-to-board spacing is greater than 0.13 mm [0.005
in], see Figure 7-53. • Maximum misalignment between any 2 modulespins in the
connector lineup is greater than 0.25 mm [0.01 in] not shown.
Figure 7-52
Figure 7-53
7.1.8.2 Component Mounting – Connectors – Vertical Shrouded Pin Headers and Vertical Receptacle Connectors
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July 2014
Where a potential for shorting violation of minimum electrical clearance exists between conductive component bodies, at least 1 of the bodies shall be protected by an insulator.
Target – Class 1,2,3 • Uninsulated metallic component insulated from underlying
circuitry with insulating material. • Uninsulated metallic clips and holding devices used to
secure components insulated from underlying circuitry with insulating material.
1 2
3
3
4
Figure 7-54
1. Conductive patterns 2. Metallic mounting clip
