Defect – Class 1,2,3 • The lead is clinched toward an electrically noncommon con-
ductor and violates minimum electrical clearance C.
C C
1
Figure 7-76
1. Noncommon conductor
Figure 7-77
7.3.4 Supported Holes – WireLead Clinches cont.
7-37 IPC-A-610F
July 2014
Criteria for soldered supported holes are provided in 7.3.5.1 through 7.3.5.12. These criteria are applicable regardless of the sol- dering process, e.g., hand soldering, wave soldering, intrusive soldering, etc.
Target – Class 1,2,3 • No void areas or surface imperfections.
• Lead and land are well wetted. • Lead is discernible.
• 100 solder fillet around lead. • Solder covers lead and feathers out to a thin edge on land
conductor.
Acceptable – Class 1,2,3 • Lead is discernible in the solder.
1
Figure 7-78
1. Land area
Figure 7-79
Figure 7-80
7.3.5 Supported Holes – Solder
7-38 IPC-A-610F
July 2014
Acceptable – Class 1 Process Indicator – Class 2,3
• Fillet convex, and as an exception to Tables 7-3 and 7-4, lead not discernible due to excess solder, providing visual
evidence of the lead in the hole can be determined on the primary side.
Defect – Class 1,2,3 • Lead not discernible due to bent lead.
• Solder not wetted to lead or land. • Solder coverage does not comply with Table 7-4.
Figure 7-81
Figure 7-82
7.3.5 Supported Holes – Solder cont.
7-39 IPC-A-610F
July 2014
Table 7-4 Plated-Through Holes with Component Leads – Minimum Acceptable Solder Conditions
1
Criteria Class 1
Class 2 Class 3
A. Vertical fill of solder for component with less than
14 leads, Notes 2, 3 see 7.3.5.1. Not Specified
75 75
Vertical fill of solder for component with 14 leads or more, Notes 2, 3 see 7.3.5.1
50 or 1.2 mm [0.05 in], whichever is less
B. Circumferential wetting of lead and barrel on solder destination side see 7.3.5.2.
Not Specified 180°
270° C. Percentage of land area covered with wetted solder
on solder destination side see 7.3.5.3. D. Circumferential wetting of lead and barrel on solder
source side see 7.3.5.4. 270°
330° E. Percentage of land area covered with wetted solder
on solder source side see 7.3.5.5. 75
Note 1. Wetted solder refers to solder applied by the solder process. For intrusive soldering there may not be an external fillet between the lead and the land. Note 2. The 25 unfilled height includes both source and destination side depressions.
Note 3. Less than 100 solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying
these situations to the manufacturer.
Defect – Class 1,2,3 • Solder connections are not in compliance with Table 7-4.
7.3.5 Supported Holes – Solder cont.
7-40 IPC-A-610F
July 2014
Target – Class 1,2,3 • There is 100 fill.
Acceptable – Class 2 • Minimum vertical fill of 50 or 1.2 mm [0.05 in] for compo-
nents with 14 or more leads not shown. • Component lead is discernible in the solder source side of
the solder connection. Acceptable – Class 1,2,3
• Minimum 75 fill. A maximum of 25 total depression, including both secondary and primary sides is permitted.
Figure 7-83
1 2
3
Figure 7-85
1. Vertical fill meets requirements of Table 7-4 2. Solder destination side
