Target – Class 1,2,3 • There is 100 fill.
Acceptable – Class 2 • Minimum vertical fill of 50 or 1.2 mm [0.05 in] for compo-
nents with 14 or more leads not shown. • Component lead is discernible in the solder source side of
the solder connection. Acceptable – Class 1,2,3
• Minimum 75 fill. A maximum of 25 total depression, including both secondary and primary sides is permitted.
Figure 7-83
1 2
3
Figure 7-85
1. Vertical fill meets requirements of Table 7-4 2. Solder destination side
3. Solder source side
Figure 7-84
7.3.5.1 Supported Holes – Solder – Vertical Fill A
7-41 IPC-A-610F
July 2014
Defect – Class 2 • Vertical fill of hole is less than 75 for component with less
than 14 leads. • Vertical fill of hole is less than 50 or 1.2 mm [0.05 in],
whichever is less, for component with 14 leads or more. Defect – Class 3
• Vertical fill of hole is less than 75.
Note: Less than 100 solder fill may not be acceptable in some applications, e.g., thermal shock, electrical perfor-
mance. The user is responsible for identifying these situations to the manufacturer.
Figure 7-86
7.3.5.1 Supported Holes – Solder – Vertical Fill A cont.
7-42 IPC-A-610F
July 2014
Target – Class 1,2,3 • 360° wetting present on lead and barrel.
Not Specified – Class 1 Acceptable – Class 2
• Minimum 180° wetting present on lead and barrel, see Fig- ure 7-88.
Acceptable – Class 3 • Minimum 270° wetting present on lead and barrel, see Fig-
ure 7-89.
Figure 7-87
Figure 7-88
Figure 7-89
7.3.5.2 Supported Holes – Solder – Solder Destination Side – Lead to Barrel B
7-43 IPC-A-610F
July 2014
Defect – Class 2 • Less than 180° wetting on lead or barrel.
Defect – Class 3 • Less than 270° wetting on lead or barrel.
Figure 7-90
Figure 7-91
7.3.5.2 Supported Holes – Solder – Solder Destination Side – Lead to Barrel B cont.
7-44 IPC-A-610F
July 2014
Acceptable – Class 1,2,3 • The land area does not need to be wetted with solder on the
solder destination side.
Figure 7-92
7.3.5.3 Supported Holes – Solder – Solder Destination Side – Land Area Coverage C
7-45 IPC-A-610F
July 2014
Acceptable – Class 1,2 • Minimum 270° fillet and wetting lead, barrel and termination
area. Acceptable – Class 3
• Minimum 330° fillet and wetting lead, barrel and termination area not shown.
Defect – Class 1,2,3 • Does not meet requirements of Table 7-4.
Figure 7-93
Figure 7-94
7.3.5.4 Supported Holes – Solder – Solder Source Side – Lead to Barrel D
7-46 IPC-A-610F
July 2014
Target – Class 1,2,3 • Land area completely covered on the solder source side.
Acceptable – Class 1,2,3 • Minimum 75 of land area covered with wetted solder on
the solder source side, see Figure 7-97. Defect – Class 1,2,3
• Does not meet requirements of Table 7-4.
Figure 7-96 Figure 7-95
Figure 7-97
7.3.5.5 Supported Holes – Solder – Solder Source Side – Land Area Coverage E
7-47 IPC-A-610F
July 2014
Solder in the bend radius is not cause for rejection provided the lead is properly formed and the topside bend radius is discernible.
Acceptable – Class 1,2,3 • Solder in lead bend area does not contact the component
body. • Solder does not obscure the stress relief bend of through-
hole components.
Defect – Class 1,2,3 • Solder in lead bend area contacts the component body.
• Solder that obscures the stress relief bend of through-hold components.
Figure 7-98
Figure 7-99
7.3.5.6 Supported Holes – Solder Conditions – Solder in Lead Bend
7-48 IPC-A-610F
July 2014
Acceptable – Class 1,2,3 • Solder does not touch the component body or end seal.
Defect – Class 1,2,3 • Solder contacts the component body or end seal. Excep-
tion, see 7.3.5.8. • Solder obscures the stress relief bend.
Figure 7-101 Figure 7-100
Figure 7-102
7.3.5.7 Supported Holes – Solder Conditions – Touching Through-Hole Component Body
7-49 IPC-A-610F
July 2014
Target – Class 1,2,3 • There is 1.2 mm [0.05 in] separation between the coating
meniscus and the solder fillet.
Acceptable – Class 1 • Components with a coating meniscus can be mounted with
the meniscus into the solder provided: – 360° wetting lead to land on the solder source side.
– Lead coating meniscus is not discernible within the con- nection on the secondary side.
Acceptable – Class 2,3 • Coating meniscus is not in the plated-through hole and
there is discernible clearance between the meniscus and the solder fillet.
Process Indicator – Class 2 • Coating meniscus is in the plated-through hole but solder
joint meets the requirements of Table 7-4. Defect – Class 3
• Coating meniscus is in the plated-through hole. • Coating meniscus is embedded in the solder connection.
Figure 7-103
1 2
Figure 7-104
1. Class 1 2. Class 2,3
